Beijing Jingyi Automation Equipment Co., Ltd. Class A

Beijing Jingyi Automation Equipment Co., Ltd. Class A

SSSE:688652
117.49
CNY
-1.48
(-1.24%)
0.99EPS
202.68P/E
33.63BMarket Cap
Oct 30Next Earn
Beijing Jingyi Automation Equipment Co., Ltd. Class A
SSE:688652
(Shanghai Stock Exchange)

Recent

price

117.49

P/E

ratio

202.68

div

yld

-NaN%

ROIC.AI

2019
2020
2021
2022
2023
2024
2025
TTM
CNY
2.2
3.31
4.18
5.24
5.73
6.11
8.48
9.92
Revenue per Share
-0.28
0.06
0.49
0.72
0.92
0.91
0.88
0.99
Basic EPS, GAAP
-0.25
-1.02
0.1
-0.04
0.09
-0.72
0.83
- -
Free Cash Flow per Basic Share
0.1
0.03
0.01
0.03
0.02
0.08
0.12
- -
Dividend per Share
0.55
1.97
3.63
4.35
11.51
12.35
13.1
13.52
Book Value per Share
0.49
1.91
3.59
4.31
11.49
12.14
12.9
13.33
Tangible Book Value per Share
105
106
120
127
129
168
168
167
Basic Weighted Avg Shares
231
349
501
664
742
1,026
1,426
1,661
Sales/Revenue/Turnover
-12.82
5.63
15.06
18.27
16.84
15.9
11.74
11.65
Operating Margin (%)
3
3
9
12
14
18
23
- -
Depreciation Expense
-29
6
59
91
119
153
148
165
Net Income, GAAP
- -
26.29
10.77
9.78
10.59
8.85
7.08
8.63
Effective Tax Rate (%)
-12.7
1.82
11.73
13.73
16.05
14.9
10.37
9.96
Profit Margin (%)
71
255
452
556
1,933
1,955
1,769
1,765
Working Capital
- -
6
7
8
5
7
20
13
LT Debt
70
248
457
548
1,934
2,074
2,202
2,272
Total Equity
- -
2.81
13.83
14.9
8.4
7.61
6.71
7.36
Return on Invested Capital (%)
- -
4.11
14.49
15.38
9.3
7.62
6.74
7.41
Return on Capital (%)
- -
3.99
16.69
18.13
9.6
7.63
6.92
7.55
Return on Common Equity (%)

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
122
76
79
LT Borrowings
- -
- -
- -
LT Finance Leases
20
16
13
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
168
168
168
Market Capitalization
16,516
16,788
33,629

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
4,278
4,226
4,547
Cash, Cash Equivalents & STI
1,523
1,427
1,569
Accounts Receivable, Net
274
216
251
Inventories
2,395
2,508
2,629
Total Current Liabilities
2,508
2,454
2,782
Payables & Accruals
- -
- -
- -
ST Debt
122
76
79
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
74.09%
6.13%
Free Cash Flow
- -
-383.44%
-215.94%
Net Income, GAAP
- -
187.92%
-3.26%
Sales/Revenue/Turnover
- -
33.04%
38.95%
Total Cash Common Dividend
- -
107.92%
66.62%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
219
286
267
254
1,026
2025
338
397
- -
323
1,426
2026
392
549
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.17
0.31
0.3
0.14
0.91
2025
0.21
0.32
- -
0.12
0.88
2026
0.28
0.27
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.08
2025
- -
- -
- -
- -
0.12
2026
- -
- -
- -
- -
- -
Business
Beijing Jingyi Automation Equipment Co., Ltd. is a China-based technology company primarily engaged in the research, development, manufacture, and distribution of high-end specialized equipment and process support systems for semiconductor and microelectronics fabrication. Founded in 2016 and headquartered in Beijing, China, the company operates as a key subsidiary of Beijing Jingyi Group Co., Ltd., under the ultimate administration of the State-owned Assets Supervision and Administration Commission of the People's Government of Beijing Municipality. The company's core product offerings are organized into three primary specialized semiconductor equipment segments: semiconductor-dedicated temperature control systems (Chiller and Temperature Control Units), designed for high-precision, wide-range thermal regulation between -70°C and 120°C across wafer etching, chemical vapor deposition, physical vapor deposition, ion implantation, and photolithography process chambers; semiconductor-dedicated process exhaust gas abatement systems (Local Scrubbers), incorporating thermal, burn-wet, plasma, and catalytic treatment technologies to achieve destruction removal efficiencies exceeding 99% for toxic, flammable, and corrosive effluent gases generated during wafer manufacturing; and wafer transfer equipment, including automated Wafer Sorters, Equipment Front End Modules (EFEM), precision wafer aligners, vacuum transfer robots, and Autonomous Mobile Robots (AMR) engineered for cleanroom wafer transport, sorting, and positioning. Additionally, the company supplies semiconductor-grade dry vacuum pumps, cleanroom auxiliary automation hardware, and a full suite of aftermarket engineering services, including custom tool retrofitting, preventive maintenance, replacement parts distribution, and on-site technical support. The company's products are deployed across integrated circuit foundries, memory device manufacturers, flat panel display fabricators, light-emitting diode producers, and photovoltaic cell manufacturing facilities throughout China and select regional markets. In recent developments, Beijing Jingyi Automation Equipment completed its initial public offering and listed its Class A shares on the Science and Technology Innovation Board (STAR Market) of the Shanghai Stock Exchange under the ticker symbol 688652, securing capital to finance advanced research and operational scaling. The company has directed significant investment toward expanding its manufacturing footprint, notably through the construction and ongoing deployment of its integrated circuit high-precision control equipment research, development, and production base located in Anhui Province. On the technological and commercial front, the company has expanded its product qualifications to support advanced semiconductor manufacturing nodes, achieving volume deployment across domestic 14-nanometer logic and 192-layer 3D NAND flash memory fabrication lines. Concurrently, the enterprise has reinforced strategic supply partnerships with major domestic chipmakers, including Yangtze Memory Technologies Corp, Semiconductor Manufacturing International Corporation, Hua Hong Semiconductor, and ChangXin Memory Technologies, leading to significant expansions in contracted order backlogs and domestic market penetration.