- Business
- ASMPT Limited (0522.HK), headquartered in Singapore and founded in 1975, serves as a leading global supplier of hardware and software solutions for semiconductor assembly and packaging as well as surface mount technology (SMT) industries. The company designs, manufactures and markets advanced equipment including thermo-compression bonders such as FIREBIRD TCB and MEGA for heterogeneous integration and multi-chip packaging; laser dicing systems like ALSI LASER1206; placement platforms including SIPLACE V, SIPLACE CA2 and solutions for large BGAs; LITHOBOLT for die-to-wafer hybrid bonding; AMICRA NANO die bonder for co-packaged optics; wafer deposition tools; inspection, storage and software solutions; plus intelligent intralogistics and IoT data platforms for optimized manufacturing processes. ASMPT operates internationally across electronics, mobile communications, computing, automotive, industrial and LED display markets, with a focus on high-productivity, reliable systems driven by continuous R&D investment.
In recent developments, ASMPT secures new orders for nineteen chip-to-substrate thermo-compression bonding (TCB) tools targeting the AI chip market, reflecting strong demand in advanced packaging; announces robust 2025 third quarter results fueled by AI momentum; appoints Gordon Lam as Chief Commercial Officer for SEMI Solutions; launches SIPLACE V placement platform and ALSI LASER1206 for AI and smart mobility; commits to the Science Based Targets initiative (SBTi) for science-based climate action; and discontinues its materials business in 2020 while closing ASMPT Equipment (Shenzhen) in 2025. The company, listed on the Hong Kong Stock Exchange, maintains constituent status in indices including Hang Seng TECH, Composite MidCap and Corporate Sustainability Benchmark.