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    Producer manufacturing

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    Industrial machinery
Chime Ball Technology Co., Ltd.

Chime Ball Technology Co., Ltd.

TTPEX:1595
74.00
TWD
-6.00
(-7.50%)
-1.53EPS
4.54BMarket Cap
Chime Ball Technology Co., Ltd.
TPEX:1595
(Taipei Exchange)

Recent

price

74.00

P/E

ratio

- -

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
TWD
31.98
33.64
30.59
28.01
32.19
26.45
18.73
32.86
37.31
36.86
36.06
51.51
38.24
29.68
19.12
13.23
13.55
Revenue per Share
7.4
8.13
6.21
5.86
7.14
5.11
0.72
7.12
4.18
2.06
0.18
3.93
4.85
1.04
-0.06
-1.95
-1.54
Basic EPS, GAAP
0.56
2.65
2.82
2.57
6.39
- -
6
6.02
-3.34
1.87
1.67
6.52
6.38
-4.16
-1.31
-2.91
-2.41
Free Cash Flow per Basic Share
1.7
2.63
4.04
3.3
3.3
4.24
2.57
1.46
4.01
2.5
1.25
0.5
2
2.03
1
0.5
- -
Dividend per Share
29.06
35.86
37.89
40.62
44.71
45.91
43.84
51.21
51.6
51.03
49.92
53.65
56.5
55.34
53.03
50.43
48.68
Book Value per Share
29.06
35.83
37.83
40.58
44.64
42.84
41.1
39.92
41.14
41.37
41.06
45.56
49.21
48.84
47.63
45.45
44.09
Tangible Book Value per Share
36
38
41
41
41
41
41
42
47
47
47
47
47
47
48
54
54
Basic Weighted Avg Shares
1,149
1,294
1,257
1,151
1,322
1,087
761
1,370
1,756
1,730
1,692
2,417
1,796
1,408
916
716
734
Sales/Revenue/Turnover
32.41
28.44
27.91
25.3
28.48
21.89
17.06
12.79
12.2
7.25
4.43
10.5
7.3
1.92
-6.94
-16.11
-19.81
Operating Margin (%)
8
6
8
20
22
31
41
56
76
80
74
67
65
55
52
53
52
Depreciation Expense
266
313
255
241
293
210
29
297
197
97
9
184
228
49
-3
-106
-83
Net Income, GAAP
21.56
21.77
21.93
23.15
22.05
23.88
42.49
11.25
26.74
6.33
67.98
25.27
29.4
46.75
138.99
- -
- -
Effective Tax Rate (%)
23.13
24.16
20.31
20.91
22.17
19.33
3.84
21.67
11.19
5.58
0.51
7.63
12.67
3.5
-0.29
-14.73
-11.34
Profit Margin (%)
809
1,088
1,113
995
1,138
1,383
1,353
1,643
1,588
1,556
1,411
1,598
1,714
1,632
1,827
1,732
1,517
Working Capital
47
42
180
77
57
265
250
430
310
285
261
207
262
339
326
356
352
LT Debt
1,092
1,473
1,557
1,669
1,837
1,886
1,801
2,387
2,422
2,395
2,343
2,521
2,668
2,648
2,867
2,722
2,693
Total Equity
25.96
18.19
14.74
11.59
11.58
8.22
3.38
5.71
4.96
3.83
0.75
5.72
2.76
0.46
0.7
- -
- -
Return on Invested Capital (%)
24.22
20.4
14.1
12.83
14.84
9.93
1.51
11.42
6.44
3.43
0.36
5.89
7.06
1.58
-0.13
- -
- -
Return on Capital (%)
28.35
24.37
16.85
14.92
16.72
11.29
1.58
14.18
8.18
4.01
0.37
7.59
8.78
1.85
-0.1
-3.78
-3.07
Return on Common Equity (%)

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
114
301
295
LT Borrowings
355
343
349
LT Finance Leases
1
2
3
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
54
54
55
Market Capitalization
2,329
2,164
4,536

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
2,361
2,365
2,449
Cash, Cash Equivalents & STI
946
1,110
1,102
Accounts Receivable, Net
212
210
308
Inventories
1,018
965
951
Total Current Liabilities
629
831
931
Payables & Accruals
- -
- -
- -
ST Debt
114
301
295
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
4.21%
3.18%
-5.05%
Free Cash Flow
-12,206.1%
40.89%
150.52%
Net Income, GAAP
637.44%
1,143.88%
3,851.5%
Sales/Revenue/Turnover
1.34%
-12.24%
-21.77%
Total Cash Common Dividend
18.87%
29.73%
-43.46%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
207
208
262
238
916
2025
209
185
110
212
716
2026
166
246
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.36
-0.19
-0.28
0.04
-0.06
2025
-0.34
-1.06
-0.41
-0.14
-1.95
2026
-0.74
-0.24
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
1
2025
- -
- -
- -
- -
0.5
2026
- -
- -
- -
- -
- -
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Business
Chime Ball Technology Co., Ltd. (1595.TWO) engages in the research, development, production, and sale of specialized exposure equipment primarily for printed circuit boards (PCBs) and semiconductor applications. The company manufactures and offers green energy LED exposure machines including solder-resistant, outer layer, and inner layer UV-LED exposure units; digital direct imaging (DDI) exposure machines with laser light and UV-LED light sources; solder mask exposure machines; fully automated laminating machines; exposure lamps; and UV energy illuminance meters; it also provides CCD auto-alignment semi-automatic and fully-automatic exposure units for PCB and flexible PCB (FPC) production, direct imaging systems such as the Gemini Series for inner and outer layer exposure, and fully-automatic collimated and uncollimated exposure units tailored for solder mask, inner layer, and outer layer processes. In addition, Chime Ball sells, installs, and maintains complete plant equipment transfer solutions for semiconductor process equipment refurbishment and spare parts; supplies mechanical equipment, electronic components, and data software services; conducts international trade; and acts as an investment advisor. Founded in 1988 and headquartered in Taoyuan City, Taiwan, at No. 33, Lane 277, Section 3, Changxing Road, Luzhu District, the company operates through its PCB and semiconductor segments, serving major customers such as large PCB manufacturers including HannStar and Tripod, with a strong market position as the leading provider of semi-automatic exposure machines in Taiwan and mainland China. Geographically, Chime Ball focuses on Taiwan and China markets while pursuing international expansion. Recent developments include a September 2025 announcement to invest NT$115 million in subscribing to 11.5 million new shares of its subsidiary Bao Hong Technology Co., Ltd. at NT$10 per share to support semiconductor equipment growth; ongoing expansion into automation stacking (Sorter) and optical inspection (AOI/AVI) equipment for vertical integration in semiconductor back-end processes; and a cross-border collaboration with France's Synergie CAD to establish IC Burn-In testing R&D amid rising demand for advanced packaging like CoWoS and Foveros. The company maintains subsidiaries like Bao Hong Technology, fully acquired in 2017 for semiconductor refurbishment and upgrades, and continues to innovate with annual patent filings and ISO9001:2008 certification.