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United Nova Technology Co. Ltd. Class A

United Nova Technology Co. Ltd. Class A

SSSE:688469
8.13
CNY
+0.22
(+2.78%)
-0.09EPS
543.73P/E
88.94BMarket Cap
Mar 30Next Earn
United Nova Technology Co. Ltd. Class A
SSE:688469
(Shanghai Stock Exchange)

Recent

price

8.13

P/E

ratio

543.73

div

yld

0.32%

ROIC.AI

2019
2020
2021
2022
2023
2024
2025
TTM
CNY
0.11
0.22
0.41
0.89
0.87
0.95
1.1
1.12
Revenue per Share
-0.31
-0.41
-0.25
-0.21
-0.32
-0.14
-0.08
0.02
Basic EPS, GAAP
-1.54
-0.73
-0.92
-1.81
-1.26
-0.24
-0.16
- -
Free Cash Flow per Basic Share
- -
0.01
0.06
0.06
0.07
0.05
0.03
0.03
Dividend per Share
0.61
0.92
0.88
0.68
1.77
1.75
1.55
1.59
Book Value per Share
0.36
0.69
0.68
0.48
1.63
1.63
1.45
1.49
Tangible Book Value per Share
2,490
3,332
4,943
5,183
6,120
6,873
7,436
8,119
Basic Weighted Avg Shares
270
739
2,024
4,606
5,324
6,509
8,180
9,082
Sales/Revenue/Turnover
-257.28
-132.01
-44.6
-15.13
-31.36
-16.47
-11.64
1
Operating Margin (%)
356
826
1,273
2,076
3,433
4,011
3,875
- -
Depreciation Expense
-772
-1,366
-1,236
-1,088
-1,958
-962
-595
158
Net Income, GAAP
- -
- -
- -
- -
- -
- -
- -
- -
Effective Tax Rate (%)
-286.17
-184.8
-61.05
-23.63
-36.78
-14.78
-7.27
1.74
Profit Margin (%)
-1,733
482
-748
-2,283
229
4,792
1,295
1,299
Working Capital
- -
1,725
4,464
9,586
6,735
7,495
5,617
4,643
LT Debt
3,115
4,667
4,307
7,106
15,848
19,947
18,351
18,432
Total Equity
- -
- -
- -
- -
- -
- -
- -
- -
Return on Invested Capital (%)
- -
- -
- -
- -
- -
- -
- -
- -
Return on Capital (%)
- -
-35.11
-27.02
-27.48
-24.59
-7.76
-4.69
1.24
Return on Common Equity (%)

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
5,041
5,652
6,266
LT Borrowings
5,614
5,878
4,607
LT Finance Leases
3
40
36
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
8,383
8,383
8,383
Market Capitalization
56,080
52,811
88,940

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
9,552
10,342
12,001
Cash, Cash Equivalents & STI
4,238
4,854
5,550
Accounts Receivable, Net
2,199
1,798
2,370
Inventories
2,026
2,230
2,417
Total Current Liabilities
8,257
8,698
10,702
Payables & Accruals
- -
- -
- -
ST Debt
5,041
5,652
6,266
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
39.63%
-8%
Free Cash Flow
- -
13.9%
-27.51%
Net Income, GAAP
- -
-6.12%
-38.17%
Sales/Revenue/Turnover
- -
72.98%
25.67%
Total Cash Common Dividend
- -
109%
-40.47%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1,353
1,527
1,668
1,962
6,509
2025
1,734
1,762
- -
2,758
8,180
2026
1,962
2,600
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.03
-0.03
-0.03
-0.04
-0.14
2025
-0.03
- -
- -
-0.02
-0.08
2026
-0.01
0.04
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.01
0.01
0.01
0.01
0.05
2025
0.01
0.01
- -
0.01
0.03
2026
0.01
0.01
- -
- -
- -
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Business
United Nova Technology Co., Ltd. (ticker: 688469.SS) is a China-based semiconductor company that provides one-stop foundry and module manufacturing solutions focusing on power, MEMS, and related automotive, industrial, and AI applications. The company conducts wafer fabrication, packaging, testing, design services, and reliability verification, offering turnkey manufacturing and module integration across its product platforms. Headquartered in Shaoxing, Zhejiang Province, United Nova Technology serves global customers with automotive-grade power devices, power discretes, MOSFETs, IGBTs, analog ICs, MEMS sensors, and MCU-driven systems for automotive, consumer electronics, industrial control, and new energy segments. The firm emphasizes automotive, AI, consumer electronics, and industrial control growth engines, alongside commitments to traceability at wafer and die levels for automotive products. Since its founding in 2018 as Semiconductor Manufacturing Electronics Shaoxing Corp, the company has evolved into United Nova Technology, expanding its foundry capacity and module packaging capabilities to deliver integrated solutions from design through mass production. Geographically, its operations and customer base span China and international markets, with a focus on providing customized process development, mass production, and one-stop manufacturing services; the company maintains relationships with diversified semiconductor customers across multiple sectors and continues to pursue capability enhancements in power, MEMS, and sensor signal chain technologies.