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    Electronic technology

  3. •

    Semiconductors
3S Silicon Tech., Inc.

3S Silicon Tech., Inc.

TTPEX:5297
73.70
TWD
-3.50
(-4.53%)
3.45BMarket Cap
3S Silicon Tech., Inc.
TPEX:5297
(Taipei Exchange)

Recent

price

73.70

P/E

ratio

- -

div

yld

- -

ROIC.AI

2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
TWD
6.75
10.22
7.37
10.37
11.85
12.07
10.6
8.53
8.19
14.27
10.88
8.76
9.06
- -
Revenue per Share
-2.38
0.69
1.16
0.75
0.26
1.16
0.49
0.06
-0.16
1.78
0.81
1.15
0.41
- -
Basic EPS, GAAP
-0.46
0.91
1.6
1.84
1.22
1.28
0.25
-0.04
2.14
-1.57
0.81
1.91
-0.69
- -
Free Cash Flow per Basic Share
0.41
- -
- -
0.58
0.66
0.21
0.83
0.41
0.25
- -
0.4
0.6
0.9
- -
Dividend per Share
7.4
7.98
9.11
9.28
8.85
9.82
9.49
9.18
8.78
10.35
12.29
12.83
12.34
12.27
Book Value per Share
7.36
7.92
9.09
9.16
8.75
9.73
9.45
9.17
8.7
10.3
12.27
12.81
12.12
12.07
Tangible Book Value per Share
28
28
28
28
28
28
28
28
28
25
29
37
37
37
Basic Weighted Avg Shares
192
289
209
295
337
343
301
242
233
359
320
325
337
- -
Sales/Revenue/Turnover
-37.48
5.99
5.64
9.27
6.51
5.54
4.26
-1.87
-2.18
7.85
7.7
8.24
2.97
- -
Operating Margin (%)
5
5
5
4
16
5
10
9
8
9
9
9
10
- -
Depreciation Expense
-67
19
33
21
7
33
14
2
-5
45
24
43
15
- -
Net Income, GAAP
- -
18.09
4.65
0.22
- -
13.02
25.33
- -
- -
12.38
14.4
19.76
16.92
- -
Effective Tax Rate (%)
-35.18
6.72
15.75
7.26
2.2
9.63
4.67
0.73
-1.99
12.51
7.42
13.13
4.56
- -
Profit Margin (%)
152
194
229
228
223
255
242
247
215
257
426
408
369
370
Working Capital
19
38
29
27
24
22
24
46
31
24
38
8
7
5
LT Debt
210
227
259
264
251
279
269
261
249
294
456
476
458
462
Total Equity
- -
4.72
3.72
8.37
- -
6.99
2.58
- -
- -
4.28
3.85
4.02
1.9
- -
Return on Invested Capital (%)
- -
6.95
11.19
6.8
- -
9.24
4.45
- -
- -
12.9
5.67
8.55
3.13
- -
Return on Capital (%)
- -
8.9
13.59
8.19
2.87
12.46
5.13
0.67
-1.81
16.52
6.32
9.16
3.28
- -
Return on Common Equity (%)

Capital Structure

TWD

•

in mil. unless spec.
Jun'25
Dec'25
Jun'26
ST Debt
49
63
37
LT Borrowings
7
6
5
LT Finance Leases
3
1
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
37
37
38
Market Capitalization
1,429
1,079
3,449

Working Capital

TWD

•

in mil. unless spec.
Jun'25
Dec'25
Jun'26
Total Current Assets
561
566
567
Cash, Cash Equivalents & STI
356
367
286
Accounts Receivable, Net
77
68
110
Inventories
112
103
148
Total Current Liabilities
206
197
197
Payables & Accruals
- -
- -
- -
ST Debt
49
63
37
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
7.1%
13.88%
-3.78%
Free Cash Flow
-659.38%
-1,276.98%
-136.07%
Net Income, GAAP
-136.15%
-292.55%
-64.05%
Sales/Revenue/Turnover
6.98%
8.93%
3.51%
Total Cash Common Dividend
- -
- -
50%

Semi-annual Revenue

TWD

•

in mil. unless spec.

Year

H1
H2
FY
2024
- -
- -
325
2025
- -
- -
337
2026
- -
- -
- -

Semi-annual Earnings Per Share

TWD

•

in mil. unless spec.

Year

H1
H2
FY
2024
- -
- -
1.15
2025
- -
- -
0.41
2026
- -
- -
- -

Semi-annual Dividends Per Share

TWD

•

in mil. unless spec.

Year

H1
H2
FY
2024
- -
- -
0.6
2025
- -
- -
0.9
2026
- -
- -
- -
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Business
3s Silicon Tech., Inc. (5297.TWO) manufactures and sells specialized assembly equipment for discrete power semiconductor devices, including stencil printers; die bonders and clip attach machines; reflow ovens, vacuum reflow ovens, and formic acid vacuum reflow ovens; flux-free solder paste for formic acid processes; and customized automation solutions for power device and module packaging, such as power discrete assembly and open lab platforms for product verification and process optimization. The company serves applications in diodes, power MOSFETs, IGBTs, power GaN, SiC, IPMs, high-power LEDs, and power modules for automotive, industrial, electric vehicle, and AI-driven power supply sectors, with operations spanning Taiwan, Asia, Europe, and the Americas through headquarters in Hsinchu, Taiwan, and branches in Shanghai, Singapore, Philippines, and Malaysia. Founded in 1998 and listed on the Taipei Exchange, 3s Silicon Tech. maintains approximately 96-100 employees and provides technical support, maintenance services, and end-to-end process solutions from solder paste deposition to quality inspection. In September 2025, the company unveiled an AI-empowered formic acid vacuum reflow oven at SEMICON Taiwan, featuring machine learning for predictive process optimization, void rate reduction, yield enhancement, equipment failure prevention up to 99.99%, and flux-free soldering that cuts waste by 99% while supporting sustainability in high-reliability power module packaging for AI and EV applications. This launch builds on its established leadership in vacuum reflow and formic acid technologies, with ongoing collaborations alongside leading IDMs and OSATs, though no major acquisitions, funding rounds, or structural changes have been reported in the last 1-2 years.