1. Taiwan Stocks

  2. •

    Electronic technology

  3. •

    Electronic components
Allied Circuit Co., Ltd.

Allied Circuit Co., Ltd.

TTPEX:8155
291.50
TWD
-13.50
(-4.43%)
11.51EPS
30.59P/E
23.39BMarket Cap
Nov 05Next Earn
Allied Circuit Co., Ltd.
TPEX:8155
(Taipei Exchange)

Recent

price

291.50

P/E

ratio

30.59

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
TWD
43.35
40.61
39.74
33.4
39.96
29.53
34.51
47.54
51.4
39.97
57.8
57.58
68.33
57.08
71.7
90.4
97.01
Revenue per Share
2.04
2.48
3.43
2.21
2.99
1.79
3.22
6.09
7.26
4.4
10.54
7.74
11.02
4.03
4.69
6.88
12.26
Basic EPS, GAAP
-1.19
2.07
3.39
1.57
1.54
3.86
2.34
2.29
9.63
4.61
10.94
-1.16
9.14
4.92
2.42
-7.3
-3.07
Free Cash Flow per Basic Share
- -
- -
0.18
1.48
1.48
1.99
1.97
2.89
5.43
5.53
3.55
6.91
5.92
7.38
3.64
3.87
- -
Dividend per Share
16.71
18.15
21.49
22.21
25.9
25.97
27.14
30.33
32.16
30.98
37.93
38.76
43.48
41.15
42.63
55.8
61.59
Book Value per Share
16.62
17.96
21.36
22.11
25.85
25.94
27.1
30.32
32.14
30.91
37.86
38.7
43.43
41.04
42.53
55.76
61.51
Tangible Book Value per Share
31
36
40
42
45
52
50
50
50
50
50
50
50
51
50
55
59
Basic Weighted Avg Shares
1,343
1,456
1,576
1,404
1,789
1,529
1,740
2,398
2,592
2,016
2,915
2,904
3,446
2,892
3,616
4,950
5,729
Sales/Revenue/Turnover
6.07
5.58
8.82
6
7.96
6.94
11.38
16.03
17.36
13.29
22.02
15.71
19.13
7.49
6.92
8.07
13.78
Operating Margin (%)
78
84
86
85
85
89
89
86
95
105
100
123
134
154
184
235
269
Depreciation Expense
63
89
136
93
134
93
163
307
366
222
532
390
556
204
236
377
724
Net Income, GAAP
- -
- -
- -
4.86
13.14
18.15
16.45
16.77
19.45
19.08
17.8
17.25
17.82
12.57
10.83
11.04
13.94
Effective Tax Rate (%)
4.71
6.11
8.64
6.62
7.48
6.06
9.34
12.81
14.13
11.02
18.24
13.45
16.13
7.06
6.54
7.61
12.63
Profit Margin (%)
-137
82
306
311
582
524
611
707
788
698
1,027
970
1,197
978
907
2,353
2,221
Working Capital
122
273
277
197
59
20
- -
- -
- -
- -
- -
- -
- -
- -
- -
738
183
LT Debt
543
717
939
971
1,352
1,310
1,369
1,530
1,622
1,562
1,913
1,954
2,258
2,136
2,203
3,231
3,992
Total Equity
8.26
- -
- -
6.45
9.21
6.11
11.47
20.81
21.26
12.27
26.99
16.73
22.12
7.63
9.34
10.93
16.69
Return on Invested Capital (%)
6.88
- -
- -
7.87
10.41
6.71
11.61
20.51
22.48
13.18
28.31
18.13
23.78
8.85
10.6
12.57
18.59
Return on Capital (%)
12.37
14.12
16.45
9.73
11.52
6.97
12.14
21.19
23.24
13.95
30.61
20.19
26.38
9.29
10.9
13.94
22.13
Return on Common Equity (%)

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
132
80
48
LT Borrowings
738
370
183
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
57
61
62
Market Capitalization
9,639
14,475
23,388

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
4,318
4,650
4,845
Cash, Cash Equivalents & STI
1,495
1,661
1,591
Accounts Receivable, Net
1,953
2,099
2,172
Inventories
757
764
952
Total Current Liabilities
1,965
2,036
2,623
Payables & Accruals
- -
- -
- -
ST Debt
132
80
48
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
10.32%
12.43%
46.67%
Free Cash Flow
-116.22%
-304.99%
-426.96%
Net Income, GAAP
31.13%
5.52%
59.34%
Sales/Revenue/Turnover
14.62%
12.83%
36.9%
Total Cash Common Dividend
16.69%
13.99%
15.45%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
704
948
985
978
3,616
2025
1,128
1,224
1,213
1,386
4,950
2026
1,536
1,594
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.74
1.82
0.69
1.43
4.69
2025
1.19
-0.19
2.26
3.4
6.88
2026
3.22
3.32
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
3.64
2025
- -
- -
- -
- -
3.87
2026
- -
- -
- -
- -
- -
Similar Companies
Corning Incorporated (NYSE:GLW)
Taiyo Yuden Co., Ltd. (TSE:6976)
Celestica, Inc. (NYSE:CLS)
Amphenol Corporation (NYSE:APH)
IBIDEN CO., LTD. (TSE:4062)
Vicor Corporation (NASDAQ:VICR)
Business
Allied Circuit Co., Ltd. specializes in the production and distribution of printed circuit boards (PCBs) for industrial and commercial applications across Taiwan and the broader Asian market. The company delivers advanced, rigid-type multi-layer PCBs, ranging from 2 to 72 layers, alongside high-density interconnect (HDI) solutions, which can also reach up to 72 layers, ensuring superior reliability for complex electronic systems. These essential components are integral to a diverse array of products including server platforms—particularly the rapidly expanding AI server segment—networking infrastructure, industrial PCs, and specialized testing equipment such as load boards. Established in April 1995, Allied Circuit is headquartered in Taoyuan City, Taiwan, and is strategically expanding its manufacturing footprint with a new high-layer PCB facility in Vietnam through a joint venture, aiming to bolster its capacity for AI server demand by late 2025.