Linco Technology Co., Ltd.

Linco Technology Co., Ltd.

TTPEX:3644
570.00
TWD
-15.00
(-2.56%)
29.57BMarket Cap
Linco Technology Co., Ltd.
TPEX:3644
(Taipei Exchange)

Recent

price

570.00

P/E

ratio

- -

div

yld

- -

ROIC.AI

2009
2010
2011
2012
2013
2014
2015
2016
2017
2023
2024
2025
TTM
TWD
- -
- -
- -
- -
- -
- -
- -
- -
- -
9.46
14.55
11.48
- -
Revenue per Share
- -
- -
- -
-0.33
- -
- -
- -
- -
- -
1.91
4.44
1.93
- -
Basic EPS, GAAP
- -
- -
- -
-4.21
- -
5.99
- -
- -
- -
-4.7
1.45
-2.12
- -
Free Cash Flow per Basic Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
0.18
0.41
0.9
- -
Dividend per Share
- -
- -
9.96
9.82
- -
- -
- -
- -
- -
14.23
32.28
30.53
31.49
Book Value per Share
- -
- -
9.94
9.8
- -
- -
- -
- -
- -
14.18
32.22
30.44
31.39
Tangible Book Value per Share
23
27
28
39
43
44
53
53
53
64
75
83
83
Basic Weighted Avg Shares
- -
- -
- -
- -
- -
- -
- -
- -
- -
604
1,091
956
- -
Sales/Revenue/Turnover
- -
- -
- -
- -
- -
- -
- -
- -
- -
19.51
31.18
20.91
- -
Operating Margin (%)
- -
- -
- -
35
- -
- -
- -
- -
- -
45
69
114
- -
Depreciation Expense
- -
- -
- -
-13
- -
- -
- -
- -
- -
122
333
161
- -
Net Income, GAAP
- -
- -
- -
- -
- -
- -
- -
- -
- -
13.66
16.81
16.58
- -
Effective Tax Rate (%)
- -
- -
- -
- -
- -
- -
- -
- -
- -
20.18
30.52
16.8
- -
Profit Margin (%)
- -
- -
40
50
- -
- -
- -
- -
- -
310
1,564
919
694
Working Capital
- -
- -
- -
- -
- -
- -
- -
- -
- -
600
589
400
369
LT Debt
- -
- -
277
438
- -
- -
- -
- -
- -
908
2,420
2,543
2,624
Total Equity
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
13.07
4.81
- -
Return on Invested Capital (%)
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
14.85
5.55
- -
Return on Capital (%)
- -
- -
- -
-3.67
- -
- -
- -
- -
- -
- -
20.01
6.47
- -
Return on Common Equity (%)

Capital Structure

TWD

•

in mil. unless spec.
Jun'16
Dec'16
Jun'26
ST Debt
- -
- -
64
LT Borrowings
- -
- -
313
LT Finance Leases
- -
- -
57
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
53
53
83
Market Capitalization
- -
- -
29,572

Working Capital

TWD

•

in mil. unless spec.
Jun'16
Dec'16
Jun'26
Total Current Assets
- -
- -
2,337
Cash, Cash Equivalents & STI
- -
- -
1,433
Accounts Receivable, Net
- -
- -
137
Inventories
- -
- -
647
Total Current Liabilities
- -
- -
1,642
Payables & Accruals
- -
- -
- -
ST Debt
- -
- -
64
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
- -
5.07%
Free Cash Flow
- -
- -
-261.85%
Net Income, GAAP
- -
- -
-51.76%
Sales/Revenue/Turnover
- -
- -
-12.38%
Total Cash Common Dividend
- -
- -
146.2%

Semi-annual Revenue

TWD

•

in mil. unless spec.

Year

H1
H2
FY
2024
- -
- -
1,091
2025
- -
- -
956
2026
- -
- -
- -

Semi-annual Earnings Per Share

TWD

•

in mil. unless spec.

Year

H1
H2
FY
2024
- -
- -
4.44
2025
- -
- -
1.93
2026
- -
- -
- -

Semi-annual Dividends Per Share

TWD

•

in mil. unless spec.

Year

H1
H2
FY
2024
- -
- -
0.41
2025
- -
- -
0.9
2026
- -
- -
- -
Business
Linco Technology Co., Ltd. is a Taiwan-based semiconductor design company primarily engaged in the research, development, design, and sale of power management ICs, brushless DC motor driver ICs, and discrete power semiconductor devices. The company operates through three principal product categories: Brushless DC (BLDC) Motor Driver and Control ICs, comprising single-phase and three-phase sensorless BLDC motor control system-on-chips (SoCs), integrated pre-drivers, intelligent gate drivers, and embedded microcontrollers optimized for thermal management fans, pump systems, and home appliances; Power Semiconductor Discrete Devices, consisting of low-, medium-, and high-voltage power metal-oxide-semiconductor field-effect transistors (MOSFETs), split-gate trench (SGT) MOSFETs, and super junction MOSFETs utilized in power conversion, load switching, and battery management; and Digital Power Management ICs, including digital pulse-width modulation (PWM) controllers, synchronous rectification controllers, and integrated power modules engineered for high-efficiency AC-DC and DC-DC power supply units. In addition, the company provides magnetic Hall sensor ICs and customized analog-digital mixed-signal application-specific integrated circuits (ASICs) along with full-stack firmware and system-level turnkey solutions. Linco Technology caters to global original equipment manufacturers (OEMs) and original design manufacturers (ODMs) across diverse end markets, including artificial intelligence (AI) and cloud data center servers, telecommunications infrastructure, computing hardware, consumer electronics, white goods, automotive electronics, and industrial automation equipment throughout Taiwan, mainland China, the broader Asia-Pacific region, North America, and Europe. Founded in 2007, Linco Technology Co., Ltd. is headquartered in Zhubei City, Hsinchu County, Taiwan. In recent developments, Linco Technology has strategically accelerated its expansion into high-performance computing (HPC) and AI server thermal architectures, introducing advanced high-voltage three-phase BLDC motor controller ICs and high-power MOSFET solutions specifically engineered for high-static-pressure server cooling fans and liquid cooling coolant distribution units (CDUs). The company has deepened its strategic partnerships with major server thermal solution providers, power supply unit (PSU) manufacturers, and computing ODMs to integrate its high-efficiency digital power ICs into Titanium-grade power architectures. Furthermore, Linco Technology has broadened its automotive-grade semiconductor portfolio with AEC-Q100 certified motor driver ICs and power devices targeting electric vehicle (EV) battery thermal management and auxiliary motor applications, reinforcing its technical capabilities and expanding its market footprint in energy-efficient power electronics.