Gallant Micro. Machining Co., Ltd. (6640.TWO) manufactures and sells semiconductor process equipment, precision molds, and related components primarily for assembly, packaging, and testing applications; its core products include die picker and bonding machines utilizing precision pick-and-place technology, automatic sealing and punching machines with precision machining, laser marking and optical inspection systems featuring optoelectronic integration, chip sorting machines, saw cutting and forming equipment, lamination heat presses, trim form punching/forming tools, and mold/die set precision molds, alongside wire/jig testing instruments, printed circuit board testing systems, and import/export trading of semiconductor assembly machines. Founded in 2010 and headquartered in New Taipei City, Taiwan, the company operates as a subsidiary of Gallant Precision Machining Co., Ltd. and serves semiconductor manufacturers in Taiwan, China, and international markets. Gallant Micro. Machining maintains strategic alliances, including a recent collaboration with C Sun Mfg. and Gallant Precision Machining to enhance business capabilities in semiconductor equipment supply.