Beijing YanDong MicroElectronic Co., Ltd. Class A

Beijing YanDong MicroElectronic Co., Ltd. Class A

SSSE:688172
33.09
CNY
-0.19
(-0.57%)
-0.43EPS
119.43BMarket Cap
Oct 31Next Earn
Beijing YanDong MicroElectronic Co., Ltd. Class A
SSE:688172
(Shanghai Stock Exchange)

Recent

price

33.09

P/E

ratio

- -

div

yld

0.25%

ROIC.AI

2019
2020
2021
2022
2023
2024
2025
TTM
CNY
0.87
0.86
2.88
2.12
1.79
1.44
1.39
1.51
Revenue per Share
-0.1
0.05
0.78
0.45
0.38
-0.15
-0.31
-0.36
Basic EPS, GAAP
-0.42
-0.23
-0.49
-1.32
-1.65
-2.74
-10.02
- -
Free Cash Flow per Basic Share
0.01
0.02
0.06
0.04
0.02
0.06
0.03
0.08
Dividend per Share
4.87
4.96
9.94
11.97
12.39
12.2
12.84
12.69
Book Value per Share
4.65
4.74
9.73
11.8
12.23
11.74
12.41
12.26
Tangible Book Value per Share
1,199
1,199
706
1,027
1,190
1,187
1,316
1,372
Basic Weighted Avg Shares
1,041
1,030
2,035
2,175
2,127
1,704
1,833
2,076
Sales/Revenue/Turnover
-11.2
3.29
29.15
23.44
15.92
-10.94
-56.43
-49.98
Operating Margin (%)
130
181
247
301
353
459
638
- -
Depreciation Expense
-126
58
550
462
452
-178
-408
-491
Net Income, GAAP
- -
- -
13.68
11.97
6.62
- -
- -
- -
Effective Tax Rate (%)
-12.07
5.68
27.05
21.24
21.27
-10.45
-22.24
-23.63
Profit Margin (%)
2,275
2,306
7,639
9,894
8,169
8,638
7,987
4,878
Working Capital
30
528
1,060
1,096
892
756
2,940
7,438
LT Debt
5,200
5,207
10,303
14,524
15,007
18,295
28,792
29,056
Total Equity
- -
- -
6.63
3.46
2.69
- -
- -
- -
Return on Invested Capital (%)
- -
- -
6.23
3.56
3.16
- -
- -
- -
Return on Capital (%)
- -
1.17
7.25
3.78
3.1
-1.21
-2.47
-3.01
Return on Common Equity (%)

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
326
319
1,250
LT Borrowings
2,931
6,516
7,404
LT Finance Leases
9
31
34
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
1,428
1,428
1,428
Market Capitalization
41,315
54,107
119,435

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
11,654
10,554
12,151
Cash, Cash Equivalents & STI
8,253
6,624
5,671
Accounts Receivable, Net
1,368
1,355
1,362
Inventories
862
1,005
1,137
Total Current Liabilities
3,667
2,754
7,274
Payables & Accruals
- -
- -
- -
ST Debt
326
319
1,250
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
44.29%
57.38%
Free Cash Flow
- -
146.66%
305.08%
Net Income, GAAP
- -
162.5%
128.96%
Sales/Revenue/Turnover
- -
17.97%
7.56%
Total Cash Common Dividend
- -
47.25%
-45.16%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
309
308
372
716
1,704
2025
228
431
- -
667
1,833
2026
400
578
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.02
-0.03
-0.09
-0.05
-0.15
2025
-0.18
0.28
- -
-0.28
-0.31
2026
-0.18
-0.12
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
0.04
- -
0.01
0.06
2025
0.01
0.01
- -
0.01
0.03
2026
0.02
0.04
- -
- -
- -
Business
Beijing YanDong MicroElectronic Co., Ltd. is a China-based integrated device manufacturer and semiconductor foundry specializing in the design, fabrication, packaging, and testing of discrete devices and analog integrated circuits. Founded in 1987 and headquartered in Beijing, China, the company operates primarily as a subsidiary of state-owned Beijing Electronics Holding Co., Ltd. Beijing YanDong MicroElectronic operates through two core business segments: Products and Solutions, and Manufacturing and Services. Its product portfolio includes discrete devices, featuring transient voltage surge suppressors, surge protection devices, digital transistors, bipolar junction transistors, electret condenser microphone preamplifiers, radio-frequency power devices, power MOSFETs, and Schottky barrier diodes; analog integrated circuits, comprising linear regulators, voltage regulation circuits, operational amplifiers, comparators, and power management integrated circuits; and high-reliability specialty integrated circuits. In addition to its proprietary product lines, the company provides open-access contract manufacturing and foundry services, encompassing 6-inch, 8-inch, and 12-inch wafer fabrication, as well as comprehensive backend semiconductor packaging, assembly, and testing solutions. Beijing YanDong MicroElectronic serves domestic and international original equipment manufacturers across diverse end markets, including consumer electronics, automotive electronics, mobile telecommunications and 5G infrastructure, industrial automation and power supplies, smart IoT terminals, and security systems. In recent strategic developments, the company has substantially expanded its advanced manufacturing footprint by leading the investment and construction of a 330-billion-RMB 12-inch specialty process integrated circuit fabrication line through Beijing Electronics IC Manufacturing (Beidian Integrated), in partnership with BOE Technology Group and municipal state-owned capital platforms. This major expansion focuses on 28-nanometer to 55-nanometer specialty platforms for display driver ICs, high-voltage mixed-signal circuits, RF-CMOS, and embedded microcontrollers, having achieved initial tool move-in and qualification milestones to support full-scale commercial production ramping toward long-term target capacity. Concurrently, the company continues to scale capacity utilization on its existing 8-inch wafer lines while accelerating the integration and localization of domestic semiconductor production equipment.