1. Taiwan Stocks

  2. •

    Producer manufacturing

  3. •

    Industrial machinery
Shen Mao Technology Inc.

Shen Mao Technology Inc.

TTWSE:3305
105.00
TWD
-7.00
(-6.25%)
5.51EPS
24.59P/E
19.51BMarket Cap
Nov 10Next Earn
Shen Mao Technology Inc.
TWSE:3305
(Taiwan Stock Exchange)

Recent

price

105.00

P/E

ratio

24.59

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
TWD
70.06
77.47
60.17
49.8
47.62
39.29
41.25
44.71
46.1
44.18
44.82
66.48
64.03
46.39
62.16
80.21
100.38
Revenue per Share
3.76
4.39
2.99
3
2.52
0.94
2.11
0.77
0.35
1.43
1.51
4.92
4.04
1.74
3.1
3.16
5.65
Basic EPS, GAAP
-7.85
4.94
10.29
6.71
-1.56
5.07
-7.07
-1.73
2.68
0.75
-1.84
-7.01
10.7
4.7
-8.48
-7.78
-14.14
Free Cash Flow per Basic Share
1.88
1.8
2.82
1.82
1.96
2.02
1.07
2.38
1.03
1.03
1
1.42
2.5
2
2
2.19
- -
Dividend per Share
26.89
31.2
30.71
32.57
34.8
33.58
33.66
31.05
30.16
30.05
31.03
33.48
35.73
35.82
37.56
40.68
43.16
Book Value per Share
26.67
31.14
30.66
32.53
34.77
33.56
33.65
31.04
30.15
30.04
31.03
33.48
35.73
35.82
37.54
37.01
39.58
Tangible Book Value per Share
106
117
118
118
121
120
116
118
118
118
118
124
131
132
132
132
137
Basic Weighted Avg Shares
7,396
9,085
7,090
5,868
5,775
4,733
4,805
5,256
5,452
5,225
5,281
8,272
8,419
6,119
8,211
10,621
13,762
Sales/Revenue/Turnover
7.31
6.87
7.74
8.33
7.28
4.29
7.81
3.62
2.07
4.07
5.25
10.66
4.9
6.22
7.02
7.47
11.73
Operating Margin (%)
97
88
85
77
75
71
72
75
76
72
68
68
73
78
80
115
122
Depreciation Expense
397
514
353
354
306
113
246
91
42
169
178
612
531
230
409
418
775
Net Income, GAAP
19.81
26.56
23.68
30.48
30.84
38.74
33.82
47.87
72.19
30.24
30.65
30.96
21.47
38.69
33.72
37.14
34.61
Effective Tax Rate (%)
5.37
5.66
4.98
6.03
5.3
2.38
5.13
1.73
0.77
3.24
3.38
7.4
6.31
3.75
4.98
3.94
5.63
Profit Margin (%)
2,716
3,553
3,539
3,149
3,442
3,178
2,876
2,587
2,461
2,125
2,383
2,599
2,593
3,052
2,577
3,856
4,147
Working Capital
300
376
383
- -
278
365
534
505
421
487
863
326
239
757
5
989
861
LT Debt
3,017
3,726
3,667
3,890
4,247
4,023
3,957
3,752
3,641
3,564
3,671
4,440
4,721
4,734
4,981
5,690
6,081
Total Equity
9.23
8.37
7.4
6.36
5.01
2.09
4.36
1.65
0.57
2.5
3.28
8.77
4.22
3.18
4.61
4.03
6.92
Return on Invested Capital (%)
9.45
10.4
7
7.03
5.53
2.16
4.44
1.74
0.81
3.17
3.33
9.27
7.73
3.56
5.6
4.81
7.43
Return on Capital (%)
13.57
15.29
9.55
9.37
7.52
2.74
6.25
2.41
1.16
4.75
4.95
15.17
11.65
4.88
8.46
7.87
14.84
Return on Common Equity (%)

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
4,875
6,526
6,556
LT Borrowings
974
861
848
LT Finance Leases
15
13
13
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
139
140
140
Market Capitalization
14,425
15,012
19,514

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
9,225
11,522
11,710
Cash, Cash Equivalents & STI
2,200
2,757
2,552
Accounts Receivable, Net
4,124
4,967
5,262
Inventories
2,440
3,326
3,499
Total Current Liabilities
5,369
7,349
7,564
Payables & Accruals
- -
- -
- -
ST Debt
4,875
6,526
6,556
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
3.81%
9.4%
14.23%
Free Cash Flow
-128.49%
-60.61%
-8.04%
Net Income, GAAP
56.4%
50.74%
2.24%
Sales/Revenue/Turnover
10.62%
18.93%
29.36%
Total Cash Common Dividend
- -
25.17%
10%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1,511
2,026
2,367
2,306
8,211
2025
2,317
2,503
2,872
2,930
10,621
2026
3,765
4,196
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.81
0.84
0.95
0.5
3.1
2025
1.22
0.16
1.19
0.6
3.16
2026
1.73
2.12
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
2
2025
- -
- -
- -
- -
2.19
2026
- -
- -
- -
- -
- -
Similar Companies
Applied Materials, Inc. (NASDAQ:AMAT)
Oklo Inc. (NYSE:OKLO)
Lam Research Corporation (NASDAQ:LRCX)
Tokyo Electron Ltd. (TSE:8035)
Welspun Corp Limited (NSE:WELCORP)
Symbotic Inc. (NASDAQ:SYM)
Business
Shenmao Technology Inc. delivers a comprehensive array of soldering solutions across Taiwan, Mainland China, Thailand, Malaysia, and numerous international markets, including Asia, Europe, and the Americas. The company specializes in advanced materials for electronics assembly, encompassing SMT assembly products like various solder pastes—including lead-free, water-soluble, package-on-package, low-temperature, and halogen-free formulations—along with specialized adhesives. For semiconductor packaging, Shenmao provides critical components such as BGA spheres, bumping solder pastes, and wafer-level packaging solder solutions. Additionally, their offerings for wave soldering assembly include diverse solder bars, flux-cored solder wires, liquid fluxes, solder preforms, and PV ribbons. Serving a broad clientele, Shenmao's materials are integral to manufacturers of electronic computers, network communication systems, consumer electronics, printed circuit boards, passive components, and advanced semiconductor packaging, extending to high-reliability sectors such as server boards, medical devices, military equipment, and satellite communications. Founded in 1973 and headquartered in Taoyuan, Taiwan, the company brings over five decades of expertise to the solder material industry. Recent strategic moves include the 2025 acquisition of Profound Material Technology Co., Ltd. (PMTC), significantly enhancing its capabilities in high-performance solder balls for advanced semiconductor and IC packaging. Shenmao Technology Inc. also actively engages in research and development, focusing on sustainable, eco-friendly, and nanotechnology-based solder materials.