China Chippacking Technology Co. Ltd. Class A
SSSE:68821629.87
CNY
+0.87
(+3.00%)
China Chippacking Technology Co. Ltd. Class A
SSE:688216
(Shanghai Stock Exchange)
Recent
price
29.87
P/E
ratio
- -
div
yld
0.24%
ROIC.AI
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in mil. unless spec.Growth Rates
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in mil. unless spec.- Similar Companies
- Business
- China Chippacking Technology Co. Ltd. Class A is a China-based outsourced semiconductor assembly and test provider engaged in the research, development, design, packaging, testing, and distribution of integrated circuits and discrete semiconductor power devices. The company delivers end-to-end semiconductor backend manufacturing solutions across standard, proprietary, and advanced packaging architectures. Its comprehensive product and service portfolio includes proprietary and specialty packages comprising CPC, ECPC, CDFN, CQFN, and Qipai series; standard surface-mount packages including SOP, SSOP, TSOP, HSOP, MSOP, EMSOP, and TSOT; flat no-lead packages comprising QFN, DFN, and PDFN; high-pin-count and through-hole configurations including LQFP, TSSOP, ESOP, DIP, and TO series; advanced packaging technologies such as flip-chip, FC-QFN, FC-DFN, and system-in-package solutions; wide-bandgap third-generation semiconductor encapsulation tailored for silicon carbide MOSFETs and gallium nitride radio frequency power devices; and turnkey testing services comprising wafer probe testing, final packaged unit testing, reliability screening, wafer thinning, and wafer dicing. The company serves semiconductor design houses, integrated device manufacturers, and original design manufacturers across automotive electronics, industrial control, telecommunications, consumer electronics, and Internet of Things markets. Founded in 2006, the company is headquartered in Dongguan, Guangdong Province, China, maintains additional operations in Shenzhen, and conducts specialized wafer-level testing activities through its subsidiary, Guangdong Chippacking Core Compete Technology Co., Ltd. In recent developments, China Chippacking Technology has accelerated its expansion into high-density advanced packaging and automotive power semiconductors, successfully commercializing volume shipments of silicon carbide power devices and flip-chip packaging lines. Additionally, the company secured regulatory approval and completed private placement equity financings to fund the construction and equipment procurement for its high-density, high-performance semiconductor packaging and testing base in Dongguan, adding substantial annual capacity for FC-QFN, FC-DFN, LQFP, and third-generation semiconductor lines, while executing capital injections into its wafer testing subsidiary to support expanding front-end probe testing demand.