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    Semiconductors
VIA Technologies, Inc.

VIA Technologies, Inc.

10.10
USD
-0.30
(-2.88%)
0.24EPS
45.24P/E
1.27BMarket Cap
Nov 03Next Earn
VIA Technologies, Inc.
LUXSE:VIATC
(Luxembourg Stock Exchange)

Recent

price

10.10

P/E

ratio

45.24

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
TWD
65.79
54.42
45.38
61.88
66.21
48.07
50.09
45.88
48.78
56.21
66.12
71.03
93.96
127.2
155.17
86.19
100.13
Revenue per Share
-9.46
-34.88
-41.39
-12.9
-15.95
9.11
2.04
0.51
0.7
0.43
48.02
40.19
-0.85
4.13
10.41
0.62
8.09
Basic EPS, GAAP
-32.08
-25.87
-28.66
-26.12
4.18
-11.55
-10.63
-8.79
-11.96
-6.02
-2.5
13.45
2.53
16.54
53.88
4.16
18.39
Free Cash Flow per Basic Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
4.01
5.01
0.75
0.49
1
- -
Dividend per Share
87.13
88.14
44.33
31.88
16.3
37.98
37.24
35.45
36.22
35.9
94.56
127.75
131.21
133.44
194.19
192.76
200.54
Book Value per Share
85.93
85.64
42.05
27.29
12.86
36.23
35.97
34.42
35.74
35.6
93.97
127.1
130.48
131.8
192.87
190.42
197.59
Tangible Book Value per Share
87
98
98
98
98
98
98
98
98
98
98
99
99
99
103
111
110
Basic Weighted Avg Shares
5,732
5,351
4,463
6,085
6,511
4,727
4,926
4,512
4,797
5,527
6,503
7,001
9,297
12,639
15,911
9,546
10,977
Sales/Revenue/Turnover
-51.17
-56.93
-81.6
-31.74
-16.79
-36.13
-26.26
-29.77
-25.57
-14.27
-11.97
-20.55
0.04
-0.2
2.74
-13.11
-13.28
Operating Margin (%)
358
317
299
361
363
341
247
239
233
289
282
291
311
305
361
377
505
Depreciation Expense
-824
-3,430
-4,070
-1,269
-1,568
896
201
50
69
42
4,723
3,961
-84
411
1,067
69
887
Net Income, GAAP
- -
- -
- -
- -
- -
10.21
- -
- -
19.44
35.5
13.87
7.21
58.07
31.68
26.02
55.05
9.03
Effective Tax Rate (%)
-14.38
-64.11
-91.19
-20.85
-24.09
18.95
4.07
1.11
1.43
0.77
72.63
56.58
-0.9
3.25
6.71
0.72
8.08
Profit Margin (%)
5,030
5,484
1,369
28
-481
-182
844
1,763
2,141
987
10,349
10,423
9,929
9,622
15,733
13,157
12,598
Working Capital
479
1,098
1,000
1,650
3,084
1,847
1,594
1,772
2,124
1,114
3,046
2,445
2,125
2,300
1,443
994
785
LT Debt
8,869
8,983
4,667
3,410
1,847
3,956
3,859
3,801
3,884
3,973
10,574
14,150
14,557
14,703
22,931
22,793
24,202
Total Equity
- -
- -
- -
- -
- -
-26.97
- -
- -
-17
-9.02
-6.78
-8.22
0.01
-0.1
1.52
-2.28
-5.54
Return on Invested Capital (%)
- -
- -
- -
- -
- -
17.66
- -
- -
1.58
0.55
48.92
23
-2.03
2.16
4.89
0.25
4.04
Return on Capital (%)
-11.51
-39.81
-62.49
-33.86
-66.2
33.57
5.42
1.4
1.95
1.2
73.63
36.19
-0.65
3.13
6.14
0.32
4.24
Return on Common Equity (%)

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
290
651
658
LT Borrowings
926
614
654
LT Finance Leases
67
102
130
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
111
111
111
Market Capitalization
28,807
28,838
40,580

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
24,740
27,030
26,566
Cash, Cash Equivalents & STI
21,186
22,347
21,445
Accounts Receivable, Net
548
523
615
Inventories
1,910
2,972
3,337
Total Current Liabilities
11,583
13,829
13,968
Payables & Accruals
- -
- -
- -
ST Debt
290
651
658
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
25.97%
18.61%
-0.6%
Free Cash Flow
-11.6%
-3.72%
-91.67%
Net Income, GAAP
1,021.77%
-128.57%
-93.53%
Sales/Revenue/Turnover
9.73%
12.46%
-40%
Total Cash Common Dividend
- -
- -
122.23%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
2,161
2,959
5,293
5,497
15,911
2025
2,052
2,124
2,321
3,049
9,546
2026
2,141
3,466
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.74
0.65
2.96
5.68
10.41
2025
0.12
-5.82
0.2
6.12
0.62
2026
0.42
1.25
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.49
2025
- -
- -
- -
- -
1
2026
- -
- -
- -
- -
- -
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Business
VIA Technologies, Inc. (TWSE: 2388) designs, manufactures and sells semiconductors, integrated circuits, PC chipsets, CPUs and AI-enabled platforms for automotive, edge computing, industrial and building applications. Core products and services include VIA Mobile360 systems for AI-powered driver safety, people detection and sensor fusion in commercial vehicles such as forklifts, trucks and heavy equipment; edge modules and boards encompassing AMOS and ARTiGO series systems, SOM-5000, VAB-5000 and starter kits with Android/Linux support for retail and industrial Edge AI devices; building solutions featuring access control, video intercom, smart doorbells, touchpad alarms and home automation tablets; industrial solutions for AI visual inspection of pipeline welds, plastic bag stitching, silicon wafers, smoke detection and worker PPE compliance; VIA NEXT back-end services for advanced ASICs and chiplets in AI computations; and VIA Labs USB/Power Delivery controllers plus graphic chipsets, chip testing, packaging and CPU licensing. VIA Intelligent Solutions integrate AI, computer vision, IoT and cloud technologies to enhance operational safety, efficiency and sustainability across demanding environments. The company, founded in 1987 in Fremont, California and headquartered at 8F, 533 Zhongzheng Road, New Taipei City, Taiwan, maintains global operations with sales offices in the US, Europe and Asia-Pacific including China locations in Beijing, Shanghai and Shenzhen; it employs around 1,000-2,000 staff and targets hi-tech, manufacturing, transportation and smart city sectors. Recent developments feature the launch of NVIDIA Jetson-powered Edge AI PCs including VIA AMOS-9100 and AMOS-9000; new SOM-3000, SOM-5000 and SOM-7000 modules powered by MediaTek Genio for industrial and consumer uses; a distribution partnership with Rutronik Electronics Worldwide; and the VIA Mobile360 Safety Solution for Heavy Equipment receiving the 2024 Mine Safety and Technology Innovation Award, alongside April 2025 consolidated sales reporting.