- Business
- Lingsen Precision Industries, Ltd. (2369.TW) provides integrated circuit packaging and testing services for semiconductors, including assembly, reliability testing, failure analysis, package characterization, and wafer/final test processes. The company manufactures and packages a range of products such as SOP, SSOP, TSOP, TSSOP, PLCC, QFP, TQFP, LQFP, LFBGA, LFLGA, TQFN, VQFN, VSON, UQFN, USON, and others across Dual Family, Quad Family, Under Lead Family, Optics Family, Discrete Family, and MEMS categories; it serves consumer electronics, automotive, memory, communications, power management, sensors, and optoelectronics sectors. Lingsen operates production facilities in Taiwan and historically in China, with global customers in Taiwan, the rest of Asia, Europe, the Americas, and Africa.
Founded in 1970 as a joint venture between Mitsubishi Electric Corp. and Dahsen Electronic Industries, Ltd. in Taipei, Taiwan, the company relocated to the Taichung Export Processing Zone in 1973 and reorganized as an independent assembly house; it maintains headquarters at No. 5-1, South 2nd Road, Tanzi District, Taichung, Taiwan, with approximately 2,083 employees.
In a significant operational change, Lingsen sold its China-based subsidiary Ningbo Liyuan Technology in early 2024 to Zhejiang Yin'an Enterprise Management Co., Ltd., streamlining its focus on core Taiwanese operations amid shifting semiconductor supply chains. The company reported consolidated revenue of NT$5.37 billion for 2024, reflecting ongoing adaptations in IC packaging demand, and participated in supply chain sustainability collaborations, such as Winbond's low-carbon transformation project in 2023. Lingsen continues to emphasize capacity expansion and technology development for 5G, IoT, AI, sensors, and RF ICs to meet evolving market needs.