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    Semiconductors
Electro Scientific Industries, Inc.

Electro Scientific Industries, Inc.

ESIO
Electro Scientific Industries, Inc.US flagNASDAQ
29.99
USD
- -
- -
2006 Y
2007 Y
2008 Y
2009 Y
2010 Y
2011 Y
2012 Y
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
TTM
Revenue per Share
7.18
8.61
- -
5.81
5.42
9.16
8.84
7.38
6.04
5.19
5.87
4.95
10.83
10.94
Basic EPS, GAAP
0.72
0.81
- -
-1.89
-0.44
0.28
0.17
-1.86
-1.28
-1.17
-0.39
-1.15
3.42
3.75
Free Cash Flow per Basic Share
0.35
0.53
- -
0.46
-0.01
1.57
0.33
0.37
-0.89
-1.07
0.03
-0.15
1.84
2.19
Dividend per Share
- -
- -
- -
- -
- -
- -
0.08
2.32
0.32
0.24
- -
- -
- -
- -
Book Value per Share
7.7
8.43
- -
12.74
12.45
12.86
13.15
2.97
1.31
-0.13
-0.76
-1.89
1.61
3.16
Tangible Book Value per Share
13.41
13.96
- -
12.39
12.18
12.42
12.74
8.42
6.94
5.24
4.95
4.15
7.61
9.2
Basic Weighted Avg Shares
29
29
- -
27
27
28
29
29
30
31
31
33
34
35
Sales/Revenue/Turnover
207
251
- -
157
149
257
254
217
181
159
184
161
368
378
Operating Margin (%)
5.65
9.66
- -
-19.72
-17.66
3.74
2.56
-13.38
-16.32
-18.72
-5.12
-14.25
21.69
25.09
Depreciation Expense
8
8
- -
13
12
12
14
15
11
9
9
9
9
9
Net Income, GAAP
21
24
- -
-51
-12
8
5
-55
-38
-36
-12
-37
116
129
Effective Tax Rate (%)
- -
32.06
- -
- -
- -
4.69
- -
- -
- -
- -
- -
- -
- -
20.41
Profit Margin (%)
10.06
9.38
- -
-32.45
-8.05
3.09
1.93
-25.26
-21.16
-22.58
-6.65
-23.23
31.59
34.25
Working Capital
304
322
275
247
254
260
270
194
165
127
127
116
203
260
LT Debt
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
13
13
12
Total Equity
388
408
392
344
343
362
379
264
223
187
170
145
266
324
Return on Invested Capital (%)
- -
4.13
- -
- -
- -
2.6
- -
- -
- -
- -
- -
- -
- -
- -
Return on Capital (%)
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Return on Common Equity (%)
7.19
10.06
- -
-16.82
-3.49
2.26
1.33
-23.51
-60.58
- -
- -
- -
- -
- -

Capital Structure

FRC

•

in mil. unless spec.
Jun'19
Sep'19
Dec'19
ST Debt
- -
- -
- -
LT Borrowings
13
13
12
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
35
35
35
Market Capitalization
540
600
1,035

Working Capital

FRC

•

in mil. unless spec.
Jun'19
Sep'19
Dec'19
Total Current Assets
312
304
321
Cash, Cash Equivalents & STI
130
178
175
Accounts Receivable, Net
81
38
56
Inventories
94
81
82
Total Current Liabilities
74
54
62
Payables & Accruals
65
45
36
ST Debt
- -
- -
- -
Deferred Revenue
9
9
10

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
-0.42%
5.7%
84.29%
Free Cash Flow
- -
-478.48%
-1,384.48%
Net Income, GAAP
- -
-61.52%
-410.68%
Sales/Revenue/Turnover
- -
20.63%
128.47%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2017
48
30
34
50
161
2018
73
71
111
113
368
2019
111
86
68
- -
- -

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2017
- -
-0.3
-0.29
-0.54
-1.15
2018
0.09
0.13
0.99
2.19
3.42
2019
0.9
0.49
0.18
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2017
- -
- -
- -
- -
- -
2018
- -
- -
- -
- -
- -
2019
- -
- -
- -
- -
- -

Company Description

APIChatGPT
Sector
Technology
Industry
Semiconductors
Address
IPO Date
Oct 18, 1983
CIK
0000726514
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Business
Electro Scientific Industries, Inc. (ESI), a subsidiary of MKS Instruments, Inc., develops and supplies laser-based manufacturing solutions for the microtechnology and electronics industries worldwide. Founded in 1944 and headquartered in Portland, Oregon, the company offers precision laser systems for flexible PCB processing, high-density interconnect (HDI) PCB laser processing, high-speed multilayer ceramic capacitor (MLCC) testing; semiconductor wafer dicing and grooving systems; laser via drilling for printed circuit boards and IC packaging; component test, trim, and inspection equipment for passive components including inductors, varistors, and arrays; industrial micromachining platforms for drilling, scribing, cutting, etching, routing, and marking; fiber, rod, solid-state, and ablation lasers; and machine vision systems for microelectronics manufacturing. ESI serves semiconductor manufacturers, PCB fabricators, passive component producers, and electronics assemblers across North America, Europe, and Asia-Pacific regions with operations emphasizing photonic systems that enable nano-scale features on wafers, flex circuits, and high-value components. In 2019, MKS Instruments completed its $1 billion acquisition of ESI, integrating its laser processing expertise into MKS' broader photonics and equipment solutions division to enhance offerings for advanced packaging, 5G components, and industrial markets; recent advancements include the Geode AcceleDrill technology, dual UV/CO2 laser systems, SPOT ON blind via processing, and intra-pulse beam steering for high-density interconnects.