Suregiant Technology Co. Ltd.
TTPEX:7669654.00
TWD
-13.00
(-1.95%)
ISIN
TW0007669B14
Return %
Stock
S&P 500
1Y
- -
14.20
3Y
- -
81.12
5Y
- -
68.34
Capital Structure
FRC
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in mil. unless spec.Working Capital
FRC
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in mil. unless spec.Growth Rates
FRC
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in mil. unless spec.Quarterly Revenue
FRC
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
FRC
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in mil. unless spec.Company Description
- CEO
- Yun Bin Yang
- Full Time Employees
- 37
- Sector
- Producer manufacturing
- Industry
- Industrial machinery
- Address
- Taoyuan Taiwan
- Website
- sites.google.com
- Similar Companies
- Business
- Suregiant Technology Co., Ltd. is a Taiwan-based specialty materials company that researches, develops, manufactures, and sells advanced precision coating materials, specialty films, and process consumables for the semiconductor and optoelectronics industries. Founded in 2007 and headquartered in Luzhu District, Taoyuan City, Taiwan, the company primarily serves global top-tier semiconductor foundries, outsourced semiconductor assembly and test (OSAT) providers, and advanced display manufacturers across Taiwan and international markets. Suregiant Technology's core product portfolio comprises advanced packaging release films engineered for high-temperature and high-pressure epoxy molding compound (EMC) processes across 2.5D and 3D architectures, including Chip-on-Wafer-on-Substrate (CoWoS-S, CoWoS-R, and CoWoS-L) and Fan-Out Panel-Level Packaging (FOPLP); wafer-level back grinding (BG) protection tapes featuring cold-release, thermal-release, and ultraviolet (UV) curable peeling mechanisms engineered to safeguard microscopic wafer surface circuits during mechanical thinning; high-precision wafer dicing and sawing tapes; high-grade protective films for flat panel and optical display manufacturing processes; and precision coating formulations. In recent operational developments, Suregiant Technology registered on the Emerging Stock Board of the Taipei Exchange (TPEx) in November 2025 and secured approval for its TPEx mainboard listing in September 2026 under ticker 7669. To fulfill surging demand driven by artificial intelligence accelerators and high-performance computing chip packaging, the company expanded its manufacturing footprint with the completion and operational ramp-up of its second production plant in Taoyuan, substantially increasing total annual capacity to over 54,000 rolls across automated precision coating lines. Furthermore, the company has consolidated its supply chain position by displacing legacy Japanese material incumbents in Tier-1 foundry advanced packaging lines while actively advancing research and development into next-generation hydrolytic and water-soluble adhesive tape solutions for clean wafer processing.