- Sector
- Industrial services
- Industry
- Engineering & construction
- Address
- Petaling Jaya Malaysia
- IPO Date
- Jun 18, 2026
- Business
- Sum Technology Berhad is a Malaysia-based investment holding company engaged in the design, development, manufacturing, and integration of precision engineering components, automated test systems, industrial automation solutions, and enterprise manufacturing software. The company operates through three principal business segments: Precision Engineering, Automation Solutions, and Digital Technologies. Its core product and service portfolio includes high-precision mechanical components, CNC-machined parts, micro-tooling, and custom jigs and fixtures; automated optical inspection (AOI) systems, vision-guided sorting machinery, wafer-level test handling platforms, and customized automated test equipment (ATE); turnkey industrial automation systems, robotic material handling cells, automated guided vehicles (AGVs), and automated storage and retrieval systems (ASRS); proprietary manufacturing execution systems (MES), supervisory control and data acquisition (SCADA) platforms, and Internet of Things (IoT)-enabled predictive maintenance software; and electronic manufacturing services (EMS), including surface mount technology (SMT) assembly, printed circuit board assembly (PCBA), and complete box-build integration. Sum Technology Berhad serves a diverse customer base spanning the semiconductor, outsourced semiconductor assembly and test (OSAT), automotive electronics, telecommunications, medical technology, and industrial equipment sectors across Malaysia, Singapore, China, the United States, and Europe. Founded in 1998 and headquartered in Penang, Malaysia, the company manages multiple production facilities, research and development centers, and regional sales and service offices through its operating subsidiaries. In recent strategic developments, Sum Technology Berhad has expanded its production capacity through the operational commissioning of an advanced smart manufacturing plant in Penang; entered into a strategic joint development agreement with a regional semiconductor technology partner to engineer next-generation artificial intelligence-driven optical inspection modules; completed the acquisition of a controlling equity interest in a regional industrial IoT solutions provider to integrate edge computing capabilities into its automation platform; introduced a new flagship series of high-speed multi-spectral inspection systems designed for advanced semiconductor packaging and high-density interconnect substrates; and completed an internal corporate reorganization establishing dedicated business units to accelerate commercial expansion into European and North American electronics manufacturing markets.