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    Semiconductors
Nexchip Semiconductor Corp. Class A

Nexchip Semiconductor Corp. Class A

18.26
HKD
+0.78
(+4.46%)
Oct 26Next Earn
Nexchip Semiconductor Corp. Class A
HKEX:2249
(Hong Kong Exchange)

Recent

price

18.26

P/E

ratio

- -

div

yld

1.20%

ROIC.AI

2018
2019
2020
2021
2022
2023
2024
2025
TTM
CNY
0.08
0.21
0.19
2.11
3.9
2.4
2.74
3.25
- -
Revenue per Share
-0.46
-0.48
-0.16
0.67
1.18
0.07
0.16
0.21
- -
Basic EPS, GAAP
-0.75
-1.11
-0.56
-0.16
-0.24
-2.51
-3.1
-1.75
- -
Free Cash Flow per Basic Share
0.03
0.1
0.04
0.11
0.12
0.14
0.19
0.23
0.19
Dividend per Share
1.97
1.49
2.78
3.58
5.1
6.24
6.08
6.34
6.78
Book Value per Share
1.23
0.8
2.28
3.1
4.54
5.85
5.7
5.96
6.37
Tangible Book Value per Share
2,573
2,573
7,964
2,571
2,578
3,016
3,374
3,345
2,552
Basic Weighted Avg Shares
218
534
1,512
5,429
10,051
7,244
9,249
10,885
- -
Sales/Revenue/Turnover
-386.85
-150.61
-8.57
33.9
34.95
3.67
8.14
8.51
- -
Operating Margin (%)
594
779
26
1,458
2,780
3,244
3,417
4,134
- -
Depreciation Expense
-1,191
-1,243
-1,258
1,729
3,045
212
533
704
- -
Net Income, GAAP
- -
- -
- -
0.02
0.01
0.15
0.05
0.04
- -
Effective Tax Rate (%)
-547.16
-232.81
-83.15
31.84
30.3
2.92
5.76
6.47
- -
Profit Margin (%)
2,390
1,411
3,615
-5,641
1,627
-2,071
2,318
2,283
5,034
Working Capital
3,206
4,971
5,821
7,266
10,192
11,510
16,389
19,520
21,776
LT Debt
5,072
3,830
7,158
9,889
18,050
22,138
26,089
28,088
31,126
Total Equity
- -
- -
- -
10.3
12.65
0.35
1.19
0.97
- -
Return on Invested Capital (%)
- -
- -
- -
11.56
13.51
2.33
2.67
2.78
- -
Return on Capital (%)
- -
-27.93
-22.89
21.11
27.26
1.23
2.52
3.3
- -
Return on Common Equity (%)

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
2,026
2,114
2,138
LT Borrowings
19,520
19,241
21,776
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
3,433
3,433
3,433
Market Capitalization
- -
- -
- -

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
7,545
8,420
10,151
Cash, Cash Equivalents & STI
3,217
4,272
6,137
Accounts Receivable, Net
1,187
1,279
1,240
Inventories
1,715
1,598
1,590
Total Current Liabilities
5,261
5,231
5,116
Payables & Accruals
- -
- -
- -
ST Debt
2,026
2,114
2,138
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
33.77%
7.66%
Free Cash Flow
- -
219.03%
-43.94%
Net Income, GAAP
- -
-14.08%
32.16%
Sales/Revenue/Turnover
- -
72.31%
17.69%
Total Cash Common Dividend
- -
23.39%
22.38%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
2,228
2,170
2,377
2,474
9,249
2025
2,568
2,631
- -
2,756
10,885
2026
2,912
3,045
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.02
0.05
0.05
0.07
0.16
2025
0.04
0.1
- -
0.08
0.21
2026
0.02
0.06
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.03
0.11
0.07
0.06
0.19
2025
0.03
0.2
- -
0.1
0.23
2026
0.03
0.06
- -
- -
- -
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Business
Nexchip Semiconductor Corporation engages in wafer foundry services and related IC product manufacturing, focusing on 12-inch wafer fabrication across multiple process nodes and supplying a broad range of front-end and back-end services. The company develops, manufactures, and sells display driver chips (DDICs), CMOS image sensor chips (CIS), power management integrated circuits (PMICs), microcontroller units (MCUs), and logic devices, supporting customers in consumer electronics, mobile, automotive, industrial, and smart device segments. Headquartered in Hefei, Anhui Province, China, Nexchip operates primarily in China with international customer engagement and service capabilities, leveraging multiple process platforms and node offerings to meet varied application requirements. The company maintains a platform-driven approach, providing wafer foundry services from advanced nodes to mature processes, along with lithography mask-related and ancillary manufacturing support services. Founded in the early 2020s and listed on the Shanghai Stock Exchange, Nexchip emphasizes ongoing technology development, capacity expansion, and collaboration with ecosystem partners to broaden its product portfolio and global reach. Recent activity includes strategic partnerships and capacity enhancements to scale CIS and DDIC production, advancement of 28nm logic platforms for TCON/ISP/SoC/WIFI/Codec applications, and continued investments to bolster 12-inch wafer throughput and customer-specific design services. Overall, Nexchip positions itself as a semiconductor foundry and IC product company offering a diversified set of detection, processing, and control semiconductors across targeted end markets with an emphasis on domestic China manufacturing capability and international demand for display, imaging, and power management solutions.