Inspec Inc. (TSE: 6656) manufactures and sells visual inspection equipment, direct imaging systems, and related software for semiconductors and electronic substrates. The company develops automated optical inspection (AOI) and automated visual inspection (AVI) systems for IC package substrates with line/space specifications from 1.5μm/1.5μm; roll-to-roll AOI/AVI, verification machines, punch/marking machines for flexible printed circuits (FPC) and chip-on-film (COF); glass mask AOI; lead frame inspection machines; in-line chip capacitor inspection machines; laser repair systems; and AI-based defect classification software and analysis tools. It operates primarily in Japan with headquarters in Semboku-shi, Akita, founded in January 1984, and maintains offices in Tokyo, a Nagano support center, a Suzhou support center in China, and a subsidiary, Inspec Taiwan Inc., in Taoyuan City, Taiwan. In response to AI-driven demands for chiplet integration and finer wiring, Inspec launched the next-generation SX7000 series AOI systems, including the SX7400 (1.5μm/1.5μm) and SX7300 (2μm/2μm) models for substrates up to 615mm x 515mm, alongside the LX7000 laser repair system (2μm/2μm), with orders accepted as of 2025.