FIT Hon Teng Limited
FITGF
Other OTC0.70
USD
-0.01
- -
ISIN
KYG3R83K1037
CUSIP
G3R83K103
Return %
Stock
S&P500
1Y
100.10
17.85
3Y
286.10
64.56
5Y
170.41
69.89
Capital Structure
FRC
•
in mil. unless spec.Working Capital
FRC
•
in mil. unless spec.Growth Rates
FRC
•
in mil. unless spec.Quarterly Revenue
FRC
•
in mil. unless spec.Quarterly Earnings Per Share
FRC
•
in mil. unless spec.Quarterly Dividends Per Share
FRC
•
in mil. unless spec.- CEO
- Sung-Ching Lu
- Full Time Employees
- 67,563
- Sector
- Technology
- Industry
- Hardware, Equipment & Parts
- Address
- 66-1, Chungshan Road New Taipei City TP Taiwan, Province of China 23680
- IPO Date
- Nov 30, 2020
- Website
- fit-foxconn.com
- Similar Companies
- Business
- FIT Hon Teng Limited engages in the development, manufacturing, and marketing of electronic and optoelectronic connectors, antennas, acoustic components, cables, and modules for use in computers, communication equipment, consumer electronics, automobiles, industrial applications, and green energy products. It operates through two main segments: Intermediate Products, which produces mobile and wireless devices, connectors for communication, computer, and automotive markets; and Consumer Products, which focuses on trading and distribution of mobile device related products. The company also develops high-speed data connectivity solutions, power delivery systems, and thermal management technologies catering to AI data centers. Founded in 2013 and headquartered in New Taipei, Taiwan, FIT Hon Teng expanded its automotive electrification capabilities by acquiring Germany’s Auto-Kabel Group in 2024, enhancing its high-voltage electric vehicle systems and wiring harness technology. In 2024, it acquired a 70% stake in Ccloud China Cloud Electro Optics Technology to strengthen its position in high-speed optical modules and co-packaged optics technologies driven by AI data center demand. FIT Hon Teng is a subsidiary of Hon Hai Precision Industry Co., Ltd. (Foxconn) and leverages vertical integration within the Foxconn group. The company reported robust revenue growth in 2025 supported by AI server momentum, automotive synergies, and a record gross profit margin, with recent innovations including 224G CPC interconnects, advanced liquid cooling solutions, and high-power busbars for servers and electric vehicles. Its technology is showcased at major industry events, underscoring its focus on high-speed connectivity, power, and thermal management solutions for emerging digital infrastructure and electric mobility sectors. FIT Hon Teng remains a significant player in electronics interconnect technologies across global markets including Taiwan, Hong Kong, Europe, and North America.
FIT Hon Teng (OTCMKTS:FITGF) Trading Down 11.2% – Time to Sell?