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Advanced Micro-Fabrication Equipment Inc. China Class A

Advanced Micro-Fabrication Equipment Inc. China Class A

264.18
CNY
-9.82
(-3.58%)
443.89BMarket Cap
Oct 31Next Earn
Advanced Micro-Fabrication Equipment Inc. China Class A
SSE:688012
(Shanghai Stock Exchange)

Recent

price

264.18

P/E

ratio

- -

div

yld

0.09%

ROIC.AI

2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
CNY
0.76
1.22
2.42
2.56
2.85
3.63
5.17
6.8
9.83
13.38
- -
Revenue per Share
-0.3
0.04
0.13
0.25
0.62
1.18
1.28
1.94
1.75
2.28
- -
Basic EPS, GAAP
-0.2
-0.21
0.34
0.12
0.75
0.61
-0.97
-2.01
0.61
1.56
- -
Free Cash Flow per Basic Share
0.02
0.02
0.02
- -
- -
- -
- -
0.15
0.22
0.22
0.25
Dividend per Share
-1.21
0.37
2.95
4.71
5.48
15.18
16.86
19.32
21.28
24.33
31.7
Book Value per Share
-1.22
0.14
2.45
4.05
4.78
14.28
15.87
18.03
19.19
21.3
26.58
Tangible Book Value per Share
797
797
677
759
797
856
917
921
922
925
939
Basic Weighted Avg Shares
610
972
1,639
1,947
2,273
3,108
4,740
6,264
9,065
12,385
- -
Sales/Revenue/Turnover
-38.27
7.73
11.35
12.43
10.56
20.1
21.2
21.25
16.71
12.82
- -
Operating Margin (%)
33
14
20
28
78
103
131
174
259
348
- -
Depreciation Expense
-239
30
91
189
492
1,011
1,170
1,786
1,616
2,111
- -
Net Income, GAAP
- -
39.13
38.3
4.94
3.98
10.73
7.2
11.26
5.54
5.74
- -
Effective Tax Rate (%)
-39.18
3.08
5.54
9.69
21.65
32.54
24.68
28.51
17.82
17.05
- -
Profit Margin (%)
-901
67
1,507
2,950
2,960
11,160
10,736
11,464
12,267
12,732
15,569
Working Capital
216
224
- -
- -
6
4
511
17
733
735
496
LT Debt
-871
266
2,116
3,751
4,369
13,940
15,483
17,823
19,736
22,729
30,290
Total Equity
- -
22.69
6.13
6.33
12.22
11.04
7.8
10.16
8.21
9.35
- -
Return on Invested Capital (%)
- -
38.01
6.63
5.92
11.88
11.04
7.85
10.48
8.4
9.9
- -
Return on Capital (%)
- -
- -
7.63
6.43
12.12
11.05
7.95
10.72
8.6
9.95
- -
Return on Common Equity (%)

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
19
18
409
LT Borrowings
730
730
482
LT Finance Leases
5
4
14
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
933
934
947
Market Capitalization
170,762
192,075
443,886

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
18,934
19,501
22,318
Cash, Cash Equivalents & STI
8,743
8,532
10,439
Accounts Receivable, Net
1,987
2,566
3,058
Inventories
7,170
7,259
7,666
Total Current Liabilities
6,202
6,035
6,750
Payables & Accruals
- -
- -
- -
ST Debt
19
18
409
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
54.23%
15.17%
Free Cash Flow
- -
-30.01%
155.69%
Net Income, GAAP
- -
39%
30.69%
Sales/Revenue/Turnover
- -
40.54%
36.62%
Total Cash Common Dividend
- -
- -
2.35%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1,605
1,843
2,059
3,558
9,065
2025
2,173
2,787
- -
4,322
12,385
2026
2,915
3,776
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.27
0.29
0.43
0.76
1.75
2025
0.34
0.42
- -
0.96
2.28
2026
0.99
1.98
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
0.21
- -
- -
0.22
2025
0.01
0.01
- -
0.01
0.22
2026
- -
0.24
- -
- -
- -
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Business
Advanced Micro-Fabrication Equipment Inc. China (AMEC; 688012.SS) is a Shanghai-based company founded in 2004 that principally engages in the research, development, manufacture, and sale of semiconductor fabrication equipment serving the semiconductor industry and adjacent high-tech sectors including LED production, power devices, MEMS applications, and back-end wafer-level packaging. The company offers a broad portfolio of specialized products such as plasma etching tools including the Primo D-RIE, Primo AD-RIE, Primo SSC AD-RIE, Primo iDEA, Primo HD-RIE, Primo TSV, Primo Nanova, Primo Twin-Star, and Primo UD-RIE series for dielectric etching, through-silicon via (TSV) processing, and advanced nodes down to 5nm; MOCVD systems including Prismo D-BLUE, Prismo A7, Prismo HiT3, and Prismo UniMax for GaN LED and power device production where it holds a dominant market position; LPCVD equipment such as Preforma Uniflex CW; and environmental control solutions like VOC purifiers for industrial use. AMEC operates manufacturing facilities in Shanghai, Xiamen, Nanchang, and plans a new CNY3 billion (USD409 million) production base in Chengdu announced in January 2025 for high-end logic and memory chip equipment R&D and manufacturing; it maintains a global network with presence in Taiwan, Japan, Korea, Singapore, North America, and Europe, serving leading chipmakers. Recent developments include strong 2024 financial performance with revenue forecasted at CNY9 billion (up 44.7% year-over-year) driven by high-end plasma etching and thin film deposition sales, R&D spending nearly doubling to CNY2.4 billion (27% of revenue), quadrupled net earnings to CNY9.1 billion, and new product launches in 2025 such as the Ultra ECDP electrochemical de-plating equipment for wide bandgap semiconductors and Ultra Lith KrF front-end coating and developing tool delivered to a major Chinese logic wafer fabricator; the company is pursuing a multi-year strategic expansion to double its high-end semiconductor equipment market share amid robust growth in etch and thin-film deposition segments.