- Business
- Greatek Electronics Inc. (2441.TW) provides integrated circuit packaging and testing services worldwide. The company offers leadframe-based packages including P-DIP; SOP, SOJ, SSOP, TSSOP, MSOP; QFP, LQFP, TQFP, PLCC; TO, SOT; QFN/DFN; flip chip QFN/DFN/SOP/TSOT; wafer bumping; wafer level CSP; BGA/LGA; flip chip CSP; stacked die packages; MCM; copper wire bonding; and system in package, alongside wafer probing, final testing for logic, mixed-mode, and analog devices; testing program development; platform conversion; device correlation; engineering support; package design for electrical and thermal characterization; and metal plating on semiconductor lead frames. Greatek operates multiple plants in Miaoli County, Taiwan, serving customers in Taiwan, Asia, America, Europe, and Africa. Founded in 1983 as He Teh Integrated Circuit Co. Ltd. and renamed Greatek Electronics Inc., the company is headquartered at No. 136, Gong-Yi Rd., Zhunan Township, Miaoli County, Taiwan, with Powertech Technology Inc. as its major shareholder; it listed on the Taiwan Stock Exchange in 2000 and employs approximately 4,211 people.
In 2024, Greatek reported consolidated revenue of NT$15.21 billion, up 12.1% from 2023, with net profit after tax of NT$2.496 billion, up 25%, and earnings per share of NT$4.39. The company advanced R&D with developments in Tri-Temp Test capability; 2.5mil copper wire; thin package BGA (0.6mm thickness); QFN packages ≥14x14mm; and invested NT$289 million in R&D, or 1.9% of revenue, while capital expenditures reached NT$1.79 billion to expand packaging, testing, and wafer-level packaging capacity. For 2025, Greatek plans key initiatives including enhanced packaging for third-generation semiconductors (GaN/SiC) with high-thermal packages (epoxy/2.0mil Cu); flip chip on thick copper substrate; wire bonding QFN ≥500 wires; 2.5mil copper wire; AI product aesthetics; power TOLT packages; and aluminum wire for power devices, alongside AI-driven automation, process improvements, and customer expansion. In June 2024, President Louis Ning transitioned leadership to Y.C. Chi under the President Inheritance Plan, with Mr. Ning remaining as advisor.