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    Semiconductors
Phoenix Pioneer Technology Co., Ltd.

Phoenix Pioneer Technology Co., Ltd.

TTPEX:6920
90.80
TWD
-0.90
(-0.98%)
20.66BMarket Cap
Phoenix Pioneer Technology Co., Ltd.
TPEX:6920
(Taipei Exchange)

Recent

price

90.80

P/E

ratio

- -

div

yld

- -

ROIC.AI

2019
2020
2021
2022
2023
2024
2025
TTM
TWD
4.77
2.73
8.39
12.5
4.56
7.23
7.33
- -
Revenue per Share
-11.59
-5.38
-3.41
0.45
-3.93
-2.92
-2.34
- -
Basic EPS, GAAP
-12.2
-1.82
-1.77
1.05
-1.43
-0.99
-0.15
- -
Free Cash Flow per Basic Share
- -
- -
- -
- -
- -
- -
- -
- -
Dividend per Share
7.77
5.94
5.54
15.15
11.28
8.38
7.63
7.69
Book Value per Share
7.43
5.64
5.34
15.06
11.27
8.37
7.62
7.68
Tangible Book Value per Share
46
104
116
152
166
166
199
207
Basic Weighted Avg Shares
221
283
974
1,907
758
1,201
1,455
- -
Sales/Revenue/Turnover
-225.25
-193.17
-40.76
4.71
-84.74
-43.96
-25.53
- -
Operating Margin (%)
377
368
389
445
453
442
439
- -
Depreciation Expense
-539
-558
-396
69
-653
-486
-464
- -
Net Income, GAAP
- -
- -
- -
- -
- -
- -
- -
- -
Effective Tax Rate (%)
-243.16
-197.13
-40.65
3.62
-86.19
-40.44
-31.9
- -
Profit Margin (%)
-748
-750
-681
152
503
188
609
672
Working Capital
1,879
1,858
1,560
461
1,285
1,138
1,015
976
LT Debt
1,290
988
920
2,518
1,876
1,393
1,582
1,594
Total Equity
- -
- -
- -
2.27
- -
- -
- -
- -
Return on Invested Capital (%)
- -
- -
- -
3.25
- -
- -
- -
- -
Return on Capital (%)
- -
-49
-41.5
4.01
-29.74
-29.73
-31.2
- -
Return on Common Equity (%)

Capital Structure

TWD

•

in mil. unless spec.
Jun'25
Dec'25
Jun'26
ST Debt
154
168
150
LT Borrowings
645
540
472
LT Finance Leases
479
474
504
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
207
207
207
Market Capitalization
3,098
6,683
20,660

Working Capital

TWD

•

in mil. unless spec.
Jun'25
Dec'25
Jun'26
Total Current Assets
1,166
1,085
1,157
Cash, Cash Equivalents & STI
713
661
538
Accounts Receivable, Net
183
199
330
Inventories
212
174
233
Total Current Liabilities
461
476
484
Payables & Accruals
- -
- -
- -
ST Debt
154
168
150
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
25.83%
13.56%
Free Cash Flow
- -
-106.01%
-81.77%
Net Income, GAAP
- -
-244.61%
-4.46%
Sales/Revenue/Turnover
- -
71.83%
21.11%
Total Cash Common Dividend
- -
- -
- -

Semi-annual Revenue

TWD

•

in mil. unless spec.

Year

H1
H2
FY
2024
- -
- -
1,201
2025
- -
- -
1,455
2026
- -
- -
- -

Semi-annual Earnings Per Share

TWD

•

in mil. unless spec.

Year

H1
H2
FY
2024
- -
- -
-2.92
2025
- -
- -
-2.34
2026
- -
- -
- -

Semi-annual Dividends Per Share

TWD

•

in mil. unless spec.

Year

H1
H2
FY
2024
- -
- -
- -
2025
- -
- -
- -
2026
- -
- -
- -
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Business
Phoenix Pioneer Technology Co., Ltd. (6920.TWO) researches, develops, manufactures, and sells integrated circuit (IC) substrates primarily for semiconductor applications in Taiwan. The company offers core products including FCCSP IC substrates; SiP module substrates; xQFN/routable LF/MIS substrates; FCCSP/FC-LGA substrates; FP-COIL and PLP substrates; Cu stud bumping; COIL substrates; EPS substrates; interposers; and ultra-thin substrates, targeting power management ICs, AI server power chips, vertical wound inductors for CoWoS applications, and advanced packaging solutions such as FOPLP for GaN power devices in electric vehicles and AI sectors. Founded on August 14, 2013, by Chu Ching Hu and headquartered in Hsinchu, Taiwan, the company operates mainly in the semiconductor industry with sales focused on Taiwan, China, and other regions. In recent developments, Phoenix Pioneer leverages its proprietary C2iM technology platform with molding materials for high-end XQFN leadframes, coil substrates, and FOPLP advanced packaging, positioning it as a supplier for third-generation semiconductors amid shifts from mining-related volatility. The company completed a seven-year qualification process with multiple European and U.S. clients, securing mass production orders expected to drive peak quarterly revenue in Q4 2024 and growth in 2025; it also initiated a capital restructuring with a 44% capital reduction followed by an increase to improve finances. Following the passing of founder Hu Chu-ching in July 2024, the board appointed Zhuang Yuan-ping as chairman to lead product repositioning, market strategies, and expansion into automotive and AI power components, with key shareholder and customer Pengcheng Technology (8255) endorsing FOPLP for energy-efficient applications.