1. South Korea Stocks

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    Electronic technology

  3. •

    Semiconductors
HPSP Co., Ltd.

HPSP Co., Ltd.

KKRX:403870
47,700.00
KRW
-700.00
(-1.45%)
1,054.24EPS
51.02P/E
4.39TMarket Cap
Nov 18Next Earn
HPSP Co., Ltd.
KRX:403870
(Korea Stock Exchange)

Recent

price

47,700.00

P/E

ratio

51.02

div

yld

- -

ROIC.AI

2020
2021
2022
2023
2024
2025
TTM
KRW
1,018.51
1,382.38
545.56
2,204.28
2,220.21
2,144.73
2,009.84
Revenue per Share
294
532.5
226
990
1,056
901
1,058.43
Basic EPS, GAAP
530.16
565.39
248.77
494.74
492.7
1,212.41
1,138.85
Free Cash Flow per Basic Share
126.34
301.43
- -
22.32
91.64
597.91
- -
Dividend per Share
435.33
667.72
2,407.27
3,349.85
3,458.09
3,792.8
3,857.2
Book Value per Share
431
664.3
2,404.04
3,329.22
3,431.52
3,781.53
3,849.86
Tangible Book Value per Share
60
66
292
81
82
81
81
Basic Weighted Avg Shares
61,174
91,752
159,336
179,087
181,402
172,965
162,785
Sales/Revenue/Turnover
40.53
49.28
53.46
53.16
51.79
51.98
53.45
Operating Margin (%)
738
929
1,100
1,330
3,601
4,346
4,564
Depreciation Expense
17,658
35,344
66,006
80,432
86,280
72,662
85,727
Net Income, GAAP
24.74
24.29
24.05
22.83
24.2
22.99
12
Effective Tax Rate (%)
28.87
38.52
41.43
44.91
47.56
42.01
52.66
Profit Margin (%)
31,814
50,569
181,623
234,281
196,752
228,295
220,297
Working Capital
811
1,780
2,082
1,257
659
177
1,420
LT Debt
34,391
52,749
195,372
277,080
277,911
308,231
313,462
Total Equity
- -
65.64
46.7
29.12
24.31
22.65
25.23
Return on Invested Capital (%)
- -
78.09
52.16
33.73
30.91
24.71
29.3
Return on Capital (%)
- -
81.12
53.2
34.05
31.09
24.79
29.44
Return on Common Equity (%)

Capital Structure

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
645
767
610
LT Borrowings
- -
- -
- -
LT Finance Leases
177
1,388
1,420
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
81
81
81
Market Capitalization
2,722,454
3,323,805
4,388,397

Working Capital

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
289,038
296,864
311,686
Cash, Cash Equivalents & STI
238,941
239,007
212,833
Accounts Receivable, Net
23,153
14,413
18,766
Inventories
15,957
23,521
41,909
Total Current Liabilities
60,743
97,835
91,389
Payables & Accruals
- -
- -
- -
ST Debt
645
767
610
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
75.36%
10.91%
Free Cash Flow
- -
41.96%
142.89%
Net Income, GAAP
- -
40.05%
-15.78%
Sales/Revenue/Turnover
- -
26.54%
-4.65%
Total Cash Common Dividend
- -
- -
544.03%

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
37,753
27,309
49,721
66,618
181,402
2025
36,895
51,347
32,047
52,676
172,965
2026
31,940
46,123
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
258
174
210
416.56
1,056
2025
189
257
167.21
288.12
901
2026
306
296.5
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
90.53
- -
- -
- -
91.64
2025
- -
- -
- -
- -
597.91
2026
- -
- -
- -
- -
- -
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Business
HPSP Co., Ltd. manufactures and markets high-pressure annealing semiconductor equipment for front-end processes in South Korea and internationally. The company offers GENI-SYS, a high-pressure thermal processing advance system; GENI, a high-pressure thermal processing system; and GENI-SE, a high-pressure oxidation system; along with parts, parts repair and exchanges, installation support, and technical support services. Founded in 2005 and headquartered in Suwon, South Korea, HPSP serves leading global semiconductor manufacturers including Samsung Electronics, TSMC, and Intel, focusing on atomic-scale precision for advanced nodes in devices such as FinFET, GAA, DRAM, and 3D NAND. In January 2024, HPSP signed a new Joint Development Project with imec to expand research on high-pressure annealing and oxidation processes for next-generation applications like CFET and 3D memory devices, while strengthening its R&D with a new center in Korea. Crescendo Equity Partners, holding a 40.9% controlling stake, initiated a sale process in late 2024 through UBS, attracting preliminary bids from private equity firms including Carlyle Group, Blackstone, MBK Partners, KKR, and Bain Capital, with main bidding targeted for mid-2025 amid valuations exceeding 2 trillion won; in May 2025, Crescendo launched a recapitalization worth 100-200 billion won via Hana Bank and shifted its largest shareholder to Hit 2025 Holdings Ltd. while retaining management control.