KINGSEMI Co., Ltd. (688037.SS) engages in the research, development, production, and sales of semiconductor fabrication equipment, specializing in photolithography process tools and single-wafer wet processing solutions including spin coaters/developers, spray coaters, scrubbers, wet etchers, single-wafer cleaners, temporary bonding tools, scribe and break machines, and frame cleaning equipment; the company serves applications in semiconductor manufacturing, advanced packaging, MEMS, LED, OLED, 3D-IC TSV, and photovoltaic sectors with customizable products meeting 300mm front-end-of-line and thick photoresist processes. Founded in 2002 as a spin-off from the Shenyang Institute of Automation, Chinese Academy of Sciences, KINGSEMI maintains headquarters in Shenyang's Hunnan High-tech Industrial Development District, Liaoning Province, China, with subsidiaries in Shanghai and Japan, and operates a 40,000 square meter campus featuring process labs and manufacturing facilities; the firm holds over 308 authorized patents, including 199 inventions, and has undertaken national 02 Special Projects for large-scale integrated circuit equipment. In recent developments, NAURA Technology announced plans in March 2025 to acquire a 9.5% stake in KINGSEMI for CNY1.69 billion to complement its portfolio in etching and deposition with KINGSEMI's gluing and developing expertise, enhancing domestic semiconductor supply chain integration; additionally, the 2024 annual report highlights new product launches such as frame cleaning equipment, temporary bonding machines, and unbonding tools amid robust revenue growth in wet processing segments.