1. Taiwan Stocks

  2. •

    Electronic technology

  3. •

    Electronic components
WUS Printed Circuit Co. Ltd.

WUS Printed Circuit Co. Ltd.

TTWSE:2316
150.00
TWD
-8.00
(-5.06%)
14.31EPS
15.17P/E
39.37BMarket Cap
WUS Printed Circuit Co. Ltd.
TWSE:2316
(Taiwan Stock Exchange)

Recent

price

150.00

P/E

ratio

15.17

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
TWD
25.1
28.42
26.79
23.92
28.53
24.18
21.4
25.18
27.4
23.59
24.68
29.49
28.29
19.38
18.36
20.61
23.42
Revenue per Share
1.24
1.62
1.44
1.07
1.42
18.55
0.21
-0.04
1.49
2.55
2.14
2.94
2.81
4.61
4.28
13.38
14.31
Basic EPS, GAAP
0.26
1.54
-0.12
0.95
1.86
1.85
1.31
-3.57
-2.44
-0.69
0.07
-5.35
0.87
-1.18
-0.85
-1.69
-6.13
Free Cash Flow per Basic Share
- -
- -
- -
0.25
0.99
1.88
5.52
- -
- -
1.04
0.52
1.5
1
0.5
0.5
0.5
- -
Dividend per Share
18.31
20.36
21.68
23.69
24.67
40.92
34.64
39.06
39.74
40.02
40.51
42.33
44.33
48.97
54.59
69.31
79.55
Book Value per Share
18.17
20.36
21.67
23.69
24.67
40.92
34.64
39.06
39.62
39.97
40.49
42.33
44.32
48.96
54.59
69.3
79.54
Tangible Book Value per Share
308
275
262
257
257
255
229
213
202
216
194
181
181
181
181
181
181
Basic Weighted Avg Shares
7,725
7,821
7,014
6,137
7,330
6,162
4,900
5,377
5,524
5,094
4,785
5,350
5,133
3,516
3,332
3,740
4,249
Sales/Revenue/Turnover
0.24
1.21
1.04
1.92
4.59
3.28
1.18
-0.72
-1.49
-1.79
-4.33
0.17
-4.81
-18.76
-16.43
-13.22
-11.14
Operating Margin (%)
440
412
382
355
350
344
337
333
342
364
351
347
369
369
376
404
408
Depreciation Expense
381
446
378
274
364
4,728
47
-8
301
550
414
534
511
836
777
2,427
2,595
Net Income, GAAP
9.89
10.22
10.76
17.48
13.17
22.04
- -
208.58
35.77
15.18
- -
17.95
21.25
31.23
24.89
24.44
21.88
Effective Tax Rate (%)
4.93
5.7
5.39
4.47
4.97
76.73
0.96
-0.16
5.44
10.8
8.65
9.97
9.95
23.77
23.33
64.89
61.09
Profit Margin (%)
1,575
1,569
1,895
1,547
2,590
8,499
6,124
5,250
5,351
4,794
2,736
2,306
2,548
2,314
2,493
3,931
4,303
Working Capital
479
774
1,317
850
1,552
1,134
1,284
1,672
1,904
2,195
2,009
2,002
1,732
1,624
1,826
1,685
1,750
LT Debt
5,637
5,725
5,568
6,088
6,378
10,219
7,884
7,086
7,209
7,261
7,351
7,680
8,042
8,885
9,905
12,576
14,433
Total Equity
0.69
1.08
0.57
1.18
3.38
1.5
- -
0.42
-0.54
-0.79
- -
0.07
-1.74
-3.84
-3.33
-2.61
-2.36
Return on Invested Capital (%)
5.29
5.95
5.11
3.65
4.6
45.15
- -
-0.37
3.3
5.91
- -
5.2
4.83
7.43
6.49
17.46
16.98
Return on Capital (%)
6.79
7.85
6.69
4.71
5.84
56.97
0.52
-0.11
4.2
7.61
5.67
7.1
6.49
9.87
8.27
21.59
21.02
Return on Common Equity (%)

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
1,096
1,521
1,375
LT Borrowings
1,633
1,341
1,607
LT Finance Leases
52
149
143
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
181
181
181
Market Capitalization
18,688
17,654
39,371

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
6,806
7,528
7,733
Cash, Cash Equivalents & STI
4,556
4,917
4,975
Accounts Receivable, Net
1,089
1,172
1,153
Inventories
862
1,163
1,316
Total Current Liabilities
2,875
3,322
3,430
Payables & Accruals
- -
- -
- -
ST Debt
1,096
1,521
1,375
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
2.88%
11.62%
26.96%
Free Cash Flow
-813.02%
-1,505.19%
98.95%
Net Income, GAAP
-356.45%
58.7%
212.25%
Sales/Revenue/Turnover
-3.86%
-3.35%
12.25%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
809
744
856
923
3,332
2025
871
774
974
1,121
3,740
2026
1,022
1,132
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.99
0.97
1.04
1.28
4.28
2025
1.46
4.15
5.19
2.57
13.38
2026
3.53
3.02
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.5
2025
- -
- -
- -
- -
0.5
2026
- -
- -
- -
- -
- -
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Business
WUS Printed Circuit Co., Ltd. is a leading manufacturer, processor, assembler, and seller of high-end printed circuit boards (PCBs), specializing in double-sided, multi-layer, high-density interconnect (HDI), backplanes, line cards, power amplifiers, antennas, heavy copper, and hybrid PCB products. The company serves key sectors including automotive electronics, telecommunications infrastructure, data communication, intelligent automotive applications, industrial automation, and consumer electronics. Its technology offerings span 2 to 64-layer PCBs with advanced features such as mechanical blind holes, buried vias, back drilling, high-frequency materials like Teflon and ceramics, and thick copper cladding. WUS provides solutions for power control systems, 5G base stations, AI servers, smart cars, factory automation, and more. Founded in 1992 and headquartered in Kunshan, China, WUS Printed Circuit Co., Ltd. has developed a dominant competitive position in the China and global PCB markets, particularly leading in multi-layer PCB sales. The company is listed on the Shenzhen Stock Exchange and has recently filed for a secondary listing on the Hong Kong Stock Exchange to support expansion efforts. Recent strategic developments include significant revenue growth, with a 57% increase in the first half of 2025 and 49% profit growth driven by its focus on AI server and smart car PCB markets. WUS is actively expanding capacity with plans to increase production facilities in Thailand and scout new locations outside China. Additionally, its subsidiary acquired a new production plant for 95 million yuan in late 2025 to boost manufacturing capabilities. The company continues to innovate with new product launches and maintain enviable gross margins by targeting the higher-end PCB market segment. WUS operates through subsidiaries including WUS Printed Circuit (Kunshan) Co., Ltd. and maintains a diverse product portfolio targeting high-speed data communication, automotive electrification, intelligent vehicle systems, and telecommunications infrastructure across Asia and global markets. Its sustained technological advancements and strategic capital investments underscore its positioning as a key global provider of advanced PCB solutions. The company leverages substantial R&D capabilities for the development of multi-material and mixed-pressure PCB technologies, reinforcing its leadership in the industry. Overall, WUS Printed Circuit Co., Ltd. integrates comprehensive PCB manufacturing technologies with strong market demand in AI, telecommunications, and automotive sectors to sustain rapid revenue and profit growth, supported by strategic geographic and capacity expansions in China and abroad.