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    Semiconductors
Mars Semiconductor Corp.

Mars Semiconductor Corp.

TTPEX:6708
60.10
TWD
-3.90
(-6.09%)
0.31EPS
128.75P/E
1.16BMarket Cap
Mars Semiconductor Corp.
TPEX:6708
(Taipei Exchange)

Recent

price

60.10

P/E

ratio

128.75

div

yld

- -

ROIC.AI

2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
TWD
11.07
11.26
8.14
8.73
9.18
13.09
12.25
6.74
6.81
9.83
9.33
Revenue per Share
1.4
0.94
0.67
0.3
0.38
1.29
1.31
-1.03
-0.31
0.25
0.31
Basic EPS, GAAP
1.28
1.5
0.68
0.51
0.09
0.3
0.86
-0.08
-0.27
0.43
-1.09
Free Cash Flow per Basic Share
- -
0.3
0.19
0.11
0.07
0.47
0.75
0.9
0.4
- -
- -
Dividend per Share
9.16
9.84
10.47
10.7
10.63
11.4
16.28
14.35
13.39
13.22
13.33
Book Value per Share
8.33
9.36
9.99
10.28
10.13
10.98
16.17
14.32
13.2
12.79
13
Tangible Book Value per Share
22
25
25
26
26
26
26
29
29
29
29
Basic Weighted Avg Shares
241
282
206
223
235
336
314
195
197
281
267
Sales/Revenue/Turnover
12.83
15.74
1.41
5.47
8.05
12.52
5.24
-16.26
-14.33
5.96
3.29
Operating Margin (%)
10
12
11
13
14
13
13
7
7
9
10
Depreciation Expense
30
24
17
8
10
33
33
-30
-9
7
9
Net Income, GAAP
- -
11.68
14.07
27.95
19.06
12.99
17.37
- -
- -
1.85
15.61
Effective Tax Rate (%)
12.62
8.38
8.26
3.38
4.15
9.85
10.66
-15.31
-4.58
2.58
3.34
Profit Margin (%)
214
241
257
261
264
302
479
405
353
341
344
Working Capital
- -
- -
- -
6
22
25
22
7
5
3
3
LT Debt
235
252
268
274
272
292
472
416
388
378
385
Total Equity
- -
11.99
0.66
2.65
4.43
10.01
3.06
- -
- -
2.48
0.22
Return on Invested Capital (%)
- -
7.68
5.26
2.47
3.04
9.4
7.82
- -
- -
1.9
2.34
Return on Capital (%)
- -
9.71
6.55
2.78
3.57
11.75
8.77
-6.73
-2.25
1.89
2.35
Return on Common Equity (%)

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
4
3
4
LT Borrowings
- -
- -
- -
LT Finance Leases
3
2
3
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
29
29
29
Market Capitalization
1,175
1,119
1,158

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
377
379
388
Cash, Cash Equivalents & STI
289
282
252
Accounts Receivable, Net
38
29
45
Inventories
42
57
70
Total Current Liabilities
37
43
44
Payables & Accruals
- -
- -
- -
ST Debt
4
3
4
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
9.58%
-2.71%
Free Cash Flow
- -
51.25%
-258.41%
Net Income, GAAP
- -
-39.73%
-180.15%
Sales/Revenue/Turnover
- -
8.42%
42.33%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
32
59
58
49
197
2025
62
87
71
61
281
2026
52
83
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.25
0.22
-0.23
-0.05
-0.31
2025
0.09
-0.06
0.01
0.2
0.25
2026
-0.2
0.29
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.4
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -
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Business
Mars Semiconductor Corp. (6708.TWO) designs, develops, manufactures, and sells long-distance high-bandwidth wireless audio-visual chips and related products in Taiwan. The company offers wireless system-on-chips (SoCs) for security video network surveillance and recording equipment; wireless car image monitoring and reversing camera systems; wireless home, car, and baby monitors; electronic components; and SaaS one-stop cloud application services integrating PaaS platforms with AI, visualization interfaces, analytics reporting, and proprietary pWiFi wireless protocols for low-latency, long-range transmission supporting up to four simultaneous cameras. Products incorporate advanced compression technologies such as MJPEG, MPEG4, and H.264, targeting consumer applications like surveillance, in-vehicle monitoring, and infant care, as well as industrial Internet of Things (IIoT) sectors including transportation, agriculture, and water conservancy; operations span Taiwan, Hong Kong, North America, and Japan. Founded in 2001 and headquartered in Hsinchu Science Park, Taiwan, Mars Semiconductor established its wireless division in 2007, launched surveillance products adopted by major North American brands in 2010, introduced in-vehicle products for the Japanese market in 2013, formed its cloud division in 2016, and completed an initial public offering on Taiwan's emerging stock market in 2018 before listing on the Taipei Exchange in 2020. Recent developments include ongoing expansion of SaaS cloud services with self-developed chip integration for B2B applications, such as the 2017 Taipei City Hall transfer station project, and sustained focus on pWiFi protocol enhancements for multi-camera, auto-relay transmission in home security and automotive uses as of 2025.