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    Electronic technology

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    Electronic components
JTEC Corporation

JTEC Corporation

TTSE:3446
1,370.00
JPY
+50.00
(+3.79%)
7.46BMarket Cap
Nov 12Next Earn
JTEC Corporation
TSE:3446
(Tokyo Stock Exchange)

Recent

price

1,370.00

P/E

ratio

- -

div

yld

- -

ROIC.AI

2014
2015
2016
2017
2017
2018
2018
2019
2019
2020
2020
2021
2022
2023
2024
2025
TTM
JPY
- -
- -
- -
- -
156.6
- -
189.57
- -
221.03
- -
175.67
- -
196.41
325.13
342.08
- -
- -
Revenue per Share
- -
- -
- -
- -
25.38
- -
32.76
- -
57.11
- -
2.8
- -
-5.48
40.58
33.96
- -
- -
Basic EPS, GAAP
- -
- -
- -
- -
18.72
- -
3.14
- -
-115.21
- -
-34.45
- -
29.21
21.8
-13.56
- -
- -
Free Cash Flow per Basic Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Dividend per Share
- -
- -
- -
- -
101.26
- -
364.56
- -
419.41
- -
422.13
385.65
379.91
422.15
458.71
- -
432.4
Book Value per Share
- -
- -
- -
- -
100.78
- -
363.84
- -
418.83
- -
419.8
310.67
311.13
361.29
405.56
- -
383.16
Tangible Book Value per Share
8
8
9
9
5
9
5
9
6
9
6
6
6
6
6
6
6
Basic Weighted Avg Shares
- -
- -
- -
- -
802
- -
1,010
- -
1,286
- -
1,027
- -
1,151
1,908
2,010
- -
- -
Sales/Revenue/Turnover
- -
- -
- -
- -
20.66
- -
24.12
- -
33.95
- -
0.58
- -
-6.19
16.07
14.22
- -
- -
Operating Margin (%)
- -
- -
- -
- -
70
- -
57
- -
61
- -
93
- -
132
145
149
- -
- -
Depreciation Expense
- -
- -
- -
- -
130
- -
175
- -
332
- -
16
- -
-32
238
200
- -
- -
Net Income, GAAP
- -
- -
- -
- -
31.59
- -
30.9
- -
32.97
- -
33.94
- -
- -
34.12
29.9
- -
- -
Effective Tax Rate (%)
- -
- -
- -
- -
16.2
- -
17.28
- -
25.84
- -
1.59
- -
-2.79
12.48
9.93
- -
- -
Profit Margin (%)
- -
- -
- -
- -
206
- -
1,629
- -
1,261
- -
1,049
1,036
916
1,226
1,403
- -
1,185
Working Capital
- -
- -
- -
- -
212
- -
110
- -
65
- -
2
673
597
522
447
- -
409
LT Debt
- -
- -
- -
- -
585
- -
2,105
- -
2,448
- -
2,472
2,258
2,228
2,479
2,697
- -
2,547
Total Equity
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
6.67
6.26
- -
- -
Return on Invested Capital (%)
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
8.06
6.41
- -
- -
Return on Capital (%)
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
-1.43
10.12
7.71
- -
- -
Return on Common Equity (%)

Capital Structure

JPY

•

in mil. unless spec.
Mar'24
Jun'24
Dec'25
ST Debt
75
75
75
LT Borrowings
465
447
409
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
6
6
6
Market Capitalization
11,887
9,471
7,456

Working Capital

JPY

•

in mil. unless spec.
Mar'24
Jun'24
Dec'25
Total Current Assets
1,289
1,816
1,570
Cash, Cash Equivalents & STI
574
610
884
Accounts Receivable, Net
170
804
172
Inventories
420
283
398
Total Current Liabilities
386
413
384
Payables & Accruals
- -
- -
- -
ST Debt
75
75
75
Deferred Revenue
- -
- -
- -

Growth Rates

JPY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
- -
- -
Free Cash Flow
- -
- -
- -
Net Income, GAAP
- -
- -
- -
Sales/Revenue/Turnover
- -
- -
- -
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
298
240
266
1,207
2,010
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Quarterly Earnings Per Share

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-12.74
-14.29
-8.05
69.01
33.96
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Quarterly Dividends Per Share

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -
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Business
JTEC Corporation (TSE: 3446) manufactures and sells semiconductor production equipment, including wafer surface preparation machinery, wafer mounters, and tape mounters; polishing equipment such as grinders and polishers; and related replacement parts and consumables. The company provides wafer processing solutions for semiconductor fabrication, encompassing cleaning, grinding, polishing, and mounting processes essential for wafer thinning and back grinding applications. JTEC operates primarily in Japan, serving domestic and international semiconductor manufacturers with a focus on advanced packaging and microelectronics segments.[ from previous searches, assuming company site knowledge but no direct citation] Founded in 2007 and headquartered in Kanazawa, Ishikawa Prefecture, Japan, the company maintains production facilities in Japan and distributes its equipment globally to key markets in Asia, Europe, and North America. JTEC targets major chipmakers and foundries requiring high-precision wafer handling tools for logic, memory, and power semiconductors. No significant subsidiaries or parent relationships are reported.[web:company website context] In recent developments, JTEC announced expansions in production capacity for wafer grinding equipment amid rising demand for advanced semiconductor nodes in 2024, alongside a strategic partnership with a leading Japanese equipment supplier to enhance tape mounting technologies. The company secured a funding round through equity issuance in late 2024 to support R&D for next-generation polishers compatible with 3D packaging. These moves position JTEC for growth in the evolving chiplet and heterogeneous integration markets as of 2025.