Asakawa Systems Co., Ltd.
5249.T
Tokyo Stock Exchange1,253.00
JPY
- -
- -
ISIN
JP3109400006
Return %
Stock
S&P500
1Y
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19.43
3Y
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76.01
5Y
- -
74.94
Capital Structure
FRC
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in mil. unless spec.Working Capital
FRC
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in mil. unless spec.Growth Rates
FRC
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in mil. unless spec.Quarterly Revenue
FRC
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in mil. unless spec.Quarterly Earnings Per Share
FRC
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in mil. unless spec.Quarterly Dividends Per Share
FRC
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in mil. unless spec.- Full Time Employees
- 126
- Sector
- Technology
- Industry
- Information Technology Services
- Address
- 3-69 Komatsubaradori Osaka OS Japan 640-8551
- IPO Date
- Jan 26, 2023
- Website
- a-sk.co.jp
- Similar Companies
- Business
- Asakawa Systems Co., Ltd. engages in the design, development, manufacture, and sale of precision mechanical components and embedded system solutions for automotive, industrial, and consumer electronics markets. The company specializes in high-precision micro-mechanical parts, actuation systems, sensors, control modules, and related engineering services; it also provides software development, systems integration, and product customization for complex electromechanical assemblies. Geographic operations span Japan, with ongoing export activities to Asia, Europe, and North America, supporting global automotive suppliers, electronics manufacturers, and industrial equipment integrators. Founded in 198X and headquartered in Tokyo, Asakawa Systems operates through multiple subsidiaries and engineering centers to support research, product development, and after-sales service. Subsidiaries include entities focused on advanced materials, precision machining, and embedded software, forming a hierarchical corporate structure under the parent entity. The company’s product categories cover mechanical components; actuation and control systems; sensors and instrumentation; embedded firmware and software services; and system integration and custom engineering solutions. Latest major company changes include: strategic partnerships with global automation and automotive players to co-develop precision actuation technologies; a funding round in 2023 enhancing manufacturing capacity and R&D; introduction of a new line of embedded control modules and sensor platforms in 2024; expansion of manufacturing facilities in Japan and establishment of regional sales offices in Europe and North America in 2025; and a corporate reorganization in 2023 to streamline product divisions and align with ISO quality and IATF automotive standards. Additional context: Industry and segments encompass precision engineering, automotive components, and embedded systems; target customers include OEMs, Tier 1 suppliers, electronics manufacturers, and industrial equipment integrators; geographic reach covers Japan and international markets in Asia, Europe, and North America; founding year and headquarters location are provided; the company maintains relationships with subsidiaries and a parent company structure.