TSiC Bhd.
MMYX:TSIC0.10
MYR
0.00
(0.00%)
ISIN
MYL03062O006
Return %
Stock
S&P 500
1Y
0.00
14.20
3Y
- -
81.12
5Y
- -
68.34
Capital Structure
FRC
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
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in mil. unless spec.Semi-annual Revenue
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in mil. unless spec.Semi-annual Earnings Per Share
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in mil. unless spec.Semi-annual Dividends Per Share
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in mil. unless spec.Company Description
- CEO
- Chot Hun Lim
- Sector
- Miscellaneous
- Industry
- Miscellaneous
- Address
- Melaka Malaysia
- IPO Date
- May 16, 2025
- Website
- tsic.com.my
- Similar Companies
- Business
- TSiC Berhad is a Malaysia-based investment holding company that specializes in engineering support services, electronic component trading, and precision maintenance, troubleshooting, and repair solutions for the electrical and electronics (E&E) and semiconductor manufacturing sectors. The company conducts its core commercial operations primarily through its wholly-owned operating subsidiary, BPE Synergy Engineering Sdn. Bhd., which was established in 2012. TSiC Berhad organizes its business into four main operating segments: Troubleshooting and Repair Activities; Service Contract Activities; Project Activities; and Trading Activities. The company's comprehensive product and service portfolio encompasses: diagnostic troubleshooting, precision component refurbishment, and gold and nickel re-plating for printed circuit boards (PCBs), integrated circuit test boards, semiconductor equipment cards, and industrial power supplies; on-site engineering maintenance, technical support service contracts, and professional engineering headcount outsourcing for cleanroom manufacturing facilities; turnkey project engineering, comprising customized hardware design, fabrication, precision assembly, and automated test system modifications; and the wholesale trading and distribution of active and passive electronic components, including integrated circuits (ICs), transistors, capacitors, resistors, relays, and industrial connectors. TSiC Berhad primarily caters to semiconductor device manufacturers, outsourced semiconductor assembly and test (OSAT) providers, and electronics manufacturing services (EMS) multinational corporations located across Malaysia and regional industrial hubs. Headquartered in Melaka, Malaysia, the company was incorporated in 2023 and completed its listing on the LEAP Market of Bursa Malaysia in May 2025 under the stock code 03062. In recent corporate developments, the company acquired industrial land plots in Taman Perindustrian Bukit Rambai, Melaka, in 2026 through BPE Synergy Engineering Sdn. Bhd. to develop a centralized three-storey manufacturing facility, corporate office, and warehouse, aimed at expanding its in-house PCB repair, assembly, and testing capacity while optimizing cost structures and consolidating operations.