SANTA PHOENIX TECHNOLOGY CO LTD

SANTA PHOENIX TECHNOLOGY CO LTD

TTPEX:7880
121.50
TWD
+1.50
(+1.25%)
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Capital Structure

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Working Capital

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Growth Rates

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Semi-annual Revenue

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Semi-annual Dividends Per Share

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Company Description

CEO
Chuan Hua Chou
Full Time Employees
117
Sector
Producer manufacturing
Industry
Industrial machinery
Address
Hsinchu Taiwan
Business
Santa Phoenix Technology Co., Ltd. is a Taiwan-based semiconductor equipment manufacturer specializing in airborne molecular contamination (AMC) control solutions and automated material handling system (AMHS) integration for advanced semiconductor manufacturing processes. Founded in 2005 and headquartered in Hsinchu, Taiwan, the company designs, develops, and delivers precision contamination control and factory automation equipment for wafer fabrication facilities. The company's core product and service portfolio includes automated overhead buffer (OHB) and side track buffer (STB) nitrogen (N2) purge systems; standalone Front Opening Unified Pod (FOUP) and Front Opening Shipping Box (FOSB) purge equipment; automated wafer carrier loading and unloading nitrogen charging systems; ultra-clean Smart N2 Charger systems; automated storage and retrieval system (ASRS) contamination control equipment; 8-inch and 12-inch wafer and photomask carrier electronic rack (e-rack) systems; volatile organic compound (VOC) gas detection and measurement integrated systems; and customized industrial automation design, system integration, parts re-engineering, and on-site maintenance and repair services. Santa Phoenix Technology serves leading semiconductor foundries and memory manufacturers across Taiwan, Japan, and other key semiconductor regions, with its micro-contamination prevention systems deployed in advanced sub-3nm fabrication lines. In recent developments, the company listed its shares on the Taipei Exchange Emerging Stock Board in November 2025 under ticker 7880. To address expanding global demand from semiconductor fabrication expansions, the company is constructing a new manufacturing and research facility in the Dadu District of Taichung, scheduled for completion in late 2026 to serve as its global production and research headquarters. Additionally, the company has broadened its international presence and localized maintenance network through strategic alliance partnerships, supporting semiconductor fabrication facilities across regional manufacturing hubs including Kumamoto and Hiroshima, Japan.