- Business
- C.Uyemura & Co., Ltd. manufactures and sells plating chemicals, surface finishing materials, plating equipment, control systems, industrial chemicals, and non-ferrous metals for surface treatment applications in electronics, automotive, and other industries; it operates plating processing services for printed wiring boards, plastics, and circuit boards; and engages in real estate leasing of office buildings, condominiums, and factory sites. The company provides specialized products including copper plating, final finish plating, electroless plating, hard disk media Ni-P plating, functional plating chemicals, and decorative plating chemicals, supporting applications in printed wiring boards, aluminum magnetic disks, semiconductors, wafers, packages, and automobile parts. Founded in 1848 and headquartered in Osaka, Japan, C.Uyemura conducts global operations across Japan, the United States, Taiwan, China, the Pacific Rim, and other regions through sales offices, manufacturing plants like the Hirakata Plant, and research facilities such as the Central Research Laboratory. In 2024, the company establishes a Shanghai Technical Center equipped with clean rooms and analytical equipment to enhance development in China; it advances investments totaling 4 billion yen over fiscal years 2025-2027 in semiconductor wafer processing, electroless nickel plating, environmentally friendly products like formalin-free electroless copper baths and PFOS/PFOA-free baths, wastewater treatment, plating solution recycling, and CO2 reduction technologies; and continues expansion in high-growth areas including new materials surface treatment and clean room chemical supply systems.