Sumco Corporation
SUOPY
Other OTC55.94
USD
+0.72
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Sumco Corporation
SUOPY
(Other OTC)
Recent
price
55.94
P/E
ratio
- -
div
yld
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ROIC.AI
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in mil. unless spec.- Similar Companies
- Business
- SUMCO Corporation manufactures and sells silicon wafers for the semiconductor industry worldwide. Established on July 30, 1999, as a joint venture between Mitsubishi Materials Corporation and Sumitomo Metal Industries, the company is headquartered at 1-2-1 Shibaura, Minato-ku, Tokyo 105-8634, Japan, and operates seven production sites primarily in Japan along with sales and support offices in Taiwan, the United States, the United Kingdom, Indonesia, and Singapore. It holds an approximate 19-30% global market share as the world's second-largest silicon wafer producer, serving major semiconductor manufacturers such as TSMC, Intel, Samsung, SK Hynix, and Micron in segments including communication, consumer electronics, automotive, and industrial applications. SUMCO's core products, derived from high-purity monocrystalline silicon ingots produced via CZ, MCZ, or FZ methods up to 300mm diameter, encompass polished wafers (PW) featuring mirror finishes and gettering for impurity capture; annealed wafers (AW) with enhanced crystal perfection through hydrogen or argon high-temperature processing; epitaxial wafers (EW) with monocrystalline silicon vapor phase growth layers; junction isolated wafers (JIW) incorporating embedding layers via photolithography, ion implantation, and thermal diffusion topped with epitaxial layers; silicon-on-insulator (SOI) wafers bonding polished wafers with an oxide insulation layer for high integration, low power, and high reliability, optionally with arsenic or antimony diffusion; and reclaimed polished wafers (RPW) for recycling customer returns. These wafers, available in diameters from 100mm to 300mm with crystal orientations <100>, <111>, or <110> and dopants including boron, phosphorus, antimony, or arsenic, support leading-edge logic, high-bandwidth memory (HBM), and advanced applications with monthly production capacity around 300,000 units. In recent developments, SUMCO has strengthened ties with SK Hynix over the last 2-3 years for significant HBM wafer supply volumes while maintaining strong Samsung relationships, and pursues structural reforms including the Miyazaki plant closure to reallocate resources toward high-growth 300mm leading-edge production amid AI-driven demand. The company reduced capital expenditures to JPY 51.9 billion in H1 FY2025 from prior highs as expansions near completion, invests annually around JPY 30 billion in R&D for next-generation 300mm and 450mm wafers, and reported consolidated net sales of JPY 396.6 billion for FY2024 with 9,850 employees, navigating polarized markets through cost reductions, inventory adjustments, and technology enhancements despite profitability pressures in Q3 2025. SUMCO lists on the Tokyo Stock Exchange Prime Market under code 3436 (OTCPK: SUOPY) and holds certifications including IATF16949 and ISO14001.
SUMCO (OTCMKTS:SUOPY) Short Interest Down 93.6% in December