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ACM Research (Shanghai), Inc. Class A

ACM Research (Shanghai), Inc. Class A

SSSE:688082
235.40
CNY
+3.29
(+1.42%)
3.14EPS
129.09P/E
208.48BMarket Cap
Oct 29Next Earn
ACM Research (Shanghai), Inc. Class A
SSE:688082
(Shanghai Stock Exchange)

Recent

price

235.40

P/E

ratio

129.09

div

yld

0.04%

ROIC.AI

2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
CNY
0.65
1.27
2.02
2.56
4.14
6.62
8.93
12.86
15.07
15.61
Revenue per Share
0.03
0.21
0.36
0.5
0.68
1.54
2.09
2.64
3.1
3.35
Basic EPS, GAAP
-0.03
0.06
0.17
-1.13
-0.64
-2.2
-1.89
1.47
-0.59
- -
Free Cash Flow per Basic Share
- -
0.01
0.02
0.02
0.03
0.03
0.41
0.68
0.73
0.08
Dividend per Share
0.12
0.37
2.13
2.69
11.11
12.74
14.82
17.47
28.05
30.27
Book Value per Share
0.12
0.37
2.12
2.52
10.96
12.47
14.45
16.84
26.99
28.82
Tangible Book Value per Share
390
434
375
394
392
434
436
437
450
469
Basic Weighted Avg Shares
254
550
757
1,007
1,621
2,873
3,888
5,618
6,786
7,317
Sales/Revenue/Turnover
7.58
18.86
20.26
16.81
16.3
23.63
22.87
23.21
22.34
22.29
Operating Margin (%)
2
2
3
5
25
39
70
90
140
- -
Depreciation Expense
11
93
135
197
266
668
911
1,153
1,396
1,568
Net Income, GAAP
18.59
10.02
11.91
11.77
0.93
6.73
5.53
11.34
4.2
13.03
Effective Tax Rate (%)
4.28
16.82
17.82
19.53
16.43
23.27
23.42
20.53
20.57
21.43
Profit Margin (%)
96
142
796
818
4,543
3,904
4,711
5,967
11,654
12,314
Working Capital
- -
- -
- -
138
159
138
306
780
1,089
1,334
LT Debt
48
145
830
1,049
4,815
5,524
6,458
7,666
13,471
14,608
Total Equity
- -
64.27
23.56
16.93
8.26
12
13.9
14.47
11.52
11.83
Return on Invested Capital (%)
- -
66.59
24.89
17.55
8.45
12.2
14.16
14.74
11.79
12.08
Return on Capital (%)
- -
95.69
27.67
20.95
9.08
12.93
15.2
16.33
13.21
13.83
Return on Common Equity (%)

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
888
870
1,152
LT Borrowings
1,058
1,329
1,314
LT Finance Leases
30
24
20
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
480
480
483
Market Capitalization
84,533
67,996
208,482

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
15,884
16,173
17,007
Cash, Cash Equivalents & STI
5,045
5,148
5,406
Accounts Receivable, Net
3,159
3,308
3,562
Inventories
4,822
5,010
5,076
Total Current Liabilities
4,231
4,153
4,693
Payables & Accruals
- -
- -
- -
ST Debt
888
870
1,152
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
97.04%
75.73%
Free Cash Flow
- -
-18.59%
-141.28%
Net Income, GAAP
- -
54.06%
21.05%
Sales/Revenue/Turnover
- -
47.75%
20.8%
Total Cash Common Dividend
- -
328.94%
9.72%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
921
1,483
1,573
1,641
5,618
2025
1,306
1,959
- -
1,640
6,786
2026
1,476
2,242
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.18
0.83
0.72
0.9
2.64
2025
0.56
1.02
- -
0.27
3.1
2026
0.22
1.84
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.01
0.02
0.64
0.02
0.68
2025
0.03
0.01
- -
0.02
0.73
2026
0.02
0.03
- -
- -
- -
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Business
ACM Research (Shanghai), Inc. (688082.SS) engages in the research, development, production, and sale of semiconductor equipment primarily for advanced integrated circuit manufacturing, advanced wafer-level packaging, and large silicon wafer manufacturing in China and internationally. The company offers an extensive portfolio of products including cleaning equipment such as single-wafer spin cleaning systems with proprietary SAPS and TEBO technologies for 2D/3D structures, scrubbing equipment, stress-free polishing systems for through-silicon vias and fan-out wafer-level packaging, vertical furnace tube equipment, front-end coating and development track systems, electroplating equipment covering front-end copper interconnects, back-end wafer-level packaging, 3D stacking, and compound semiconductors, plasma-enhanced chemical vapor deposition (PECVD) systems, as well as wet etching, degumming, and Tahoe SPM cleaning solutions for eco-friendly ultra-clean processes. Founded in 2005 and headquartered in Shanghai, China, at the Zhangjiang Hi-Tech Park, the company operates as a subsidiary of U.S.-based ACM Research, Inc., with additional facilities in South Korea and manufacturing sites targeted to achieve RMB 20 billion in annual output value once fully operational. ACM Research (Shanghai), Inc. serves leading semiconductor foundries and chip manufacturers, holding significant market shares including over 30% in single-wafer cleaning equipment in China and 8.2% globally in semiconductor electroplating, where it ranks third worldwide after delivering its 1,500th ECP chamber in early 2025. In recent developments, the company completed a major private share offering on the Shanghai STAR Market in September 2025, raising approximately RMB 4.5 billion (US$630 million) from 17 qualified investors to fund research and development, capital expenditures, production capacity expansion, and working capital, which diluted the parent company's stake from 81.1% to 74.5% while maintaining control; additionally, its self-developed panel-level horizontal electroplating equipment received the Technology Enablement Award from 3D InCites in 2025, and platform-based products have begun entering the market amid strong demand for next-generation wafer processing solutions.