D'nonce Technology Bhd.
MMYX:DNONCE0.04
MYR
0.00
(0.00%)
D'nonce Technology Bhd.
MYX:DNONCE
(Bursa Malaysia)
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ROIC.AI
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- D'nonce Technology Bhd. is a Malaysia-based investment holding company that provides integrated supply chain, contract manufacturing, precision engineering, and specialized packaging solutions across Southeast Asia. Founded in 1989 and headquartered in Perai, Penang, Malaysia, the company operates across three primary business segments: Electrical and Electronics, Healthcare, and Other Industries, serving industrial clients in the semiconductor, consumer electronics, automotive, medical device, and food and beverage sectors. The group delivers its offerings through a network of operating subsidiaries across Malaysia, Thailand, and Singapore, including D'nonce (M) Sdn. Bhd., D'nonce (K.L) Sdn. Bhd., D'nonce (Johore) Sdn. Bhd., Richmond Technology Sdn. Bhd., D'nonce Singapore Pte. Ltd., Integrated SCM Co., Ltd., ISCM Technology (Thailand) Co. Ltd., and ISCM Industries (Thailand) Co. Ltd. The company's core products and services encompass specialized packaging solutions, including customized design packaging, flexographic and offset printed packaging, corrugated cartons, kraft paper products, cleanroom paper labels and separators, and self-adhesive flexible packaging; precision polymer engineering and thermoforming solutions, comprising plastic injection molding, thermoformed packaging trays, plastic and paper carrier reels, and thermal cover tapes; contract manufacturing and cleanroom services, featuring Class 100 cleanroom processing, precision electronic assembly, box-build contract manufacturing, and healthcare consumables including surgical face masks; and industrial commerce and distribution, providing engineering polymers, cleanroom consumables, specialty adhesives and tapes, industrial brushes, and automotive spare parts and lubricants. In recent developments, D'nonce Technology Bhd. has progressed with its corporate transformation program focused on reinforcing its end-to-end total packaging and supply chain solution capabilities. As part of its regional expansion strategy, the company completed strategic asset investments totaling approximately RM30 million to acquire a manufacturing plant in Kuala Lumpur and industrial land in Johor, targeted at expanding group packaging production capacity by 20% and up to 65% respectively. Furthermore, the group broadened its regional manufacturing footprint and technical capabilities through the integration of its acquired specialized labelling business in Thailand, while continuing to upgrade its cleanroom assembly infrastructure and high-precision packaging facilities to support regional semiconductor, electronics, and medical device supply chains.