Halo Microelectronics Co., Ltd. Class A

Halo Microelectronics Co., Ltd. Class A

SSSE:688173
11.02
CNY
+0.36
(+3.38%)
7.95BMarket Cap
Oct 31Next Earn
Halo Microelectronics Co., Ltd. Class A
SSE:688173
(Shanghai Stock Exchange)

Recent

price

11.02

P/E

ratio

- -

div

yld

0.09%

ROIC.AI

2018
2019
2020
2021
2022
2023
2024
2025
TTM
CNY
0.17
0.29
0.63
1.26
1.48
0.94
1.39
2.31
- -
Revenue per Share
-0.01
-0.02
-0.4
0.07
-0.04
-0.13
-0.74
-0.28
- -
Basic EPS, GAAP
-0.01
-0.1
-0.08
0.08
-0.27
-0.97
-0.73
-0.63
- -
Free Cash Flow per Basic Share
- -
- -
- -
- -
- -
- -
- -
- -
0.01
Dividend per Share
0.07
0.48
1.14
1.34
4.43
4.48
3.6
3.45
3.61
Book Value per Share
0.06
0.46
1.1
1.28
4.31
4.08
2.9
2.82
2.63
Tangible Book Value per Share
400
400
362
366
379
417
393
407
403
Basic Weighted Avg Shares
68
115
228
463
559
394
546
939
- -
Sales/Revenue/Turnover
-3.68
-5.49
-62.91
4.71
-4.77
-52.91
-43.29
-13.87
- -
Operating Margin (%)
1
1
5
18
27
42
55
57
- -
Depreciation Expense
-5
-10
-145
26
-15
-54
-291
-114
- -
Net Income, GAAP
- -
- -
- -
- -
- -
- -
- -
- -
- -
Effective Tax Rate (%)
-7.9
-8.3
-63.43
5.54
-2.71
-13.77
-53.27
-12.13
- -
Profit Margin (%)
20
167
436
478
1,692
1,440
1,075
919
843
Working Capital
- -
- -
6
6
4
3
3
1
153
LT Debt
25
174
409
482
1,794
1,835
1,569
1,488
1,556
Total Equity
- -
- -
- -
- -
- -
- -
- -
- -
- -
Return on Invested Capital (%)
- -
- -
- -
- -
- -
- -
- -
- -
- -
Return on Capital (%)
- -
-9.59
-49.7
5.76
-1.33
-2.99
-17.54
-7.85
- -
Return on Common Equity (%)

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
140
197
370
LT Borrowings
- -
146
145
LT Finance Leases
1
1
8
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
412
413
415
Market Capitalization
6,062
5,539
7,945

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
1,256
1,365
1,470
Cash, Cash Equivalents & STI
778
630
786
Accounts Receivable, Net
133
182
193
Inventories
265
319
361
Total Current Liabilities
337
417
627
Payables & Accruals
- -
- -
- -
ST Debt
140
197
370
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
54.52%
-5.18%
Free Cash Flow
- -
-84.53%
-11.71%
Net Income, GAAP
- -
71.27%
-60.8%
Sales/Revenue/Turnover
- -
40.94%
72.21%
Total Cash Common Dividend
- -
- -
302.95%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
123
107
115
200
546
2025
178
289
- -
222
939
2026
251
277
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.12
-0.17
-0.19
-0.23
-0.74
2025
-0.07
-0.04
- -
-0.09
-0.28
2026
-0.02
-0.06
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
0.01
- -
- -
- -
Business
Halo Microelectronics Co., Ltd. is a fabless semiconductor company that designs, develops, and markets high-performance analog and mixed-signal integrated circuits, primarily focusing on power management and signal chain solutions. Founded in 2012 and headquartered in Foshan, China, the company maintains research and development, sales, and customer support operations across Shenzhen, Shanghai, Beijing, and Chengdu, as well as international subsidiaries and offices in South Korea, the United States, and Taiwan. Halo Microelectronics Co., Ltd. Class A shares are listed on the Shanghai Stock Exchange Science and Technology Innovation Board under the ticker symbol 688173. The company provides an extensive portfolio of analog semiconductor products serving the consumer electronics, automotive, telecommunications, computing, and industrial IoT sectors. Its core product offerings include direct charge and charge pump fast-charging integrated circuits; lithium-ion battery management systems and linear/switching battery chargers; high-efficiency synchronous DC/DC step-down, step-up, and buck-boost voltage regulators; integrated power distribution switches, including over-voltage protection ICs, over-current protection load switches, and electronic fuses; USB Type-C and Power Delivery interface controllers; audio power amplifiers and haptic feedback drivers; touch controller ICs and voice coil motor auto-focus drivers; and AEC-Q100 qualified automotive-grade power management and protection ICs for advanced driver-assistance systems, in-vehicle infotainment, and automotive body electronics. In recent developments, Halo Microelectronics has expanded its technological capabilities and international footprint through strategic acquisitions and new product rollouts. The company advanced its cross-border consolidation strategy by acquiring an equity stake in South Korea-based fabless semiconductor designer Zinitix Co., Ltd., broadening its portfolio in capacitive touch controllers, auto-focus drivers, and smart wearable power management solutions. In addition, Halo Microelectronics has scaled its automotive semiconductor division, achieving commercial design wins with major automotive tier-1 suppliers and original equipment manufacturers for its AEC-Q100 certified smart high-side switches and power conversion ICs. The company has also introduced next-generation multi-cell high-voltage charge pump fast-charging architectures and expanded its reference design collaborations with premier mobile platform chipset providers to address high-density power requirements in flagship smartphones, laptops, and AI-enabled edge computing hardware.