1. South Korea Stocks

  2. •

    Producer manufacturing

  3. •

    Industrial machinery
Hanmi Semiconductor Co., Ltd

Hanmi Semiconductor Co., Ltd

KKRX:042700
191,000.00
KRW
-200.00
(-0.10%)
2,329.99EPS
109.58P/E
24.33TMarket Cap
Nov 06Next Earn
Hanmi Semiconductor Co., Ltd
KRX:042700
(Korea Stock Exchange)

Recent

price

191,000.00

P/E

ratio

109.58

div

yld

0.42%

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
KRW
1,795.17
1,390
1,445.89
1,626.95
1,659.49
1,005.06
614.41
1,921.03
2,128.28
1,196.74
2,577.38
1,888.39
3,334.18
1,638.49
5,819.36
6,079.23
5,812.08
Revenue per Share
280.8
133.63
207.2
94.79
258.2
186
116.2
92.5
483
191.5
502
528.5
939
2,753
1,589
2,256
2,340.75
Basic EPS, GAAP
43.23
-128.59
226.18
-61.17
213.23
271.5
104.95
230.8
206.53
78.73
297.68
128.73
1,019.91
179.04
911.84
1,421.99
1,086.13
Free Cash Flow per Basic Share
19.02
100.54
20.77
100
101.6
102.06
40.51
105.2
123.92
124.97
50.31
99.55
302.04
200.6
421.9
719.94
799.97
Dividend per Share
1,298.89
1,346.82
1,540.78
1,538.38
1,713.49
1,769.16
1,937.5
1,957.06
2,143.46
2,186.53
2,613.84
3,505.99
4,007.6
5,875.31
5,698.17
7,277.87
7,874.17
Book Value per Share
1,293.17
1,317.56
1,515.41
1,512.18
1,687.2
1,742.31
1,910.45
1,914.35
2,109.09
2,152.66
2,578.79
3,459.85
3,963.63
5,829.5
5,649.42
7,031.94
7,626.71
Tangible Book Value per Share
124
126
120
118
116
117
271
103
102
101
100
198
98
97
96
95
95
Basic Weighted Avg Shares
221,945
175,816
173,394
191,550
192,310
117,791
166,268
197,300
217,115
120,378
257,386
373,169
327,592
159,009
558,917
576,685
551,311
Sales/Revenue/Turnover
12.23
9.8
12.21
7.03
25.52
19.31
23.19
26.18
26.16
11.4
25.89
32.81
34.15
21.74
45.69
43.59
42.49
Operating Margin (%)
4,173
4,407
4,784
5,085
5,473
4,567
4,706
4,951
5,033
6,444
6,133
6,473
8,753
8,649
9,772
11,554
11,594
Depreciation Expense
34,717
16,903
24,848
11,161
29,921
21,799
31,445
9,500
49,273
19,263
50,131
104,438
92,259
267,168
152,614
214,008
222,034
Net Income, GAAP
23.27
19.04
22.56
18.54
22.74
22.3
23.42
34.37
20.54
21.62
23.63
23.35
27.83
22.62
23.07
23.12
24.22
Effective Tax Rate (%)
15.64
9.61
14.33
5.83
15.56
18.51
18.91
4.82
22.69
16
19.48
27.99
28.16
168.02
27.31
37.11
40.27
Profit Margin (%)
76,448
74,041
87,310
93,395
99,257
87,179
131,527
103,287
84,128
97,734
141,364
169,092
206,520
214,382
247,751
373,154
363,821
Working Capital
900
- -
56
15,311
- -
- -
28,137
14,772
- -
103
191
342
789
467
1,463
1,214
779
LT Debt
167,611
169,790
183,035
182,717
204,953
193,961
209,345
206,173
215,557
219,705
257,091
346,812
390,097
571,899
540,888
690,328
746,889
Total Equity
12.5
8.02
8.92
5.52
18.16
8.56
13.31
14.28
20.14
4.85
20.47
29.16
20.51
5.28
32.39
28.36
24.39
Return on Invested Capital (%)
22
10.18
14.08
6
15.1
10.95
14.75
4.59
22.67
8.89
21.03
34.54
24.97
55.37
27.35
34.66
32.53
Return on Capital (%)
23.94
10.15
14.23
6.16
15.5
10.93
15.59
4.57
23.37
8.85
21.03
34.59
25.04
55.54
27.43
34.76
33.24
Return on Common Equity (%)

Capital Structure

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
1,340
1,196
1,502
LT Borrowings
- -
- -
- -
LT Finance Leases
1,214
1,056
779
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
95
95
95
Market Capitalization
12,084,272
23,808,104
24,329,795

Working Capital

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
493,275
430,430
495,962
Cash, Cash Equivalents & STI
277,218
175,669
89,580
Accounts Receivable, Net
62,375
75,424
258,347
Inventories
150,384
173,046
143,898
Total Current Liabilities
120,120
104,048
132,141
Payables & Accruals
- -
- -
- -
ST Debt
1,340
1,196
1,502
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
14.61%
23.24%
27.63%
Free Cash Flow
82.95%
130.98%
54.03%
Net Income, GAAP
77.61%
56.72%
40.23%
Sales/Revenue/Turnover
37.51%
47.2%
3.18%
Total Cash Common Dividend
43.13%
96.94%
68.54%

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
77,318
123,478
208,525
149,596
558,917
2025
147,392
180,047
166,231
83,014
576,685
2026
50,902
251,163
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
721
-123
400
590.21
1,589
2025
577
682
692.79
304.24
2,256
2026
200.64
1,143
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
419.76
- -
- -
- -
421.9
2025
719.75
- -
- -
- -
719.94
2026
800
- -
- -
- -
- -
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Business
HANMI Semiconductor Co., Ltd. manufactures and sells semiconductor back-end process equipment worldwide. The company offers an extensive range of products including dual TC bonders, HBM 6-side inspection systems, micro SAW equipment, vision placement equipment, meta grinders, EMI shield vision attach and detach equipment, EMI shield vision placement equipment, EMI shield tape mounter, EMI shield tape laser cutting equipment, EMI shield tape demounter, vision inspection equipment, converlay attach equipment, laser marking equipment, laser ablation equipment, laser cutting equipment, pick and place systems, strip mounters, singulation systems, flip chip binders, molding systems, trim and form systems, and PCB equipment; it also provides solutions for photovoltaic and LED applications such as PV brick IR inspection and PV wafer inspection equipment. Founded in 1980 and headquartered in Incheon, South Korea, HANMI Semiconductor operates primarily in the semiconductor equipment industry, serving major chip producers globally with a focus on advanced packaging and assembly technologies. In recent developments, the company signed an approximately 8 billion won equipment supply contract with ASE Technology Holding in May 2025 for flip-chip bonders and secured ongoing partnerships in HBM production equipment. HANMI Semiconductor showcased new HBM4-compatible equipment including TC Bonder 4, 2.5D Big Die TC Bonder, and Big Die FC Bonder at SEDEX 2025 in October, amid reports of thawing relations with Samsung Electronics for potential HBM4 collaboration, and announced plans to build a new TC Bonder plant in Incheon. These initiatives reflect strategic expansions in high-bandwidth memory manufacturing and global supply chain strengthening.