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Lam Research Corporation

Lam Research Corporation

LRCX.TO
Lam Research CorporationCA flagToronto Stock Exchange
26.16
CAD
+0.01
- -
32.73BMarket Cap
Lam Research Corporation
LRCX.TO
(Toronto Stock Exchange)

Recent

price

26.16

P/E

ratio

- -

div

yld

- -

ROIC.AI

2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
2026
TTM
FRC
2.62
2.15
2.13
2.8
3.29
3.7
4.94
6.85
6.33
6.94
10.18
12.31
12.87
11.34
14.33
18.51
18.51
Revenue per Share
0.59
0.14
0.07
0.38
0.41
0.58
1.05
1.47
1.44
1.55
2.72
3.29
3.33
2.91
4.17
5.79
5.79
Basic EPS, GAAP
0.61
0.4
0.43
0.44
0.49
0.85
1.25
1.64
2.08
1.47
2.5
2.22
3.82
3.54
4.8
4.67
4.67
Free Cash Flow per Basic Share
- -
- -
- -
- -
0.07
0.12
0.15
0.19
0.44
0.45
0.51
0.58
0.67
0.78
0.89
1.01
1.01
Dividend per Share
2
2.85
2.87
3.21
3.37
3.81
4.32
4.19
3.27
3.57
4.23
4.58
6.16
6.55
7.77
9.97
9.97
Book Value per Share
1.82
1.41
1.32
1.76
2.04
2.59
3.21
3.04
2.09
2.43
3.09
3.4
4.82
5.2
6.35
8.45
8.45
Tangible Book Value per Share
1,235
1,242
1,689
1,647
1,596
1,589
1,622
1,616
1,525
1,448
1,436
1,399
1,355
1,314
1,286
1,255
1,255
Basic Weighted Avg Shares
3,238
2,665
3,599
4,607
5,259
5,886
8,014
11,077
9,654
10,045
14,626
17,227
17,429
14,905
18,436
23,233
23,233
Sales/Revenue/Turnover
25.2
8.92
3.28
14.71
16.49
18.25
23.74
29.01
25.53
26.62
30.64
31.24
29.93
28.73
32.01
35.29
35.29
Operating Margin (%)
75
101
304
292
278
291
307
326
309
269
307
334
342
360
386
442
442
Depreciation Expense
724
169
114
632
656
914
1,698
2,381
2,191
2,252
3,908
4,605
4,511
3,828
5,358
7,265
7,265
Net Income, GAAP
9.63
17.46
- -
12.59
11.51
4.8
6.29
24.47
10.43
12.55
10.58
11.32
11.71
12.21
10.07
12.07
12.07
Effective Tax Rate (%)
22.35
6.33
3.16
13.72
12.47
15.53
21.19
21.49
22.7
22.42
26.72
26.73
25.88
25.68
29.06
31.27
31.27
Profit Margin (%)
2,593
2,988
2,389
3,202
3,639
6,795
6,192
6,000
6,189
7,691
8,125
7,720
9,043
8,545
7,949
9,673
9,673
Working Capital
738
762
789
817
1,001
3,378
1,785
1,807
3,823
4,971
4,984
4,998
5,003
4,479
3,730
3,730
3,730
LT Debt
2,470
5,322
4,676
5,213
5,345
6,102
6,987
6,580
4,723
5,183
6,027
6,278
8,210
8,539
9,862
12,471
12,471
Total Equity
28.94
3.97
- -
9.36
10.67
11.2
17.57
25.62
23.95
22.85
35.52
41.3
36.24
27.46
37.13
46.01
46.01
Return on Invested Capital (%)
29.12
4.1
- -
10.95
10.11
11.5
17.98
26.28
25.22
23.82
37.2
42.76
38.16
29.84
39.6
48.46
48.46
Return on Capital (%)
34.16
4.33
2.28
12.79
12.42
15.97
25.94
35.09
38.77
45.46
69.73
74.85
62.27
45.71
58.24
65.07
65.07
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Dec'26
Mar'26
Jun'26
ST Debt
754
4
4
LT Borrowings
3,730
3,730
3,722
LT Finance Leases
- -
- -
9
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
1,251
1,251
1,251
Market Capitalization
- -
- -
33,692

Working Capital

FRC

•

in mil. unless spec.
Dec'26
Mar'26
Jun'26
Total Current Assets
14,018
13,297
15,611
Cash, Cash Equivalents & STI
6,180
4,751
5,579
Accounts Receivable, Net
3,492
4,133
5,340
Inventories
4,038
4,000
4,276
Total Current Liabilities
6,213
5,242
5,937
Payables & Accruals
1,571
1,586
1,891
ST Debt
754
4
4
Deferred Revenue
2,165
2,091
2,279

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
8.74%
16.18%
26.46%
Free Cash Flow
20.73%
14.18%
-5.11%
Net Income, GAAP
27.05%
15.24%
35.59%
Sales/Revenue/Turnover
16.54%
10.83%
26.02%
Total Cash Common Dividend
24.13%
11.82%
10.53%

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
3,482
3,758
3,794
3,872
14,905
2025
4,168
4,376
4,720
5,171
18,436
2026
5,324
5,345
5,841
6,722
23,233

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.67
0.72
0.74
0.78
2.91
2025
0.86
0.93
1.04
1.35
4.17
2026
1.24
1.27
1.46
1.82
5.79

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.17
0.2
0.2
0.2
0.78
2025
0.2
0.23
0.23
0.23
0.89
2026
0.23
0.26
0.26
0.26
1.01
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Business
Lam Research Corporation designs, manufactures, markets, refurbishes and services wafer fabrication equipment and related solutions for the global semiconductor industry. The company provides deposition, etch, wafer-cleaning, dry-resist and advanced-packaging technologies used by semiconductor memory manufacturers, foundries and integrated device manufacturers to produce logic, DRAM, NAND and other non-volatile memory devices, as well as complementary metal-oxide-semiconductor image sensors, micro-electromechanical systems and related specialty semiconductor products. Its deposition portfolio includes SABRE electrochemical deposition systems for copper and other metal interconnects and advanced packaging; ALTUS chemical vapor deposition and atomic layer deposition systems for tungsten and molybdenum metallization; VECTOR plasma-enhanced chemical vapor deposition systems and Striker atomic layer deposition systems for dielectric films. Its etch portfolio includes Kiyo, Versys Metal and Akara conductor-etch systems; Flex and Vantex dielectric-etch systems; Syndion deep silicon-etch systems; and Argos, Prevos and Selis selective-etch platforms. Its cleaning portfolio includes EOS, DV-Prime, Da Vinci and SP Series wet-clean systems, as well as Coronus dry-plasma bevel-cleaning systems. The company also offers the Aether dry-resist platform for extreme-ultraviolet and high-numerical-aperture EUV lithography pattern transfer; fan-out panel-level packaging and high-bandwidth-memory 3D-stacking solutions; and customer-support offerings comprising equipment service, spare parts, process and performance upgrades, equipment-intelligence software and analytics, and Reliant new and refurbished non-leading-edge deposition, etch and clean equipment. Lam Research operates facilities across Asia, Europe and the United States and serves customers globally, with principal operating and research-and-development locations in Fremont and Livermore, California; Tualatin, Oregon; Yongin, South Korea; Bengaluru, India; Salzburg and Villach, Austria. Incorporated in 1980, the Delaware corporation is headquartered in Fremont, California. Recent strategic developments include a five-year collaboration with International Business Machines Corp. announced in March 2026 to develop novel materials, advanced etch and deposition processes, and High-NA EUV lithography capabilities for sub-1-nanometer logic scaling, utilizing Lam’s Aether, Kiyo, Akara, Striker and ALTUS Halo platforms and advanced-packaging technologies; and the September 2025 launch of the VECTOR TEOS 3D dielectric-deposition tool, which expands the company’s advanced-packaging portfolio for 3D integration and chiplet applications.