BE Semiconductor Industries N.V.
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in mil. unless spec.Company Description
- CEO
- Richard W. Blickman
- Full Time Employees
- 1,856
- Sector
- Technology
- Industry
- Semiconductors
- Address
- Ratio 6 Duiven GE Netherlands 6921 RW
- IPO Date
- Dec 5, 1995
- Website
- besi.com
- Similar Companies
- Business
- BE Semiconductor Industries N.V. (Besi) develops, manufactures, markets, sells and services semiconductor assembly equipment for the global semiconductor and electronics industries. The company offers die attach equipment including single chip, multi-chip, multi-module, flip chip, epoxy and soft solder die bonding systems, hybrid bonding, thermo-compression bonding, embedded bridge die bonding, die lid attach, fan-out wafer level packaging and die sorting systems; packaging equipment such as conventional, ultra-thin and wafer level molding systems, trim and form systems and singulation systems under the Fico brand; and plating equipment including metal plating systems and related process chemicals for solar cells, connectors and other electric devices. Besi serves leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies in end-user markets encompassing electronics, mobile internet, cloud servers, computing, automotive, industrial, LED, solar energy, artificial intelligence, photonics and high-performance computing applications. Founded in 1995 and headquartered in Duiven, Netherlands, the company maintains manufacturing facilities and sales offices across Europe, Asia-Pacific including Malaysia, Singapore and China, and North America. In 2024, Besi reported full-year revenue of €607.5 million, up 4.9% from 2023, driven by higher demand in computing markets for hybrid bonding and photonics applications amid weakness in mobile, automotive and Chinese markets; orders rose 7.0% to €586.7 million with hybrid bonding revenue tripling and customer adoption expanding from nine to fifteen, including new bookings from Japanese and Korean producers for advanced logic semiconductors. The company increased R&D spending by 31.7% in 2024 to advance 2.5D and 3D architectures, plans expansion of advanced packaging production capacity in 2025 and announced a €350 million bond offering in 2024 alongside recent share transactions and early bond redemption in November 2025.
Company News
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BE Semiconductor Industries N.V. (BESIY) Q2 2026 Earnings Call Transcript
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BE Semiconductor Industries N.V. (BESIY) Q1 2026 Earnings Call Transcript
BE Semiconductor Industries N.V. Announces Q1-26 Results
BE Semiconductor Industries N.V. Announces Q1-26 Results
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BE Semiconductor Industries N.V. (BESIY) Q4 2025 Earnings Call Transcript
BE Semiconductor Industries N.V. Announces Q4-25 and Full Year 2025 Results
BE Semiconductor Industries (BESIY) to Release Earnings on Thursday