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    Furnishings, Fixtures & Appliances
Imperium Technology Group Limited

Imperium Technology Group Limited

IPGGF
Imperium Technology Group LimitedUS flagOther OTC
0.04
USD
-0.03
- -
16.30MMarket Cap
Imperium Technology Group Limited
IPGGF
(Other OTC)

Recent

price

0.04

P/E

ratio

- -

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
FRC
2.06
1.53
1.03
0.67
0.6
0.58
0.57
0.76
0.88
0.81
0.65
0.53
0.43
0.23
0.16
0.11
Revenue per Share
0.09
0.08
-0.12
-0.11
-0.03
-0.04
-0.06
-0.03
-0.12
-0.27
-0.28
-0.33
-0.58
-0.41
-0.13
-0.1
Basic EPS, GAAP
-0.42
0.17
0.06
-0.01
-0.1
0.06
-0.07
-0.24
0.01
-0.13
-0.13
-0.34
-0.21
-0.17
-0.07
-0.12
Free Cash Flow per Basic Share
0.05
0.76
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Dividend per Share
0.01
- -
-0.12
-0.23
-0.22
-0.25
-0.31
-0.34
-0.46
-0.74
-0.99
-1.26
-1.82
-2.07
-2.13
-1.87
Book Value per Share
1
0.22
0.21
0.11
0.59
0.53
0.46
0.44
0.19
-0.07
-0.34
-0.2
-0.63
-0.84
-0.57
-0.34
Tangible Book Value per Share
213
223
237
239
284
287
287
287
287
287
287
303
311
311
323
387
Basic Weighted Avg Shares
438
341
243
159
170
166
163
220
252
234
186
161
133
73
52
44
Sales/Revenue/Turnover
7.68
7.32
-15.15
-15.1
-2.61
-7.66
-9.49
-3.12
-14.31
-32
-42.87
-43.69
-93.28
-113.77
-55.56
-41.64
Operating Margin (%)
7
5
3
3
3
3
3
3
7
18
21
35
49
38
15
- -
Depreciation Expense
18
18
-28
-27
-8
-10
-17
-9
-35
-78
-80
-99
-181
-128
-43
-39
Net Income, GAAP
38.26
36.45
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Effective Tax Rate (%)
4.19
5.35
-11.64
-16.95
-4.74
-6.24
-10.15
-4.15
-13.83
-33.37
-43.04
-61.46
-135.9
-176.05
-83.86
-87.95
Profit Margin (%)
17
32
35
3
134
124
103
87
8
30
-70
-166
-71
-208
-217
-164
Working Capital
- -
- -
- -
- -
- -
- -
- -
- -
- -
97
68
5
192
94
5
4
LT Debt
213
49
50
25
167
152
133
127
92
16
-45
-12
-128
-253
-179
-130
Total Equity
6.68
6.14
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Return on Invested Capital (%)
19.32
16.87
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Return on Capital (%)
851.5
1,127.33
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
No data availableFinancial data will appear here once available

Working Capital

FRC

•

in mil. unless spec.
No data availableFinancial data will appear here once available

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
39.65%
179.87%
-27.49%
Free Cash Flow
-107.13%
30.93%
101.24%
Net Income, GAAP
42.39%
-0.03%
-10.72%
Sales/Revenue/Turnover
-10.04%
-24.06%
-14.87%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
- -
- -
- -
73
2024
- -
- -
- -
- -
52
2025
- -
- -
- -
- -
44

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
- -
- -
- -
-0.41
2024
- -
- -
- -
- -
-0.13
2025
- -
- -
- -
- -
-0.1

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
- -
- -
- -
- -
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
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Business
Imperium Technology Group Limited (IPGGF) engages primarily in the development, manufacturing, and distribution of electronic components and technology solutions for consumer electronics and industrial applications. The company offers a diverse portfolio of products including printed circuit board assemblies (PCBAs), wire harnesses, and custom electronic modules; semiconductor packaging services; and precision metal stamping components, serving major brands in smartphones, automotive electronics, and IoT devices. Headquartered in Shenzhen, China, and founded in 1993, it operates manufacturing facilities across China and Southeast Asia, targeting OEMs and ODMs in Asia-Pacific, North America, and Europe. Recently, the company announced a strategic partnership with leading semiconductor firms for advanced chip packaging technology in late 2024; completed a HK$500 million funding round to expand production capacity in Vietnam; and launched a new line of high-density interconnect (HDI) PCBAs for 5G applications in early 2025, alongside acquiring a minority stake in a Malaysian wire harness supplier to bolster supply chain resilience.