Raytek Semiconductor, Inc.
TTPEX:7873133.50
TWD
-11.50
(-7.93%)
ISIN
TW0007873002
Return %
Stock
S&P 500
1Y
- -
14.20
3Y
- -
81.12
5Y
- -
68.34
Capital Structure
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in mil. unless spec.Company Description
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- Taipei Taiwan
- Website
- rayteksemi.com
- Similar Companies
- Business
- Raytek Semiconductor, Inc. is a Taiwan-based semiconductor packaging and testing company specializing in wafer-level packaging (WLP) foundry services and advanced microelectronics integration solutions. Founded in 2016 and headquartered in Hsinchu County, Taiwan, the company operates within the semiconductor back-end manufacturing industry, serving fabless design houses, integrated device manufacturers (IDMs), and system vendors across consumer electronics, artificial intelligence (AI) computing, telecommunications, biomedical devices, and automotive sectors. The company offers a systematic suite of middle-to-back-end manufacturing and turnkey packaging services, including wafer bumping processes featuring copper pillar bumping (CuP Bump), lead-free solder bumping, and micro-bumping; wafer-level chip scale packaging (WLCSP) design, assembly, and turnkey integration; redistribution layer (RDL) fabrication, including high-density multi-layer Cu/Ni/Au trace routing; through-silicon via (TSV) reveal processing; backgrinding and backside metallization (BGBM); front-and-back surface metal deposition; and wafer-level optical and electrical testing. In recent corporate developments, Raytek Semiconductor completed its public listing on the Taipei Exchange Emerging Stock Board in May 2026 under the ticker 7873; deepened strategic collaborations with key shareholders and industry partners, including Ardentec Corporation for combined packaging-and-testing turnkey capacity and Fabrinet for outsourced manufacturing collaboration in Thailand; expanded into silicon photonics by co-developing advanced co-packaged optics (CPO) and high-density optoelectronic packaging technologies in collaboration with the Industrial Technology Research Institute (ITRI) and French deep-tech innovator NcodiN; executed a bumping technology transfer agreement with Formosa Advanced Technologies Co., Ltd. (FATC); and integrated AI-driven computer vision inspection systems into its fabrication operations through a smart manufacturing partnership with SixSense to accelerate production ramp-up for next-generation integrated voltage regulators (IVRs) and high-performance computing modules.