- Business
- Applied Materials, Inc. provides materials engineering solutions, semiconductor manufacturing equipment, software and services used to produce integrated circuits, advanced packaging, flat-panel displays and related electronic products. The company designs, manufactures, sells, installs and supports wafer-fabrication systems for semiconductor manufacturers, foundries, memory producers and other electronics-industry customers. Its Semiconductor Systems portfolio includes deposition equipment for chemical vapor deposition, physical vapor deposition, epitaxy, atomic layer deposition and electrochemical deposition; etch systems; ion implantation systems; rapid thermal processing and annealing systems; chemical mechanical planarization systems; metrology, inspection, process diagnostics and control equipment; wafer-cleaning and surface-preparation tools; and systems supporting advanced logic, DRAM, NAND, high-bandwidth memory, heterogeneous integration, 3D integration and panel-level packaging. Applied Materials also supplies tools and technologies for display manufacturing and coatings applications, including equipment used in the production of flat-panel displays and flexible electronic products.
The company operates principally through Semiconductor Systems and Applied Global Services. Semiconductor Systems develops and commercializes equipment used to fabricate semiconductor chips, while Applied Global Services supplies spare parts, equipment upgrades, maintenance and support programs, consulting, performance-improvement services, factory automation software and digital solutions for customers’ fabrication facilities. Its products and services support end markets including artificial intelligence infrastructure, cloud and data-center computing, smartphones, personal computing, automotive electronics, industrial applications and communications devices. Applied Materials maintains manufacturing, research and development, office and service operations globally, with major facilities in the United States, Singapore, Taiwan, Israel, China and India.
Recent initiatives include the expansion of Applied Materials’ EPIC Center platform in Silicon Valley, a semiconductor equipment research and commercialization center intended to accelerate materials-engineering, process-integration and equipment innovation for AI-era chips. In 2026, the company announced an innovation partnership with Taiwan Semiconductor Manufacturing Co. to develop and commercialize energy-efficient semiconductor technologies; long-term collaborations with SK hynix and Micron Technology on next-generation DRAM, high-bandwidth memory and NAND technologies; an alliance with Advantest to link front-end manufacturing innovation with chip and package testing; and research relationships with Arizona State University, Rensselaer Polytechnic Institute and Stanford University. Applied Materials also announced collaborations with Synopsys and NVIDIA in AI-accelerated materials modeling and, subsequently, EPIC engagements with Broadcom, SCREEN and the University of California, Berkeley.
Applied Materials has expanded its advanced-packaging offering through an agreement to acquire ASMPT Ltd.’s NEXX business, which supplies large-area deposition equipment for panel-level advanced packaging. The company has also introduced semiconductor-production systems including the Sentura Prime epitaxy platform for high-performance DRAM, the Avila system for high-bandwidth-memory performance and layer scaling, the Dakota VMAX plating system, the OptiQuad chemical mechanical planarization system and additional electron-beam inspection systems for advanced-packaging applications. In June 2026, Applied Materials entered a long-term agreement with EssilorLuxottica to develop augmented-reality display technology and artificial-intelligence glasses. Effective in fiscal 2026, it transferred its 200-millimeter equipment business from Applied Global Services to Semiconductor Systems.
Applied Materials was founded in 1967 and is headquartered in Santa Clara, California, United States.