- CEO
- Swee Kiang Fong
- Full Time Employees
- 391
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- Bayan Baru Malaysia
- IPO Date
- May 20, 2026
- Business
- Skyechip Berhad operates as a fabless semiconductor design company specializing in advanced silicon Intellectual Property (IP) and custom Application-Specific Integrated Circuit (ASIC) solutions for artificial intelligence (AI), high-performance computing (HPC), data centers, automotive systems, and Internet of Things (IoT) applications. Founded in 2019 and headquartered in Bayan Lepas, Penang, Malaysia, the company provides end-to-end integrated circuit (IC) design services and semiconductor architectures to global technology providers, system original equipment manufacturers (OEMs), and fabless chipmakers across Asia-Pacific, North America, and international markets. The company offers a specialized portfolio of silicon IP and engineering solutions, including high-bandwidth memory interface IP encompassing High Bandwidth Memory (HBM3, HBM3E, and HBM4) PHYs and controllers; high-speed memory IP comprising DDR4, DDR5, LPDDR5, and LPDDR6 controllers and physical layer interfaces; interconnect and system IP featuring coherent and non-coherent Network-on-Chip (NoC) architectures as well as 2.5D and 3D die-to-die (D2D) packaging interconnects; analog and foundation IP consisting of high-speed phase-locked loops (PLLs), bandgaps, configurable input/output (I/O) interfaces, MIPI D-PHYs, and RISC-V processor cores; full-lifecycle custom ASIC design services spanning architecture planning, logic design, physical synthesis, advanced multi-die packaging, and post-silicon validation; and proprietary AI silicon hardware, including the MARS1000 edge AI processor engineered for decentralized inference in industrial automation, robotics, and intelligent infrastructure. In May 2026, Skyechip Berhad completed its initial public offering (IPO) on the Main Market of Bursa Malaysia, raising RM352 million to expand its research and development operations, upgrade computing cluster infrastructure, and acquire advanced electronic design automation (EDA) tooling. The company has also strengthened its global ecosystem partnerships through collaborations with Arm on advanced compute subsystems, qualification on leading foundry IP programs including Samsung CONNECT IP, and expanded technical alignments with major semiconductor fabrication and packaging partners to scale its next-generation multi-die and AI silicon accelerator offerings.