Hermes Testing Solutions Inc.
TTPEX:78563,410.00
TWD
-35.00
(-1.02%)
ISIN
TW0007856007
Return %
Stock
S&P 500
1Y
503.82
14.20
3Y
- -
81.12
5Y
- -
68.34
Capital Structure
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
TWD
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in mil. unless spec.Quarterly Revenue
TWD
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
TWD
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in mil. unless spec.Company Description
- CEO
- Chi Chien Wang
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- Hsinchu Taiwan
- Website
- hermes-testing.com.tw
- Similar Companies
- Business
- Hermes Testing Solutions Inc. is a Taiwan-based semiconductor test interface and engineering solutions company that specializes in the design, development, manufacture, and servicing of high-performance test interface hardware for the global microelectronics industry. The company operates primarily within the semiconductor testing equipment and interface sector, delivering mission-critical solutions across wafer sort testing and final package testing stages. Its comprehensive product and service portfolio includes advanced vertical probe cards (VPC), micro-electromechanical systems (MEMS) probe cards, and cantilever probe cards for wafer-level testing; high-density load boards, burn-in boards, and probe interface motherboards for automated test equipment (ATE); high-precision integrated circuit (IC) test sockets, contactors, and change kits tailored for high-speed, radio frequency (RF), and high-power devices; custom hardware design, signal integrity simulation, and thermal management engineering; and comprehensive probe card maintenance, rebuild, and needle-replacement services. Hermes Testing Solutions primarily serves fabless semiconductor design firms, integrated device manufacturers (IDMs), pure-play wafer foundries, and outsourced semiconductor assembly and test (OSAT) providers across Taiwan, Greater China, Southeast Asia, and North America. Headquartered in Hsinchu County, Taiwan, the company was established as an affiliate within the Hermes-Epitek corporate network to focus on precision test interface technology. In recent developments, Hermes Testing Solutions completed its registration on the Taipei Exchange Emerging Stock Board (TPEx: 7856), advancing its capital market presence and strategic growth initiatives. In response to surging demand from artificial intelligence (AI), high-performance computing (HPC), and automotive electronics applications, the company has expanded its cleanroom manufacturing footprint for ultra-fine-pitch MEMS probe cards, deepened technical partnerships with major foundries and OSAT leaders to co-develop advanced packaging test solutions for 2.5D, 3D, and chiplet architectures, and introduced next-generation high-frequency test interface boards capable of supporting multi-gigahertz data transfer rates.