Towa Corporation

Towa Corporation

12.03
USD
-1.58
(-11.61%)
1.45BMarket Cap
Nov 06Next Earn
Towa Corporation
OTC:TOWCF
(OTC Markets)

Recent

price

12.03

P/E

ratio

- -

div

yld

- -

ROIC.AI

2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
2026
TTM
JPY
301.08
228.42
219.28
228.76
281.88
296.81
368.28
413.32
376.82
336.62
395.95
675.32
717.19
2,018.3
713.03
724.62
- -
Revenue per Share
50
12.9
9.21
7.57
25.78
24.33
51.55
40.34
11.7
4.92
35.5
108.36
97.9
257.7
108.28
61.22
- -
Basic EPS, GAAP
67.71
12.73
20.1
-8.76
15.67
15.91
6.43
38.97
-34.67
84.66
70.8
15.08
1.33
319.8
71.04
0.68
- -
Free Cash Flow per Basic Share
- -
3.33
1.67
3.33
3.33
3.33
3.33
5.33
5.33
5.33
5.33
5.33
16.66
40.02
13.35
20.02
- -
Dividend per Share
196.85
212.17
224.85
235.26
276.44
275.23
329.13
371.93
368.08
358.88
415.6
542.86
629.13
779.18
818.41
941.14
- -
Book Value per Share
185.14
202.59
216.43
228.18
268.08
265.94
320
363.2
359.31
349.72
407.12
525.44
613.64
761.46
799.47
911.27
- -
Tangible Book Value per Share
75
75
75
75
75
75
75
75
75
75
75
75
75
25
75
75
75
Basic Weighted Avg Shares
22,593
17,140
16,454
17,165
21,150
22,270
27,632
31,011
28,272
25,255
29,707
50,667
53,823
50,472
53,479
54,365
- -
Sales/Revenue/Turnover
18
8.62
-2.67
2.67
9.36
8.78
13.87
11.87
3.31
3.22
12.18
22.71
18.65
17.16
16.61
12.72
- -
Operating Margin (%)
1,171
1,182
1,391
1,357
1,262
1,353
1,307
1,291
1,486
1,549
1,630
1,964
2,615
2,687
2,823
3,271
- -
Depreciation Expense
3,752
968
691
568
1,934
1,826
3,868
3,027
878
369
2,663
8,130
7,347
6,444
8,121
4,593
- -
Net Income, GAAP
4.82
10.37
10.05
11.59
6.64
14.64
5.21
15.46
12.74
45.65
30.11
30.3
27.8
29.3
27.54
34.44
- -
Effective Tax Rate (%)
16.61
5.65
4.2
3.31
9.15
8.2
14
9.76
3.1
1.46
8.96
16.05
13.65
12.77
15.19
8.45
- -
Profit Margin (%)
5,167
5,755
8,030
8,653
10,278
9,833
12,192
12,186
15,349
13,951
15,317
18,694
26,212
30,513
32,642
39,609
- -
Working Capital
3,003
1,533
2,882
3,195
2,853
2,906
1,629
807
4,087
4,763
4,877
3,647
4,410
2,910
1,778
4,353
- -
LT Debt
14,771
15,926
17,072
17,910
21,061
21,006
25,101
27,905
27,723
27,018
31,504
41,121
47,623
58,436
61,386
70,612
- -
Total Equity
17.06
5.92
-1.77
1.73
7.28
6.35
13.07
10.09
2.32
1.17
6.55
17.05
12.26
8.84
8.76
5.58
- -
Return on Invested Capital (%)
17.46
4.85
3.47
2.64
7.84
6.82
14.11
10.05
2.62
1.1
7.09
17.93
12.85
9.55
11.38
5.87
- -
Return on Capital (%)
29.01
6.31
4.22
3.29
10.08
8.82
17.06
11.51
3.16
1.35
9.17
22.61
16.71
12.2
13.56
6.96
- -
Return on Common Equity (%)

Capital Structure

JPY

•

in mil. unless spec.
Sep'26
Mar'26
Jun'27
ST Debt
13,120
13,819
- -
LT Borrowings
810
4,000
- -
LT Finance Leases
- -
353
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
75
75
75
Market Capitalization
129,258
230,093
255,175

Working Capital

JPY

•

in mil. unless spec.
Sep'26
Mar'26
Jun'27
Total Current Assets
56,215
67,168
- -
Cash, Cash Equivalents & STI
24,526
28,432
- -
Accounts Receivable, Net
12,778
16,164
- -
Inventories
17,509
19,791
- -
Total Current Liabilities
23,535
27,559
- -
Payables & Accruals
- -
- -
- -
ST Debt
13,120
13,819
- -
Deferred Revenue
- -
- -
- -

Growth Rates

JPY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
13.32%
17.82%
15.03%
Free Cash Flow
750.78%
1,522.12%
-99.04%
Net Income, GAAP
74.92%
33.19%
-43.44%
Sales/Revenue/Turnover
11.26%
15.64%
1.66%
Total Cash Common Dividend
- -
- -
50.02%

Quarterly Revenue

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2025
- -
- -
- -
- -
53,479
2026
- -
- -
- -
- -
54,365
2027
- -
- -
- -
- -
- -

Quarterly Earnings Per Share

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2025
- -
- -
- -
- -
108.28
2026
- -
- -
- -
- -
61.22
2027
- -
- -
- -
- -
- -

Quarterly Dividends Per Share

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2025
- -
- -
- -
- -
13.35
2026
- -
- -
- -
- -
20.02
2027
- -
- -
- -
- -
- -
Business
TOWA Corporation specializes in the design, development, production, and worldwide distribution of semiconductor manufacturing systems and advanced precision molds. The company offers a diverse range of products, including sophisticated molding and singulation equipment, ultra-precise molds, and specialized tooling like THPL-CBN end mills and TEN-systems. Beyond its core semiconductor offerings, TOWA also engages in the medical device and laser processing equipment sectors, providing a comprehensive array of precision-engineered solutions. With a history originating as TOWA Precision Industries Limited, the firm adopted its current name in December 1988, having been established in 1979. Headquartered in Kyoto, Japan, TOWA Corporation remains a key innovator in its global markets.