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    Electronic technology

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    Semiconductors
SPEL Semiconductor Limited

SPEL Semiconductor Limited

107.35
INR
-5.60
(-4.96%)
-4.26EPS
6.91BMarket Cap
SPEL Semiconductor Limited
BSE:SPELS
(Bombay Stock Exchange)

Recent

price

107.35

P/E

ratio

- -

div

yld

- -

ROIC.AI

2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
2026
TTM
INR
19.83
17.3
17.51
13.75
10.23
5.61
7.7
9.04
5.71
7.98
3.45
2.06
2.42
2.6
1.7
1.36
0.96
Revenue per Share
0.98
0.12
-0.98
0.07
-0.07
-4.29
-6.64
-1.84
-2.33
0.23
-1.87
-2.77
-0.67
-3.64
-4.56
-5.17
-4.26
Basic EPS, GAAP
0.17
-0.02
2.07
0.97
1.23
-1.51
-6.21
-1.39
0.87
-1.47
-0.54
-5.62
-0.81
-1.98
-0.36
2.79
- -
Free Cash Flow per Basic Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Dividend per Share
19.81
19.96
18.92
19
18.86
25.58
20.63
18.87
16.82
17.14
15.62
11.44
10.74
7.17
2.8
0.66
- -
Book Value per Share
19.72
19.88
18.86
18.96
18.85
25.58
20.63
18.87
16.81
17.14
15.62
11.44
10.74
7.17
2.8
0.66
- -
Tangible Book Value per Share
46
46
46
46
46
46
46
46
46
46
46
46
46
46
46
46
46
Basic Weighted Avg Shares
915
798
808
634
472
259
355
416
263
365
159
95
112
120
79
63
44
Sales/Revenue/Turnover
8.77
4.06
-1.33
6.1
4.71
-75.18
-25.46
-21.91
-49.51
2.75
-62.37
-73.22
2.94
-40.35
-86.7
-31.53
-56.38
Operating Margin (%)
88
94
119
110
101
107
69
63
51
50
43
47
39
29
20
11
11
Depreciation Expense
45
5
-45
3
-3
-198
-306
-85
-107
11
-86
-128
-31
-168
-210
-238
-196
Net Income, GAAP
41.53
28.08
- -
- -
- -
- -
- -
- -
- -
21.75
- -
- -
- -
- -
- -
- -
- -
Effective Tax Rate (%)
4.95
0.68
-5.61
0.51
-0.69
-76.58
-86.16
-20.36
-40.8
2.88
-54.24
-134.58
-27.67
-139.85
-267.62
-379.64
-442.7
Profit Margin (%)
-71
-46
-61
23
80
-223
28
19
-42
52
40
164
142
10
-169
-353
- -
Working Capital
144
169
133
159
103
- -
133
132
136
165
192
248
191
196
205
108
- -
LT Debt
914
921
873
876
870
1,180
952
870
776
790
720
527
495
331
129
30
- -
Total Equity
3.74
0.38
- -
- -
- -
- -
- -
- -
- -
0.74
- -
- -
- -
- -
- -
- -
- -
Return on Invested Capital (%)
4.66
1.86
- -
- -
- -
- -
- -
- -
- -
2.1
- -
- -
- -
- -
- -
- -
- -
Return on Capital (%)
5.08
0.59
-5.05
0.37
-0.37
-19.32
-28.72
-9.3
-13.05
1.35
-11.43
-20.46
-6.04
-40.65
-91.55
-298.82
- -
Return on Common Equity (%)

Capital Structure

INR

•

in mil. unless spec.
Dec'26
Mar'26
Jun'27
ST Debt
104
100
- -
LT Borrowings
110
108
- -
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
46
46
46
Market Capitalization
6,309
5,668
6,906

Working Capital

INR

•

in mil. unless spec.
Dec'26
Mar'26
Jun'27
Total Current Assets
398
398
- -
Cash, Cash Equivalents & STI
- -
- -
- -
Accounts Receivable, Net
2
6
- -
Inventories
31
30
- -
Total Current Liabilities
740
752
- -
Payables & Accruals
- -
- -
- -
ST Debt
104
100
- -
Deferred Revenue
- -
- -
- -

Growth Rates

INR

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
-24.92%
-40.7%
-76.42%
Free Cash Flow
-20.54%
10.9%
-868.86%
Net Income, GAAP
-56.62%
90.83%
13.28%
Sales/Revenue/Turnover
-6.96%
-13.97%
-20.15%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

INR

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2025
21
14
19
25
79
2026
19
15
6
22
63
2027
1
- -
- -
- -
- -

Quarterly Earnings Per Share

INR

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2025
-0.78
-1.01
-1.05
-1.73
-4.56
2026
-1.21
-2.7
-1.42
0.17
-5.17
2027
-0.29
- -
- -
- -
- -

Quarterly Dividends Per Share

INR

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -
2027
- -
- -
- -
- -
- -
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Business
SPEL Semiconductor Limited, India's first semiconductor assembly and test services (SATS) provider, offers contract manufacturing for integrated circuits, including turnkey solutions such as wafer sort, assembly, final electrical testing, tube/tape & reel/tray packing, custom labeling, finished goods storage, and drop-shipment to end-customers; value-added services encompassing package design, leadframe development, failure analysis, full reliability testing (high temperature operating life, HAST, temperature cycling, MSL evaluation), test program development, and product characterization; and packaging solutions for leaded packages (SOIC, QSOP, TSSOP, SSOP) and non-leaded packages (QFN, TDFN, TQFN) with capabilities in gold/copper wire bonding, saw singulation, laser top marking, and matte tin lead finish, serving applications in communications, consumer electronics, computing, industrials, automotive, and emerging areas like BGA, WLCSP, flip chip, system-in-package, and MEMS. The company operates from its headquarters and manufacturing facility at 5, CMDA Industrial Estate, Maraimalai Nagar, Chennai, Tamil Nadu, India, where it was incorporated in 1984, and caters to integrated device manufacturers and fabless companies primarily in the United States, Asia, and Europe as a subsidiary of Natronix Semiconductor Technology Private Limited. In February 2024, SPEL's board approved a phased INR 1,100 million investment (INR 550 million per phase, including INR 35 crores debt funding) to expand IC assembly, packaging, and test capacity for advanced QFN (high density, flipchip, stacked, double row), power packages (Cu clip attach, exposed pad, multichip), laminate packages, and wafer-level packaging, targeting phased sales growth to INR 1,500 million; the company outlined longer-term plans for INR 6,000 million investment over five years to exceed INR 10,000 million annual sales via capacity upgrades at its existing site and a greenfield second facility focused on BGA packages; recent financial restructuring in FY 2024-25 included converting INR 69.5 million unsecured promoter loans to non-convertible redeemable preference shares, proposals to sell/lease non-core assets, cost controls amid net losses, director appointments (e.g., Dr. Nagarajan Govindan as independent director), and strategic emphasis on new customers from Europe and the US alongside technology upgrades.