Foundpac Group Bhd.
MMYX:FPGROUP0.37
MYR
-0.02
(-5.19%)
ISIN
MYL5277OO008
Return %
Stock
S&P 500
1Y
7.35
14.20
3Y
-14.12
81.12
5Y
-53.21
68.34
Capital Structure
FRC
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in mil. unless spec.Working Capital
FRC
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in mil. unless spec.Growth Rates
FRC
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in mil. unless spec.Quarterly Revenue
FRC
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in mil. unless spec.Quarterly Earnings Per Share
FRC
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in mil. unless spec.Quarterly Dividends Per Share
FRC
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in mil. unless spec.Company Description
- CEO
- Choon Heng Ong
- Full Time Employees
- 127
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- Bayan Lepas Malaysia
- IPO Date
- Dec 29, 2016
- Website
- foundpac.com
- Similar Companies
- Business
- FoundPac Group Berhad is an investment holding company that specializes in the design, development, manufacture, and marketing of precision engineering parts, laser stencils, and cable assemblies for the semiconductor, automotive, and electronics industries. Founded in 2004 and headquartered in Bayan Lepas, Penang, Malaysia, the company serves as an engineering solutions provider primarily across three operating segments: Precision Engineering, Laser Stencils, and Cables and Connectors. The company's product and service offerings comprise: precision engineering components, including printed circuit board stiffeners, high-frequency test sockets, manual test lids, conversion kits, and test fixture accessories designed for integrated circuit validation and semiconductor testing; laser stencils, consisting of high-accuracy laser-cut metal stencils, electroformed stencils, step stencils, and custom thin-metal precision parts used in surface-mount technology and semiconductor packaging processes; wire harness and cable assemblies, encompassing automotive wire harnesses, industrial cable assemblies, power supply cords, and customized connector systems; and industrial support solutions, including automated machinery integration, turnkey precision machining, equipment sourcing, and contract module assembly. FoundPac delivers its products to outsourced semiconductor assembly and test providers, fabless design firms, integrated device manufacturers, and electronic manufacturing services providers across Malaysia, the United States, Europe, China, Taiwan, Singapore, and Hong Kong. Key operating subsidiaries include FoundPac Technologies Sdn. Bhd., FP Stencil Sdn. Bhd., and SDKM Technologies Sdn. Bhd. In recent corporate developments, FoundPac Group Berhad has pursued operational consolidation and capability expansion to enhance manufacturing efficiency and scale. The group completed the acquisition of industrial land and buildings in Bayan Lepas, Penang, for RM41.88 million via FoundPac Sdn. Bhd., aimed at centralizing its distributed manufacturing facilities into a unified production hub. To diversify its revenue base beyond core semiconductor test components, the company acquired a controlling 70% equity stake in SDKM Technologies Sdn. Bhd., establishing its wire harness and cable assembly division catering to automotive and industrial clients. Furthermore, following a localized operational incident at its FP Stencil facility in Penang, the group implemented comprehensive business continuity protocols, including strategic contract manufacturing partnerships and facility upgrades, maintaining full supply chain continuity while advancing automation initiatives across its production lines.