Applied Materials, Inc.

Applied Materials, Inc.

AMAT.TO
Applied Materials, Inc.CA flagToronto Stock Exchange
50.54
CAD
+0.27
- -
40.11BMarket Cap
Applied Materials, Inc.
AMAT.TO
(Toronto Stock Exchange)

Recent

price

50.54

P/E

ratio

- -

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
0.57
0.64
0.56
0.5
0.6
0.64
0.79
1.1
1.33
1.26
1.51
2.04
2.39
2.55
2.65
2.84
3.13
Revenue per Share
0.06
0.12
0.01
0.02
0.07
0.09
0.13
0.26
0.24
0.23
0.32
0.52
0.6
0.66
0.7
0.7
0.94
Basic EPS, GAAP
0.1
0.15
0.12
0.04
0.12
0.08
0.19
0.28
0.3
0.28
0.33
0.48
0.5
0.84
0.85
0.8
0.85
Free Cash Flow per Basic Share
0.02
0.02
0.03
0.03
0.03
0.03
0.03
0.03
0.05
0.07
0.07
0.07
0.08
0.09
0.12
0.14
0.15
Dividend per Share
5.67
6.74
6.04
5.89
6.44
6.56
6.69
8.82
7.08
8.97
11.57
13.73
14.45
19.63
23.23
25.74
32.29
Book Value per Share
4.45
5.55
1.97
2.24
2.96
3.06
3.09
5.25
3.38
5.09
7.61
9.71
9.66
14.79
18.36
20.78
27.01
Tangible Book Value per Share
16,619
16,359
15,702
14,908
15,069
15,057
13,730
13,308
12,564
11,621
11,361
11,286
10,803
10,418
10,257
9,972
9,845
Basic Weighted Avg Shares
9,549
10,517
8,719
7,509
9,072
9,659
10,825
14,698
16,705
14,608
17,202
23,063
25,785
26,517
27,176
28,368
30,837
Sales/Revenue/Turnover
17.07
22.26
11.47
10.39
16.42
16.61
19.88
26.78
26.88
22.93
25.37
31.22
30.19
28.86
28.95
29.86
31.09
Operating Margin (%)
305
246
422
410
375
371
389
407
457
363
376
394
444
515
392
435
527
Depreciation Expense
938
1,926
109
256
1,072
1,377
1,721
3,519
3,038
2,706
3,619
5,888
6,525
6,856
7,177
6,998
9,267
Net Income, GAAP
32.37
19.01
65.51
26.86
25.97
13.83
14.51
7.78
30.89
17.22
13.13
13.04
14.13
11.15
11.96
24.52
13.61
Effective Tax Rate (%)
9.82
18.31
1.25
3.41
11.82
14.26
15.9
23.94
18.19
18.52
21.04
25.53
25.31
25.86
26.41
24.67
30.05
Profit Margin (%)
3,877
7,561
2,837
3,199
4,144
5,463
4,721
8,803
6,682
5,759
8,910
9,763
8,546
11,775
12,752
12,882
14,738
Working Capital
204
1,947
1,946
1,946
1,947
3,342
3,125
5,304
5,309
4,713
5,643
5,680
5,744
5,713
5,719
6,859
5,927
LT Debt
7,536
8,800
7,235
7,088
7,868
7,613
7,217
9,349
6,845
8,214
10,578
12,247
12,194
16,349
19,001
20,415
25,626
Total Equity
14.39
20.24
3.47
6.25
11.6
12.44
16.06
28.53
22.85
21.26
25.09
35.53
36.06
33.22
28.42
23.68
27.74
Return on Invested Capital (%)
12.66
21.35
1.42
3.57
12.12
13.34
16.33
29.38
23.87
22.6
25.68
35.54
37.31
35.01
30.84
27.14
32.39
Return on Capital (%)
12.82
23.58
1.36
3.57
14.34
17.79
23.21
42.48
37.52
35.94
38.52
51.59
53.39
48.04
40.61
35.51
41.07
Return on Common Equity (%)

Capital Structure

FRC

in mil. unless spec.
Jan'26
Apr'26
Jul'26
ST Debt
201
1,313
1,419
LT Borrowings
6,453
5,256
5,245
LT Finance Leases
536
699
682
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
794
794
794
Market Capitalization
21,055
25,724
31,818

Working Capital

FRC

in mil. unless spec.
Jan'26
Apr'26
Jul'26
Total Current Assets
21,049
22,571
25,095
Cash, Cash Equivalents & STI
8,511
8,241
9,233
Accounts Receivable, Net
4,977
6,372
7,691
Inventories
5,997
6,343
6,564
Total Current Liabilities
7,753
8,998
10,357
Payables & Accruals
4,314
4,126
4,353
ST Debt
201
1,313
1,419
Deferred Revenue
2,472
2,570
3,271

Growth Rates

FRC

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
11.94%
14.62%
7.44%
Free Cash Flow
26.6%
18.97%
-8.29%
Net Income, GAAP
21.94%
16.16%
-2.49%
Sales/Revenue/Turnover
12.23%
11.12%
4.39%
Total Cash Common Dividend
11.9%
12.14%
16.11%

Quarterly Revenue

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
6,707
6,646
6,778
7,045
27,176
2025
7,166
7,100
7,302
6,800
28,368
2026
7,012
7,910
9,115
- -
- -

Quarterly Earnings Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.2
0.17
0.17
0.17
0.7
2025
0.12
0.21
0.18
0.19
0.7
2026
0.21
0.28
0.26
- -
- -

Quarterly Dividends Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.03
0.03
0.03
0.03
0.12
2025
0.03
0.03
0.04
0.04
0.14
2026
0.04
0.04
0.04
- -
- -
Business
Applied Materials, Inc. provides materials engineering solutions, semiconductor manufacturing equipment, software and services used to produce integrated circuits, advanced packaging, flat-panel displays and related electronic products. The company designs, manufactures, sells, installs and supports wafer-fabrication systems for semiconductor manufacturers, foundries, memory producers and other electronics-industry customers. Its Semiconductor Systems portfolio includes deposition equipment for chemical vapor deposition, physical vapor deposition, epitaxy, atomic layer deposition and electrochemical deposition; etch systems; ion implantation systems; rapid thermal processing and annealing systems; chemical mechanical planarization systems; metrology, inspection, process diagnostics and control equipment; wafer-cleaning and surface-preparation tools; and systems supporting advanced logic, DRAM, NAND, high-bandwidth memory, heterogeneous integration, 3D integration and panel-level packaging. Applied Materials also supplies tools and technologies for display manufacturing and coatings applications, including equipment used in the production of flat-panel displays and flexible electronic products. The company operates principally through Semiconductor Systems and Applied Global Services. Semiconductor Systems develops and commercializes equipment used to fabricate semiconductor chips, while Applied Global Services supplies spare parts, equipment upgrades, maintenance and support programs, consulting, performance-improvement services, factory automation software and digital solutions for customers’ fabrication facilities. Its products and services support end markets including artificial intelligence infrastructure, cloud and data-center computing, smartphones, personal computing, automotive electronics, industrial applications and communications devices. Applied Materials maintains manufacturing, research and development, office and service operations globally, with major facilities in the United States, Singapore, Taiwan, Israel, China and India. Recent initiatives include the expansion of Applied Materials’ EPIC Center platform in Silicon Valley, a semiconductor equipment research and commercialization center intended to accelerate materials-engineering, process-integration and equipment innovation for AI-era chips. In 2026, the company announced an innovation partnership with Taiwan Semiconductor Manufacturing Co. to develop and commercialize energy-efficient semiconductor technologies; long-term collaborations with SK hynix and Micron Technology on next-generation DRAM, high-bandwidth memory and NAND technologies; an alliance with Advantest to link front-end manufacturing innovation with chip and package testing; and research relationships with Arizona State University, Rensselaer Polytechnic Institute and Stanford University. Applied Materials also announced collaborations with Synopsys and NVIDIA in AI-accelerated materials modeling and, subsequently, EPIC engagements with Broadcom, SCREEN and the University of California, Berkeley. Applied Materials has expanded its advanced-packaging offering through an agreement to acquire ASMPT Ltd.’s NEXX business, which supplies large-area deposition equipment for panel-level advanced packaging. The company has also introduced semiconductor-production systems including the Sentura Prime epitaxy platform for high-performance DRAM, the Avila system for high-bandwidth-memory performance and layer scaling, the Dakota VMAX plating system, the OptiQuad chemical mechanical planarization system and additional electron-beam inspection systems for advanced-packaging applications. In June 2026, Applied Materials entered a long-term agreement with EssilorLuxottica to develop augmented-reality display technology and artificial-intelligence glasses. Effective in fiscal 2026, it transferred its 200-millimeter equipment business from Applied Global Services to Semiconductor Systems. Applied Materials was founded in 1967 and is headquartered in Santa Clara, California, United States.