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TongFu Microelectronics Co., Ltd. Class A

TongFu Microelectronics Co., Ltd. Class A

1.57
THB
-0.05
(-3.09%)
0.21EPS
Oct 30Next Earn
TongFu Microelectronics Co., Ltd. Class A
SET:TONGFU23
(Stock Exchange of Thailand)

Recent

price

1.57

P/E

ratio

- -

div

yld

4.01%

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
CNY
0.02
0.01
0.01
0.01
0.02
0.02
0.03
0.05
0.04
0.06
0.06
0.08
0.11
0.1
0.11
0.12
0.54
Revenue per Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
0.01
0.04
Basic EPS, GAAP
- -
-0.01
- -
- -
- -
-0.01
-0.01
- -
-0.01
- -
-0.01
-0.02
-0.02
- -
- -
- -
- -
Free Cash Flow per Basic Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
0.01
Dividend per Share
0.02
0.02
0.02
0.02
0.02
0.03
0.03
0.04
0.04
0.04
0.05
0.05
0.06
0.06
0.07
0.07
0.07
Book Value per Share
0.02
0.02
0.02
0.02
0.02
0.03
0.02
0.03
0.03
0.03
0.04
0.05
0.06
0.06
0.06
0.06
0.07
Tangible Book Value per Share
107,251
118,151
121,586
129,940
122,597
145,654
141,129
139,320
171,136
141,932
173,063
197,050
201,138
228,431
223,301
225,916
57,410
Basic Weighted Avg Shares
1,727
1,622
1,590
1,767
2,091
2,322
4,592
6,519
7,223
8,267
10,769
15,812
21,429
22,269
23,882
27,921
30,792
Sales/Revenue/Turnover
8.6
2.17
3.42
5.2
4.87
2.81
5.13
5.27
3.94
2.35
5.73
7.61
5.26
4.45
6.43
6.8
7.44
Operating Margin (%)
181
207
234
251
292
355
655
893
1,021
1,223
1,548
2,015
2,981
3,548
3,221
3,498
- -
Depreciation Expense
139
49
38
61
121
147
181
122
127
19
338
957
502
169
678
1,219
2,386
Net Income, GAAP
11.63
19.88
2.03
14.1
9.98
8.96
2.91
- -
- -
- -
- -
- -
- -
10.64
24.42
21.47
19.05
Effective Tax Rate (%)
8.05
3.02
2.38
3.43
5.78
6.35
3.94
1.87
1.76
0.23
3.14
6.05
2.34
0.76
2.84
4.36
7.75
Profit Margin (%)
853
504
636
343
154
1,379
626
707
-268
-1,171
1,649
-1,113
-615
-803
-1,319
-3,325
-5,364
Working Capital
140
179
347
120
152
476
301
772
361
758
2,449
4,232
6,026
6,003
7,371
9,726
9,283
LT Debt
2,132
2,181
2,209
2,256
2,364
3,740
6,142
6,258
6,504
6,522
10,015
11,022
14,559
14,694
15,711
17,141
18,478
Total Equity
4.55
0.34
0.41
0.93
1.5
0.59
2.15
- -
- -
- -
- -
- -
- -
0.78
2.69
4.15
7.04
Return on Invested Capital (%)
7.56
2.69
2.69
3.25
5.1
4.66
2.98
- -
- -
- -
- -
- -
- -
2.36
3.25
4.4
7.5
Return on Capital (%)
8.7
2.27
1.72
2.72
5.23
4.83
4.72
2.48
2.11
0.31
4.31
9.56
4.13
1.22
4.74
8.08
15.09
Return on Common Equity (%)

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
9,041
11,194
11,618
LT Borrowings
9,726
8,836
9,279
LT Finance Leases
- -
- -
4
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
225,057
225,057
225,057
Market Capitalization
- -
- -
- -

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
15,565
15,912
16,787
Cash, Cash Equivalents & STI
5,410
4,921
5,593
Accounts Receivable, Net
5,068
5,364
5,345
Inventories
4,220
4,811
5,009
Total Current Liabilities
18,890
21,578
22,151
Payables & Accruals
- -
- -
- -
ST Debt
9,041
11,194
11,618
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
18.3%
11.82%
9.1%
Free Cash Flow
5.69%
-1.81%
-211.57%
Net Income, GAAP
202.6%
89.73%
79.86%
Sales/Revenue/Turnover
30.57%
22.09%
16.92%
Total Cash Common Dividend
28.74%
27.02%
10.79%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
5,282
5,798
6,001
6,800
23,882
2025
6,092
6,946
- -
7,805
27,921
2026
7,482
8,559
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
0.15
0.15
0.08
- -
2025
- -
0.2
- -
0.24
0.01
2026
- -
0.91
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
0.1
0.08
0.09
- -
2025
- -
0.13
- -
0.09
- -
2026
- -
0.17
- -
- -
- -
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Business
Tongfu Microelectronics Co., Ltd is a leading enterprise primarily engaged in the design, manufacturing, and sale of semiconductor packaging and testing services. Its core offerings include advanced IC packaging solutions such as flip chip packaging, ball grid array (BGA) packages, system-in-package (SiP), and other microelectronic assembly products. The company also provides comprehensive IC testing services, covering various testing types to ensure product quality and performance. Tongfu Microelectronics serves a broad range of industries including consumer electronics, telecommunications, automotive electronics, and industrial applications, operating mainly in China and expanding its footprint across Asia. Founded in 1993 and headquartered in Suzhou, Jiangsu Province, China, Tongfu Microelectronics has maintained a strong market position as a semiconductor backend service provider. Recent strategic initiatives include intensifying partnerships with global semiconductor firms to enhance technological capabilities and increase production scale. The company has expanded its product portfolio to include more system-in-package solutions addressing increasing demands for miniaturization and higher integration in electronic devices. Additionally, Tongfu Microelectronics has undergone operational upgrades to improve automated manufacturing efficiency and quality control, reflecting its focus on innovation and competitiveness in a rapidly evolving semiconductor market environment. The company's major recent developments also include investments in R&D centers and advanced fabs to support new packaging technologies and services, reinforcing its commitment to innovation-led growth. Through these efforts, Tongfu continues to strengthen its service offerings, targeting sophisticated applications such as 5G communications, automotive electronics, and IoT devices. Tongfu Microelectronics also operates several subsidiaries and has built strategic alliances within the semiconductor supply chain, which enhance its ability to serve multinational clients and meet global standards. Overall, Tongfu Microelectronics Co., Ltd exemplifies a comprehensive semiconductor service provider with a diversified product range, a strong technological foundation, and ongoing projects to broaden its service capacity and market reach in the Asia-Pacific region and beyond.