Jiangsu Aisen Semiconductor Material Co., Ltd. Class A

Jiangsu Aisen Semiconductor Material Co., Ltd. Class A

SSSE:688720
48.62
CNY
+1.52
(+3.23%)
12.42BMarket Cap
Oct 27Next Earn
Jiangsu Aisen Semiconductor Material Co., Ltd. Class A
SSE:688720
(Shanghai Stock Exchange)

Recent

price

48.62

P/E

ratio

- -

div

yld

0.20%

ROIC.AI

2019
2020
2021
2022
2023
2024
2025
TTM
CNY
2.06
2.36
3.53
3.48
3.86
3.5
4.87
- -
Revenue per Share
0.2
0.26
0.39
0.25
0.35
0.27
0.42
- -
Basic EPS, GAAP
-0.33
-0.85
-1.97
-1.47
-1.58
-0.95
-0.52
- -
Free Cash Flow per Basic Share
0.13
0.11
0.09
0.09
0.03
0.15
0.04
0.1
Dividend per Share
2.66
2.84
4.56
4.77
8.24
7.89
8.35
8.54
Book Value per Share
2.56
2.74
4.46
4.64
8.14
7.72
8.18
8.36
Tangible Book Value per Share
85
88
89
93
93
123
122
124
Basic Weighted Avg Shares
176
209
314
324
360
432
593
- -
Sales/Revenue/Turnover
8.07
13.92
11.82
4.47
8.32
4.48
7.44
- -
Operating Margin (%)
3
3
3
11
19
24
34
- -
Depreciation Expense
17
23
35
23
33
33
51
- -
Net Income, GAAP
7.05
10.92
10
- -
0.98
- -
- -
- -
Effective Tax Rate (%)
9.7
11.18
11.13
7.19
9.07
7.75
8.65
- -
Profit Margin (%)
167
151
175
148
661
299
278
483
Working Capital
- -
- -
- -
8
38
1
17
14
LT Debt
227
242
422
441
1,016
978
1,035
1,055
Total Equity
- -
9.33
10.18
- -
3.87
- -
- -
- -
Return on Invested Capital (%)
- -
9.91
10.42
- -
4.28
- -
- -
- -
Return on Capital (%)
- -
9.95
10.54
5.4
4.48
3.36
5.11
- -
Return on Common Equity (%)

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
211
168
143
LT Borrowings
15
17
12
LT Finance Leases
2
3
2
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
123
123
123
Market Capitalization
6,203
5,912
12,416

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
603
739
793
Cash, Cash Equivalents & STI
194
228
184
Accounts Receivable, Net
197
211
237
Inventories
70
89
104
Total Current Liabilities
324
312
309
Payables & Accruals
- -
- -
- -
ST Debt
211
168
143
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
42.2%
5.78%
Free Cash Flow
- -
10.43%
-45.5%
Net Income, GAAP
- -
22.45%
53.05%
Sales/Revenue/Turnover
- -
24.39%
37.13%
Total Cash Common Dividend
- -
78.7%
-75.92%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
82
104
126
120
432
2025
126
154
- -
153
593
2026
162
184
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.06
0.05
0.08
0.08
0.27
2025
0.06
0.08
- -
0.14
0.42
2026
0.07
0.1
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
0.1
0.04
0.01
0.15
2025
- -
0.01
- -
0.02
0.04
2026
- -
0.08
- -
- -
- -
Business
Jiangsu Aisen Semiconductor Material Co., Ltd. engages in the research, development, manufacturing, and sale of specialized electronic chemicals and advanced semiconductor materials. Founded in 2010 and headquartered in Kunshan, Jiangsu Province, China, the company operates across key segments within the integrated circuit fabrication, advanced semiconductor packaging, electronic display, printed circuit board (PCB), and photovoltaic industries. The company provides an extensive portfolio of high-purity process chemicals, organized into two core product lines: electroplating solutions and photoresist systems. Its electroplating products and supporting reagents include electroplating copper additives and electrolyte systems for dual-Damascene processes; ultra-high-purity cobalt sulfate solutions; high-speed and rack/barrel tin and tin-alloy plating chemistries; lead-free solderable coating solutions; degreasing, pickling, and micro-etching pretreatment formulations; and anti-oxidation and post-treatment rinsing agents applied across wafer-level bumping, redistribution layer (RDL), through-silicon via (TSV), lead frame packaging, passive electronic components, and high-density interconnect (HDI) PCBs. Its photoresist and auxiliary chemical portfolio comprises positive and negative photoresists; thick-film negative photoresists engineered for advanced packaging and glass substrate applications; OLED array photoresists; and photolithography wet chemicals including tetramethylammonium hydroxide (TMAH)-based developers, organic strippers, edge bead removers (EBR), and specialized rinsing agents. Jiangsu Aisen Semiconductor Material serves semiconductor foundries, outsourced semiconductor assembly and test (OSAT) providers, display manufacturers, and electronics producers across domestic and international markets, supplying customers such as Semiconductor Manufacturing International Corporation (SMIC), Hua Hong Semiconductor, JCET Group, Tongfu Microelectronics, Huatian Technology, ASE Group, BOE Technology Group, Visionox, and AT&S. In recent developments, the company completed its initial public offering on the Shanghai Stock Exchange Science and Technology Innovation Board (STAR Market) under ticker 688720 in December 2023. Expanding its international operational footprint, the company acquired an 80% equity interest in Malaysia-based Inofine Chemicals Sdn Bhd in late 2024 to strengthen its overseas chemical manufacturing and distribution network across Southeast Asia. In early 2025, the company announced the acquisition of a 70% controlling interest in Binuo (Suzhou) New Material Co., Ltd. to strategically expand into high-purity OLED intermediate and sublimation materials for major display manufacturers. Furthermore, the company has commercialized and scaled mass production for advanced packaging negative photoresists, glass substrate photolithography materials, and advanced-node Damascene plating additives for advanced packaging and sub-28-nanometer fabrication processes.