1. Technology

  2. •

    Semiconductors
Electro Scientific Industries, Inc.

Electro Scientific Industries, Inc.

ESIO
Electro Scientific Industries, Inc.US flagNASDAQ
29.99
USD
- -
- -
Electro Scientific Industries, Inc.
ESIO
(NASDAQ)

Recent

price

29.99

P/E

ratio

- -

div

yld

- -

ROIC.AI

2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017
2018
TTM
FRC
4.93
7.41
8.21
7.18
8.61
- -
5.81
5.42
9.16
8.84
7.38
6.04
5.19
5.87
4.95
10.83
10.94
Revenue per Share
-1.81
0.42
0.7
0.72
0.81
- -
-1.89
-0.44
0.28
0.17
-1.86
-1.28
-1.17
-0.39
-1.15
3.42
3.75
Basic EPS, GAAP
0.1
0.53
0.77
0.35
0.53
- -
0.46
-0.01
1.57
0.33
0.37
-0.89
-1.07
0.03
-0.15
1.84
2.19
Free Cash Flow per Basic Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
0.08
2.32
0.32
0.24
- -
- -
- -
- -
Dividend per Share
11.16
11.74
12.58
7.7
8.43
- -
12.74
12.45
12.86
13.15
2.97
1.31
-0.13
-0.76
-1.89
1.61
3.16
Book Value per Share
11.18
11.62
12.56
13.41
13.96
- -
12.39
12.18
12.42
12.74
8.42
6.94
5.24
4.95
4.15
7.61
9.2
Tangible Book Value per Share
28
28
28
29
29
- -
27
27
28
29
29
30
31
31
33
34
35
Basic Weighted Avg Shares
137
207
233
207
251
- -
157
149
257
254
217
181
159
184
161
368
378
Sales/Revenue/Turnover
-59.81
1.26
12.83
5.65
9.66
- -
-19.72
-17.66
3.74
2.56
-13.38
-16.32
-18.72
-5.12
-14.25
21.69
25.09
Operating Margin (%)
10
10
8
8
8
- -
13
12
12
14
15
11
9
9
9
9
9
Depreciation Expense
-50
12
20
21
24
- -
-51
-12
8
5
-55
-38
-36
-12
-37
116
129
Net Income, GAAP
- -
- -
24.5
- -
32.06
- -
- -
- -
4.69
- -
- -
- -
- -
- -
- -
- -
20.41
Effective Tax Rate (%)
-36.59
5.74
8.5
10.06
9.38
- -
-32.45
-8.05
3.09
1.93
-25.26
-21.16
-22.58
-6.65
-23.23
31.59
34.25
Profit Margin (%)
340
370
276
304
322
275
247
254
260
270
194
165
127
127
116
203
260
Working Capital
142
143
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
13
13
12
LT Debt
310
327
357
388
408
392
344
343
362
379
264
223
187
170
145
266
324
Total Equity
- -
- -
5.47
- -
4.13
- -
- -
- -
2.6
- -
- -
- -
- -
- -
- -
- -
- -
Return on Invested Capital (%)
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Return on Capital (%)
-15.01
3.73
5.78
7.19
10.06
- -
-16.82
-3.49
2.26
1.33
-23.51
-60.58
- -
- -
- -
- -
- -
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Jun'19
Sep'19
Dec'19
ST Debt
- -
- -
- -
LT Borrowings
13
13
12
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
35
35
35
Market Capitalization
540
600
1,035

Working Capital

FRC

•

in mil. unless spec.
Jun'19
Sep'19
Dec'19
Total Current Assets
312
304
321
Cash, Cash Equivalents & STI
130
178
175
Accounts Receivable, Net
81
38
56
Inventories
94
81
82
Total Current Liabilities
74
54
62
Payables & Accruals
65
45
36
ST Debt
- -
- -
- -
Deferred Revenue
9
9
10

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
-0.42%
5.7%
84.29%
Free Cash Flow
- -
-478.48%
-1,384.48%
Net Income, GAAP
- -
-61.52%
-410.68%
Sales/Revenue/Turnover
- -
20.63%
128.47%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2017
48
30
34
50
161
2018
73
71
111
113
368
2019
111
86
68
- -
- -

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2017
- -
-0.3
-0.29
-0.54
-1.15
2018
0.09
0.13
0.99
2.19
3.42
2019
0.9
0.49
0.18
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2017
- -
- -
- -
- -
- -
2018
- -
- -
- -
- -
- -
2019
- -
- -
- -
- -
- -
Similar Companies
Tower Semiconductor Ltd. (TSEM.TA)
Shanghai Fudan Microelectronics Group Company Limited (1385.HK)
Atomera Incorporated (ATOM)
iCatch Technology, Inc. (6695.TW)
Microsemi Corp. (MSCC)
Qnity Electronics, Inc. (Q)
Business
Electro Scientific Industries, Inc. (ESI), a subsidiary of MKS Instruments, Inc., develops and supplies laser-based manufacturing solutions for the microtechnology and electronics industries worldwide. Founded in 1944 and headquartered in Portland, Oregon, the company offers precision laser systems for flexible PCB processing, high-density interconnect (HDI) PCB laser processing, high-speed multilayer ceramic capacitor (MLCC) testing; semiconductor wafer dicing and grooving systems; laser via drilling for printed circuit boards and IC packaging; component test, trim, and inspection equipment for passive components including inductors, varistors, and arrays; industrial micromachining platforms for drilling, scribing, cutting, etching, routing, and marking; fiber, rod, solid-state, and ablation lasers; and machine vision systems for microelectronics manufacturing. ESI serves semiconductor manufacturers, PCB fabricators, passive component producers, and electronics assemblers across North America, Europe, and Asia-Pacific regions with operations emphasizing photonic systems that enable nano-scale features on wafers, flex circuits, and high-value components. In 2019, MKS Instruments completed its $1 billion acquisition of ESI, integrating its laser processing expertise into MKS' broader photonics and equipment solutions division to enhance offerings for advanced packaging, 5G components, and industrial markets; recent advancements include the Geode AcceleDrill technology, dual UV/CO2 laser systems, SPOT ON blind via processing, and intra-pulse beam steering for high-density interconnects.