- Business
- Beijing YanDong MicroElectronic Co., Ltd. is a China-based integrated device manufacturer and semiconductor foundry specializing in the design, fabrication, packaging, and testing of discrete devices and analog integrated circuits. Founded in 1987 and headquartered in Beijing, China, the company operates primarily as a subsidiary of state-owned Beijing Electronics Holding Co., Ltd. Beijing YanDong MicroElectronic operates through two core business segments: Products and Solutions, and Manufacturing and Services. Its product portfolio includes discrete devices, featuring transient voltage surge suppressors, surge protection devices, digital transistors, bipolar junction transistors, electret condenser microphone preamplifiers, radio-frequency power devices, power MOSFETs, and Schottky barrier diodes; analog integrated circuits, comprising linear regulators, voltage regulation circuits, operational amplifiers, comparators, and power management integrated circuits; and high-reliability specialty integrated circuits. In addition to its proprietary product lines, the company provides open-access contract manufacturing and foundry services, encompassing 6-inch, 8-inch, and 12-inch wafer fabrication, as well as comprehensive backend semiconductor packaging, assembly, and testing solutions. Beijing YanDong MicroElectronic serves domestic and international original equipment manufacturers across diverse end markets, including consumer electronics, automotive electronics, mobile telecommunications and 5G infrastructure, industrial automation and power supplies, smart IoT terminals, and security systems. In recent strategic developments, the company has substantially expanded its advanced manufacturing footprint by leading the investment and construction of a 330-billion-RMB 12-inch specialty process integrated circuit fabrication line through Beijing Electronics IC Manufacturing (Beidian Integrated), in partnership with BOE Technology Group and municipal state-owned capital platforms. This major expansion focuses on 28-nanometer to 55-nanometer specialty platforms for display driver ICs, high-voltage mixed-signal circuits, RF-CMOS, and embedded microcontrollers, having achieved initial tool move-in and qualification milestones to support full-scale commercial production ramping toward long-term target capacity. Concurrently, the company continues to scale capacity utilization on its existing 8-inch wafer lines while accelerating the integration and localization of domestic semiconductor production equipment.