1. Hong Kong Stocks

  2. •

    Consumer Cyclical

  3. •

    Furnishings, Fixtures & Appliances
Imperium Technology Group Limited

Imperium Technology Group Limited

IPGGF
Imperium Technology Group LimitedUS flagOther OTC
0.04
USD
-0.03
- -
16.30MMarket Cap
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
Revenue per Share
0.67
0.6
0.58
0.57
0.76
0.88
0.81
0.65
0.53
0.43
0.23
0.16
0.11
Basic EPS, GAAP
-0.11
-0.03
-0.04
-0.06
-0.03
-0.12
-0.27
-0.28
-0.33
-0.58
-0.41
-0.13
-0.1
Free Cash Flow per Basic Share
-0.01
-0.1
0.06
-0.07
-0.24
0.01
-0.13
-0.13
-0.34
-0.21
-0.17
-0.07
-0.12
Dividend per Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Book Value per Share
-0.23
-0.22
-0.25
-0.31
-0.34
-0.46
-0.74
-0.99
-1.26
-1.82
-2.07
-2.13
-1.87
Tangible Book Value per Share
0.11
0.59
0.53
0.46
0.44
0.19
-0.07
-0.34
-0.2
-0.63
-0.84
-0.57
-0.34
Basic Weighted Avg Shares
239
284
287
287
287
287
287
287
303
311
311
323
387
Sales/Revenue/Turnover
159
170
166
163
220
252
234
186
161
133
73
52
44
Operating Margin (%)
-15.1
-2.61
-7.66
-9.49
-3.12
-14.31
-32
-42.87
-43.69
-93.28
-113.77
-55.56
-41.64
Depreciation Expense
3
3
3
3
3
7
18
21
35
49
38
15
- -
Net Income, GAAP
-27
-8
-10
-17
-9
-35
-78
-80
-99
-181
-128
-43
-39
Effective Tax Rate (%)
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Profit Margin (%)
-16.95
-4.74
-6.24
-10.15
-4.15
-13.83
-33.37
-43.04
-61.46
-135.9
-176.05
-83.86
-87.95
Working Capital
3
134
124
103
87
8
30
-70
-166
-71
-208
-217
-164
LT Debt
- -
- -
- -
- -
- -
- -
97
68
5
192
94
5
4
Total Equity
25
167
152
133
127
92
16
-45
-12
-128
-253
-179
-130
Return on Invested Capital (%)
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Return on Capital (%)
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Return on Common Equity (%)
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -

Capital Structure

FRC

•

in mil. unless spec.
No data availableFinancial data will appear here once available

Working Capital

FRC

•

in mil. unless spec.
No data availableFinancial data will appear here once available

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
39.65%
179.87%
-27.49%
Free Cash Flow
-107.13%
30.93%
101.24%
Net Income, GAAP
42.39%
-0.03%
-10.72%
Sales/Revenue/Turnover
-10.04%
-24.06%
-14.87%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
- -
- -
- -
73
2024
- -
- -
- -
- -
52
2025
- -
- -
- -
- -
44

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
- -
- -
- -
-0.41
2024
- -
- -
- -
- -
-0.13
2025
- -
- -
- -
- -
-0.1

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
- -
- -
- -
- -
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -

Company Description

APIChatGPT
CEO
Tingting Li
Full Time Employees
108
Sector
Consumer Cyclical
Industry
Furnishings, Fixtures & Appliances
Address
One Harbour Square Kwun Tong Hong Kong
IPO Date
Apr 30, 2021
Website
776.hk
Similar Companies
U10 Corp (ALU10.PA)
Inscape Corporation (ICPBF)
Fancy Wood Industries Public Company Limited (FANCY.BK)
Ariston Holding N.V. (ARIS.MI)
Suncha Technology Co., Ltd. (001211.SZ)
Asahi India Glass Limited (ASAHIINDIA.NS)
Business
Imperium Technology Group Limited (IPGGF) engages primarily in the development, manufacturing, and distribution of electronic components and technology solutions for consumer electronics and industrial applications. The company offers a diverse portfolio of products including printed circuit board assemblies (PCBAs), wire harnesses, and custom electronic modules; semiconductor packaging services; and precision metal stamping components, serving major brands in smartphones, automotive electronics, and IoT devices. Headquartered in Shenzhen, China, and founded in 1993, it operates manufacturing facilities across China and Southeast Asia, targeting OEMs and ODMs in Asia-Pacific, North America, and Europe. Recently, the company announced a strategic partnership with leading semiconductor firms for advanced chip packaging technology in late 2024; completed a HK$500 million funding round to expand production capacity in Vietnam; and launched a new line of high-density interconnect (HDI) PCBAs for 5G applications in early 2025, alongside acquiring a minority stake in a Malaysian wire harness supplier to bolster supply chain resilience.